My Inquiry
My Account
Microchip Technology SST39WF400B-70-4I-VA
- Part No.:
- SST39WF400B-70-4I-VA
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- Die
- Datasheet:
-
SST39WF400B-70-4I-VA.pdf
- Description:
- IC FLASH 4MBIT PARALLEL WAFER
- Quantity:
- Payment:
- Shipping:
Inventory:4,424
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39WF400B-70-4I-VA from Microchip Technology is a 4 Mbit (256K × 16) Multi-Purpose Flash memory IC using SuperFlash technology, operating at 1.65–1.95 V, with 70 ns read access time, 100,000 program/erase cycles endurance, and >100-year data retention. It serves as nonvolatile program/data storage in embedded controllers and firmware update modules.
For engineers reviewing the SST39WF400B-70-4I-VA datasheet, SST39WF400B-70-4I-VA pinout, SST39WF400B-70-4I-VA application, or SST39WF400B-70-4I-VA equivalent, this page delivers verified electrical specs, JEDEC-compliant x16 interface timing, sector/block-erase command sequences, and package-specific pin validation for 48-ball WFBGA/XFLGA/TFBGA footprints.
Technical Context
The SST39WF400B-70-4I-VA implements an asynchronous x16 parallel interface with CE#, OE#, and WE# control lines, supporting Word-Program, Sector-Erase (2 KWord), Block-Erase (32 KWord), and Chip-Erase operations via JEDEC-standard six-byte command sequences. Its split-gate SuperFlash cell enables fixed 28 µs word-program and 36 ms sector/block-erase times independent of cycle count.
It integrates hardware protections including noise/glitch immunity (<5 ns pulse rejection), VDD power-up/down detection (<1.0 V inhibit), and write-inhibit mode (OE# low, CE# high, or WE# high). Software Data Protection (SDP) is permanently enabled, requiring three-byte unlock sequences for programming and six-byte sequences for erasing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16 (4 Mbit total); supports byte-wide addressing via A0–A17 with AMS = A17 |
| Read Access Time | 70 ns; meets fast boot and real-time firmware fetch requirements in microcontroller systems |
| Supply Voltage | 1.65–1.95 V; compatible with low-voltage SoC I/O domains and eliminates need for level shifters |
| Endurance | 100,000 cycles (typical); sufficient for field firmware updates and configuration logging |
| Data Retention | >100 years at 85°C; validated per JEDEC A103 for long-life industrial deployments |
| Erase Granularity | Sector (2 KWord), Block (32 KWord), Chip; enables selective firmware patching without full reflash |
| Write Detection | Toggle Bit (DQ6) and Data# Polling (DQ7); allows host CPU to poll status without dedicated interrupt |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), 48-ball XFLGA (4 mm × 6 mm), or 48-ball TFBGA (6 mm × 8 mm); RoHS compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 select word address; A17 = AMS (most significant address) used for sector/block selection during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; latched internally during Program; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low device select; must be low for Read, Program, Erase; high = standby (5 µA) |
| OE# | Output Enable | Active-low output gate; controls DQ bus drive; high = high-impedance output |
| WE# | Write Enable | Active-low control for Program/Erase initiation; falling edge latches address, rising edge latches data/command |
| VDD | Power Supply | 1.65–1.95 V core supply; internal VPP generation eliminates external high-voltage pump |
| VSS | Ground | Two dedicated ground balls (pins E1, L6 in WFBGA/XFLGA) reduce noise coupling during erase pulses |
| NC | No Connection | Unbonded pads (e.g., pins C1, D1, E2 in WFBGA); must be left floating or tied to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide tunneling injector enables fixed 28 µs program and 36 ms erase times across full lifecycle |
| JEDEC x16 Pinout Compliance | Direct drop-in replacement for industry-standard parallel NOR flash; no PCB redesign required for migration |
| Uniform Erase Architecture | 128 sectors (2 KWord each) and 8 blocks (32 KWord each); simplifies firmware partitioning and wear leveling |
| CMOS I/O Compatibility | VIL = 0.2VDD, VIH = 0.8VDD; ensures robust interfacing with 1.8 V logic families without external biasing |
| Embedded CFI Support | Both SST-specific and general CFI Query modes (via 5555H/98H or 55H/98H); enables auto-detection in bootloader code |
Applications
| Firmware Storage in Industrial PLCs | Boot Code Storage in Network Routers |
|---|---|
Use Scenario: Storing field-upgradable firmware images and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile parallel NOR flash providing direct XIP (eXecute-In-Place) capability for microcontroller boot ROM and runtime parameter tables. Use Value: 70 ns read access enables sub-100 µs instruction fetch latency; 100,000-cycle endurance supports quarterly firmware patches over 15+ years. |
Use Scenario: Holding primary bootloader, secure boot keys, and fail-safe recovery images in enterprise-grade Ethernet switches and wireless access points. IC Role / Device Role / Timing Role: Primary boot memory mapped to CPU address space; accessed during cold start and safe-mode recovery sequences. Use Value: Sector-erase granularity allows atomic update of bootloader without corrupting recovery image; CFI support enables automatic vendor/part detection in multi-sourced BOMs. |
| Configuration Memory in Medical Imaging Systems | Calibration Data Storage in Test Equipment |
Use Scenario: Retaining sensor calibration coefficients, user preferences, and regulatory compliance logs in MRI and ultrasound diagnostic platforms. IC Role / Device Role / Timing Role: Persistent configuration store accessed during system initialization and runtime calibration routines. Use Value: >100-year data retention meets FDA 21 CFR Part 11 long-term recordkeeping mandates; 1.65–1.95 V operation aligns with low-power imaging subsystems. |
Use Scenario: Storing instrument-specific calibration constants, linearity correction tables, and self-test results in benchtop oscilloscopes and spectrum analyzers. IC Role / Device Role / Timing Role: Field-serviceable nonvolatile memory updated during metrology lab recalibration events. Use Value: Block-erase capability enables full calibration dataset refresh in ≤36 ms; Toggle Bit polling reduces host CPU overhead during automated recalibration sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W29N04GVSIAA | 4 Gbit NAND flash with internal ECC and serial interface (SPI); lacks x16 parallel bus and CFI support | Requires controller-side wear leveling and bad-block management; unsuitable for XIP or legacy NOR-based bootloaders | Select only if migrating to NAND architecture with dedicated flash controller and software stack changes |
| Macronix MX29LV400CTTI-70G | 4 Mbit x16 parallel NOR flash, 70 ns access, but requires 3.0 V supply and lacks SuperFlash low-voltage programming | Not compatible with 1.8 V I/O domains; higher energy per erase/program cycle increases thermal load in dense layouts | Use only in legacy 3.3 V systems where voltage translation is acceptable and power efficiency is secondary |
Compared with Winbond W29N04GVSIAA and Macronix MX29LV400CTTI-70G, the SST39WF400B-70-4I-VA uniquely combines 1.65–1.95 V operation, fixed-timing SuperFlash, and JEDEC x16 compatibility-enabling drop-in upgrades in space-constrained, low-power embedded designs without firmware or PCB changes.
Availability
SST39WF400B-70-4I-VA is available at Aetrix Electronics and suitable for industrial PLCs, network infrastructure equipment, medical imaging systems, and test instrumentation requiring stable component supply and long-term obsolescence management.
Supply support for SST39WF400B-70-4I-VA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and maintains the SuperFlash product line for high-reliability embedded memory solutions.
The SST39WF400B series was designed specifically for low-voltage, high-endurance firmware and configuration storage in industrial, medical, and communications equipment where data integrity and long service life are critical.
FAQ
What is the guaranteed minimum endurance rating for the SST39WF400B-70-4I-VA?
The SST39WF400B-70-4I-VA is qualified to a minimum of 10,000 program/erase cycles per JEDEC Standard A117, with typical performance rated at 100,000 cycles. This endurance applies uniformly across all sectors and blocks, and is validated under industrial temperature conditions (-40°C to +85°C).
Does the SST39WF400B-70-4I-VA support execute-in-place (XIP) operation?
Yes, the SST39WF400B-70-4I-VA supports XIP due to its fast 70 ns read access time and asynchronous x16 interface. When mapped into a microcontroller's external memory space, instructions can be fetched directly from the SST39WF400B-70-4I-VA without copying to RAM, reducing boot time and SRAM usage.
How is software data protection implemented on the SST39WF400B-70-4I-VA?
Software Data Protection (SDP) is permanently enabled on the SST39WF400B-70-4I-VA. Programming requires a three-byte unlock sequence (5555H/AAH, 2AAAH/55H, 5555H/A0H), and erasing requires a six-byte sequence. Invalid commands abort the device back to Read mode within TRC (read cycle time), preventing accidental writes during power transitions.
Which packages are supported by the SST39WF400B-70-4I-VA?
The SST39WF400B-70-4I-VA is offered in three RoHS-compliant packages: 48-ball WFBGA (4 mm × 6 mm), 48-ball XFLGA (4 mm × 6 mm), and 48-ball TFBGA (6 mm × 8 mm). All share identical pinouts per JEDEC standard, enabling footprint interchangeability with appropriate pad layout adjustments.
Can the SST39WF400B-70-4I-VA operate with a 1.8 V supply only, or does it require additional voltages?
The SST39WF400B-70-4I-VA operates exclusively from a single 1.65–1.95 V supply (VDD). It integrates internal VPP generation for programming and erasing, eliminating the need for external high-voltage sources or charge pumps-simplifying power design and reducing bill-of-materials cost.
SST39WF400B-70-4I-VA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- Die
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- Wafer
SST39WF400B-70-4I-VA FAQ
1.How can I place an order for SST39WF400B-70-4I-VA through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF400B-70-4I-VA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF400B-70-4I-VA reliable?
The price and inventory of SST39WF400B-70-4I-VA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF400B-70-4I-VA is usually 5 days.
3.What payment methods are accepted for SST39WF400B-70-4I-VA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF400B-70-4I-VA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF400B-70-4I-VA?
SST39WF400B-70-4I-VA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF400B-70-4I-VA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF400B-70-4I-VA?
For technical support, including SST39WF400B-70-4I-VA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF400B-70-4I-VA requirements.
6.How does Aetrix verify that SST39WF400B-70-4I-VA is sourced from the original manufacturer or authorized distributors?
All SST39WF400B-70-4I-VA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF400B-70-4I-VA meets industry standards.
7.What is the process for return or replacement of SST39WF400B-70-4I-VA?
All SST39WF400B-70-4I-VA units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF400B-70-4I-VA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF400B-70-4I-VA part is unused and in its original packaging.
Return procedure for SST39WF400B-70-4I-VA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39WF400B-70-4I-VA Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
