Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Microchip Technology SST39WF400B-70-4I-B3KE-T

Name: SST39WF400B-70-4I-B3KE-T
Brand: Microchip Technology
SKU: SST39WF400B-70-4I-B3KE-T
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: SST39WF400B-70-4I-B3KE-T

Manufacturer:: Microchip Technology

Category:: Memory

Package:: 48-TFBGA

Datasheet:: SST39WF400B-70-4I-B3KE-T.pdf

Description:: IC FLASH 4MBIT PARALLEL 48TFBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,872

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

SST39WF400B-70-4I-B3KE-T from Microchip Technology is a 4 Mbit (256K × 16) Multi-Purpose Flash memory IC using SuperFlash technology, operating from 1.65–1.95 V, with 70 ns read access time, 100,000 program/erase cycles endurance, and >100-year data retention. It serves as nonvolatile program/data storage in embedded controllers requiring low-voltage, sector/block-erasable flash.

For engineers reviewing the SST39WF400B-70-4I-B3KE-T datasheet, SST39WF400B-70-4I-B3KE-T pinout, SST39WF400B-70-4I-B3KE-T application, or SST39WF400B-70-4I-B3KE-T equivalent, key selection criteria include JEDEC-compliant x16 asynchronous interface, uniform 2 KWord sector / 32 KWord block erase architecture, software data protection (SDP), CFI support, and 48-ball WFBGA/XFLGA/TFBGA packaging options.

Technical Context

The SST39WF400B-70-4I-B3KE-T implements a split-gate SuperFlash cell with thick-oxide tunneling injector for enhanced reliability and fixed erase/program timing independent of cycle count. It supports standard microprocessor bus interfacing via CE#, OE#, and WE# control signals with latched address/data paths.

Operation modes include Read, Word-Program, Sector-Erase, Block-Erase, Chip-Erase, Software ID Entry, and CFI Query-all initiated via JEDEC-standard command sequences written to specific address locations (e.g., 5555H/2AAAH). End-of-write detection uses DQ7 Data# Polling and DQ6 Toggle Bit status reporting.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 16 (4 Mbit total); enables 16-bit parallel data transfers aligned with common microcontroller external memory buses.
Read Access Time	70 ns; ensures compatibility with high-speed 14 MHz+ system clocks without wait states in typical embedded host interfaces.
Supply Voltage	1.65–1.95 V; supports single-supply operation in modern low-power SoC and battery-backed systems without level-shifting.
Endurance	100,000 cycles (typical); guarantees reliable field-updatable firmware or configuration storage over extended product lifetimes.
Data Retention	>100 years; eliminates need for periodic refresh or backup power in industrial and automotive applications.
Erase Architecture	Uniform 2 KWord sectors & 32 KWord blocks; allows granular firmware patching and secure data wiping without full-chip erasure.
Write Detection	DQ7 Data# Polling & DQ6 Toggle Bit; enables efficient polling-based write completion handling without dedicated interrupt lines.

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, suitable for space-constrained PCB layouts in portable and industrial modules.

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Address Inputs	A0–A16 select 256K words; A17 (AMS) used for sector/block address decoding during erase operations.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; tri-stated when CE# or OE# is high; latched internally during Program/Erase.
CE#	Chip Enable	Active-low chip select; device enters standby mode (5 µA) when high; required low for all non-read operations.
OE#	Output Enable	Active-low output gate; controls data bus drive during Read; must be low with CE# for valid output.
WE#	Write Enable	Active-low control for Program/Erase command latching; rising edge initiates internal timing sequences.
VDD	Power Supply	1.65–1.95 V supply; powers core logic and SuperFlash array; internal charge pump generates programming voltage.
VSS	Ground	Reference ground for all I/O and core circuitry; two dedicated balls ensure low-impedance return path.
NC	No Connection	Unbonded pins (e.g., A11, A13, DQ10 in WFBGA layout); must remain unconnected per design.

Key Features

Feature	Design Value
SuperFlash Technology	Split-gate cell with thick-oxide tunneling injector delivers fixed 28 µs Word-Program and 36 ms Sector/Block-Erase times across full lifetime.
JEDEC x16 Pinout Compliance	Direct drop-in replacement for industry-standard 4 Mbit x16 flash devices without PCB redesign or signal mapping changes.
Software Data Protection (SDP)	Three-byte (Program) and six-byte (Erase) command sequences prevent accidental writes during power transitions or firmware bugs.
Common Flash Interface (CFI)	Supports both SST-specific and general CFI Query modes for automatic device identification and parameter discovery in bootloader code.
Low-Power Operation	5 mA active current (5 MHz) and 5 µA standby current enable energy-efficient operation in always-on or battery-powered systems.

Applications

Industrial PLC Firmware Storage	Medical Device Configuration Memory
Use Scenario: Storing firmware updates and calibration tables in programmable logic controllers deployed in factory automation environments with wide temperature ranges. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into microcontroller external bus; accessed via synchronous CE#/OE#/WE# strobes with 70 ns timing compliance. Use Value: 100,000-cycle endurance and >100-year retention ensure long-term reliability without field maintenance; sector-erase capability enables safe over-the-air firmware patches.	Use Scenario: Holding patient-specific settings, sensor calibration coefficients, and regulatory-compliant boot code in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure configuration storage with hardware/software write protection; accessed during power-up initialization and runtime parameter loading. Use Value: SDP and CFI support simplify bootloader development and validation; 1.65–1.95 V operation aligns with low-power medical SoCs and extends battery life.
Automotive Infotainment Boot Memory	Networking Equipment Code Storage
Use Scenario: Hosting boot ROM and feature-enabling license keys in head-unit ECUs requiring AEC-Q100-compliant components. IC Role / Device Role / Timing Role: Primary boot memory mapped at reset vector; read during cold start with strict tRC ≤ 70 ns timing budget. Use Value: Industrial-grade (-40°C to +85°C) temperature rating and robust SuperFlash cell structure meet automotive reliability requirements without derating.	Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in enterprise switches and routers with frequent field upgrades. IC Role / Device Role / Timing Role: External code memory interfaced to ARM Cortex-A/MIPS processors via 16-bit parallel bus; erased in blocks for fast firmware deployment. Use Value: Uniform 32 KWord block erase reduces upgrade time vs. full-chip erase; CFI support enables generic flash programming tools across vendor families.

Industrial PLC Firmware Storage

Medical Device Configuration Memory

Use Scenario: Storing firmware updates and calibration tables in programmable logic controllers deployed in factory automation environments with wide temperature ranges.

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into microcontroller external bus; accessed via synchronous CE#/OE#/WE# strobes with 70 ns timing compliance.

Use Value: 100,000-cycle endurance and >100-year retention ensure long-term reliability without field maintenance; sector-erase capability enables safe over-the-air firmware patches.

Use Scenario: Holding patient-specific settings, sensor calibration coefficients, and regulatory-compliant boot code in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Secure configuration storage with hardware/software write protection; accessed during power-up initialization and runtime parameter loading.

Use Value: SDP and CFI support simplify bootloader development and validation; 1.65–1.95 V operation aligns with low-power medical SoCs and extends battery life.

Automotive Infotainment Boot Memory

Networking Equipment Code Storage

Use Scenario: Hosting boot ROM and feature-enabling license keys in head-unit ECUs requiring AEC-Q100-compliant components.

IC Role / Device Role / Timing Role: Primary boot memory mapped at reset vector; read during cold start with strict tRC ≤ 70 ns timing budget.

Use Value: Industrial-grade (-40°C to +85°C) temperature rating and robust SuperFlash cell structure meet automotive reliability requirements without derating.

Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in enterprise switches and routers with frequent field upgrades.

IC Role / Device Role / Timing Role: External code memory interfaced to ARM Cortex-A/MIPS processors via 16-bit parallel bus; erased in blocks for fast firmware deployment.

Use Value: Uniform 32 KWord block erase reduces upgrade time vs. full-chip erase; CFI support enables generic flash programming tools across vendor families.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SST39VF400A-70-4C-B3KE-T	Lower voltage range (2.7–3.6 V); 70 ns access; same density and pinout but incompatible supply domain.	Requires 3.3 V system rail; not suitable for 1.8 V platforms where SST39WF400B-70-4I-B3KE-T is specified.	Select only if host system operates at 3.3 V and industrial temperature range is not required.
MX29LV400CTTI-70G	3.3 V operation; 70 ns access; 48-pin TSOP package; lacks CFI support and SuperFlash timing consistency.	TSOP footprint requires PCB redesign; no built-in CFI simplifies driver development but limits auto-detection capability.	Choose for cost-sensitive, non-upgradable designs where package compatibility with legacy TSOP layouts is critical.

Compared with SST39VF400A-70-4C-B3KE-T and MX29LV400CTTI-70G, the SST39WF400B-70-4I-B3KE-T uniquely supports 1.65–1.95 V operation with guaranteed industrial temperature range (-40°C to +85°C), fixed-program timing, and dual-mode CFI-making it optimal for next-generation low-power, upgradable embedded systems.

Availability

SST39WF400B-70-4I-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and automotive infotainment boot memory requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SST39WF400B-70-4I-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company specializing in microcontrollers, analog, FPGA, and memory solutions, with leadership in flash technology through its acquisition of Silicon Storage Technology (SST).

The SST39WF400B-70-4I-B3KE-T belongs to the SuperFlash Multi-Purpose Flash (MPF) product line, designed specifically for low-voltage, high-reliability embedded applications demanding flexible erase granularity, fast programming, and long-term data integrity.

FAQ

What is the operating voltage range for the SST39WF400B-70-4I-B3KE-T?

The SST39WF400B-70-4I-B3KE-T operates from 1.65 V to 1.95 V for both read and write functions. This single-supply range enables direct integration with 1.8 V system rails without level shifters. The device is rated for industrial temperature operation (-40°C to +85°C), and its internal charge pump generates necessary programming voltages-no external VPP supply is required. All DC and AC specifications in the datasheet are defined within this voltage window.

Does the SST39WF400B-70-4I-B3KE-T support JEDEC-standard command sets?

Yes, the SST39WF400B-70-4I-B3KE-T fully complies with JEDEC standard pinouts and command sets for x16 flash memories. It supports standard operations-including Word-Program, Sector-Erase, Block-Erase, and Chip-Erase-via documented six-byte command sequences (e.g., 5555H/2AAAH/5555H followed by command byte). Software Data Protection (SDP) and Common Flash Interface (CFI) modes also adhere to JEDEC JESD68 and JEP137B specifications.

What package type is used for the SST39WF400B-70-4I-B3KE-T?

The SST39WF400B-70-4I-B3KE-T is packaged in a 48-ball WFBGA (4 mm × 6 mm) with 0.5 mm pitch, designated by the "B3KE-T" suffix. This micro-package variant offers superior thermal and electrical performance over TSOP alternatives and is compatible with standard surface-mount assembly processes. Pin assignments match JEDEC-standard x16 flash layouts, enabling drop-in use in space-constrained industrial and portable designs.

How does the SST39WF400B-70-4I-B3KE-T indicate completion of a Program or Erase operation?

The SST39WF400B-70-4I-B3KE-T provides two hardware-supported status detection methods: Data# Polling on DQ7 and Toggle Bit on DQ6. After initiating a Word-Program (4th WE# pulse) or Erase (6th WE# pulse), the host reads DQ7 to detect true data (vs. complement) or monitors DQ6 for cessation of toggling. Both methods are valid during internal operations and require no additional hardware-enabling efficient polling-based firmware control without interrupts.

Is the SST39WF400B-70-4I-B3KE-T suitable for automotive applications?

The SST39WF400B-70-4I-B3KE-T is qualified for industrial temperature range (-40°C to +85°C) and meets RoHS compliance, but it is not AEC-Q100 qualified. While widely used in automotive infotainment and body control modules where qualification is customer-defined, formal automotive deployment requires validation per AEC-Q100 stress tests. For production automotive ECUs, consult Microchip's AEC-Q100-qualified variants such as the SST39WF400B-70-4I-B3KE-T's automotive-grade counterparts.

SST39WF400B-70-4I-B3KE-T Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: SST39 MPF™

Package/Case:: 48-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH

Memory Size:: 4Mbit

Memory Organization:: 256K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 40µs

Access Time:: 70 ns

Voltage - Supply:: 1.65V ~ 1.95V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TFBGA

SST39WF400B-70-4I-B3KE-T FAQ

1.How can I place an order for SST39WF400B-70-4I-B3KE-T through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39WF400B-70-4I-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39WF400B-70-4I-B3KE-T reliable?

The price and inventory of SST39WF400B-70-4I-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF400B-70-4I-B3KE-T is usually 5 days.

3.What payment methods are accepted for SST39WF400B-70-4I-B3KE-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF400B-70-4I-B3KE-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39WF400B-70-4I-B3KE-T?

SST39WF400B-70-4I-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39WF400B-70-4I-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39WF400B-70-4I-B3KE-T?

For technical support, including SST39WF400B-70-4I-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF400B-70-4I-B3KE-T requirements.

6.How does Aetrix verify that SST39WF400B-70-4I-B3KE-T is sourced from the original manufacturer or authorized distributors?

All SST39WF400B-70-4I-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF400B-70-4I-B3KE-T meets industry standards.

7.What is the process for return or replacement of SST39WF400B-70-4I-B3KE-T?

All SST39WF400B-70-4I-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF400B-70-4I-B3KE-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39WF400B-70-4I-B3KE-T part is unused and in its original packaging.

Return procedure for SST39WF400B-70-4I-B3KE-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…