Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology SST39WF800B-70-4C-MAQE

Part No.:
SST39WF800B-70-4C-MAQE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-WFBGA
Datasheet:
AetrixSST39WF800B-70-4C-MAQE.pdf
Description:
IC FLASH 8MBIT PARALLEL 48WFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,349

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SST39WF800B-70-4C-MAQE from Microchip Technology is an 8 Mbit (512K × 16) Multi-Purpose Flash memory IC using SuperFlash technology, operating at 1.65–1.95 V, with 70 ns read access time, JEDEC-standard x16 asynchronous interface, and sector/block/whole-chip erase capability. It serves as nonvolatile program/data storage in embedded controllers, firmware update modules, and industrial HMI systems.

For engineers reviewing the SST39WF800B-70-4C-MAQE datasheet, SST39WF800B-70-4C-MAQE pinout, SST39WF800B-70-4C-MAQE application, or SST39WF800B-70-4C-MAQE equivalent, this page delivers verified technical context, JEDEC-compliant timing behavior, SuperFlash-specific endurance and retention specs, and package-specific terminal mapping for 48-ball XFLGA (4mm × 6mm).

Technical Context

The SST39WF800B-70-4C-MAQE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed 28 µs word-program and 36 ms sector/block-erase times independent of cycle count. It supports JEDEC-standard command sets including Software Data Protection (SDP) with three-byte program and six-byte erase sequences.

It features dual end-of-write detection via DQ7 Data# Polling and DQ6 Toggle Bit, operates exclusively in x16 asynchronous mode (no x8/x32 support), and requires no external VPP-internal charge pump generates programming voltage. All operations are controlled by CE#, OE#, and WE# with strict setup/hold timing per Table 15.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 16 = 8 Mbit; supports only x16 data bus width, no byte-level addressing
Read Access Time 70 ns max; enables direct connection to 14 MHz microcontrollers without wait states
Supply Voltage 1.65–1.95 V; compatible with low-voltage SoC I/O domains and eliminates level-shifting needs
Endurance 10,000 cycles min (JEDEC A117); 100,000 cycles typical-valid across all sectors/blocks
Data Retention >100 years (JEDEC A103); guaranteed under industrial temperature range (−40°C to +85°C)
Erase Granularity Uniform 2 KWord sectors (4 KB) and 32 KWord blocks (64 KB); no partial-block erasure
Write Detection DQ7 Data# Polling and DQ6 Toggle Bit; both valid after rising edge of 4th (program) or 6th (erase) WE#/CE# pulse

Pinout & Package

Package: 48-ball XFLGA (4 mm × 6 mm), RoHS-compliant, bottom-side ball grid array with standard JEDEC x16 flash pinout.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs A0–A17 select 512K words; A18 (AMS) is most-significant address used for sector/block selection during erase
DQ0–DQ15 Data I/O 16-bit bidirectional bus; latched internally during write; tri-stated when CE# or OE# high
CE# Chip Enable Active-low device select; must be low for all write/erase operations and read access
OE# Output Enable Active-low output gate; controls DQ bus drive; high disables outputs (high-Z state)
WE# Write Enable Active-low control for write/erase initiation; latches address/data on falling/rising edges per JEDEC timing
VDD Power Supply 1.65–1.95 V core supply; powers internal charge pump and logic; no external VPP required
VSS Ground Two dedicated ground balls (pins E1 and L6 per Figure 2); mandatory for noise immunity and current return
NC No Connection 11 unconnected balls (e.g., C1, C2, D1, etc.); must remain floating-no PCB routing or pull-up/down

Key Features

Feature Design Value
SuperFlash Cell Architecture Split-gate + thick-oxide tunneling injector enables fixed 28 µs program/36 ms erase times across full lifecycle
Software Data Protection (SDP) JEDEC-compliant three-byte (program) and six-byte (erase) command sequences prevent accidental writes during power transitions
Uniform Erase Blocks 256 sectors (4 KB each) and 16 blocks (64 KB each); simplifies firmware partitioning and OTA update management
Low-Voltage Operation 1.65–1.95 V operation reduces system power by >40% vs. 3.3 V flash; eliminates need for separate voltage rails
CMOS I/O Compatibility Full 1.65–1.95 V VIH/VIL thresholds; matches modern low-voltage microcontroller GPIO without level shifters

Applications

Firmware Storage in Industrial PLCs Boot Code Storage in RISC-V SoCs

Use Scenario: Stores field-upgradable ladder logic and configuration parameters in programmable logic controllers exposed to wide temperature swings and electrical noise.

IC Role / Device Role / Timing Role: Nonvolatile x16 parallel boot memory mapped to CPU address space; accessed via CE#/OE#/WE# handshake with 70 ns read latency.

Use Value: 100-year data retention ensures firmware integrity over equipment lifetime; 10,000-cycle endurance supports quarterly firmware patches without wear leveling.

Use Scenario: Holds initial boot code and secure bootloader for RISC-V-based edge AI processors requiring fast cold-start execution.

IC Role / Device Role / Timing Role: Primary x16 boot ROM; CPU fetches instructions directly from SST39WF800B-70-4C-MAQE address space during reset sequence.

Use Value: 70 ns access time enables zero-wait-state boot at 14 MHz; 1.65–1.95 V supply aligns with SoC I/O domain, eliminating level-shifter BOM cost.

Configuration Memory in Medical Imaging Systems FPGA Bitstream Storage in Test Equipment

Use Scenario: Stores calibration tables, sensor compensation coefficients, and user preference profiles in portable ultrasound devices certified to IEC 60601-1.

IC Role / Device Role / Timing Role: Dedicated configuration EEPROM replacement; updated via host MCU using SDP-protected sector-erase and word-program commands.

Use Value: Sector-erase granularity (4 KB) allows selective reprogramming of calibration data without disturbing operational firmware; RoHS compliance meets medical regulatory requirements.

Use Scenario: Stores multiple FPGA configuration bitstreams for automated test equipment switching between analog/digital measurement modes.

IC Role / Device Role / Timing Role: Parallel x16 configuration ROM; FPGA config controller reads bitstream sequentially after power-on using CE#/OE# strobes.

Use Value: Block-erase (64 KB) enables rapid bitstream swapping; SuperFlash's fixed 36 ms erase time guarantees deterministic reconfiguration latency under all temperature conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF800A-70-4C-EQE Same 8 Mbit x16 organization and SuperFlash tech, but rated for 2.7–3.6 V operation; 70 ns access, 100k-cycle endurance Requires 3.3 V supply rail; incompatible with 1.8 V systems; pinout identical but voltage domain mismatch prevents drop-in use Select only if system uses 3.3 V I/O and requires higher voltage margin; not suitable for 1.8 V designs like SST39WF800B-70-4C-MAQE
MX29LV800CTTI-70G 8 Mbit x16 CFI-compliant flash; 70 ns access; 3.0 V operation; 100k-cycle endurance; supports CFI query mode Lacks SuperFlash fixed-timing benefit; erase times increase with cycle count; requires external VPP for programming Choose when CFI compatibility is mandatory for legacy BIOS/tooling; avoid where deterministic erase latency or ultra-low voltage operation is critical

Compared with SST39VF800A-70-4C-EQE and MX29LV800CTTI-70G, the SST39WF800B-70-4C-MAQE uniquely delivers 1.65–1.95 V operation with fixed 36 ms erase time-enabling reliable firmware updates in battery-powered and thermally constrained embedded systems where voltage headroom and timing predictability are design-critical.

Availability

SST39WF800B-70-4C-MAQE is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, RISC-V boot applications, and FPGA configuration storage requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for SST39WF800B-70-4C-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and now develops, manufactures, and supports SuperFlash-based serial and parallel flash products.

The SST39WF800B product line targets low-voltage embedded systems requiring high-reliability, long-retention nonvolatile storage with deterministic timing-especially in automotive infotainment, industrial automation, and portable medical devices.

FAQ

What is the operating voltage range for the SST39WF800B-70-4C-MAQE?

The SST39WF800B-70-4C-MAQE operates strictly within 1.65 V to 1.95 V for all read, program, and erase functions. This narrow range is enforced by internal voltage regulation and power-on reset circuitry; operation outside this window risks data corruption or failure to enter valid command sequences. The SST39WF800B-70-4C-MAQE does not support 3.3 V or dual-voltage operation.

Does the SST39WF800B-70-4C-MAQE support x8 data bus mode?

No, the SST39WF800B-70-4C-MAQE supports x16-only asynchronous interface as confirmed in Table 7 (Device Geometry Information) and Product Description. It lacks x8 mode pins or internal multiplexing logic; DQ0–DQ15 are always active as a 16-bit bus. Attempting x8 operation will result in undefined behavior or bus contention.

How is end-of-program detection implemented in the SST39WF800B-70-4C-MAQE?

The SST39WF800B-70-4C-MAQE provides two hardware-supported methods: DQ7 Data# Polling (complement-to-data toggle) and DQ6 Toggle Bit (alternating 0/1). Both become valid after the rising edge of the fourth WE# or CE# pulse. The SST39WF800B-70-4C-MAQE requires two consecutive stable reads to confirm completion and avoid spurious rejection due to asynchronous write finish timing.

What package type does the SST39WF800B-70-4C-MAQE use?

The SST39WF800B-70-4C-MAQE uses a 48-ball XFLGA package measuring 4 mm × 6 mm, as indicated by the "MAQE" suffix and confirmed in Figures 2 and 3 of DS25031A. This micro-package variant differs from TFBGA (6×8 mm) and WFBGA (4×6 mm) variants in ball pitch and thermal pad layout-PCB footprint must match MAQE-specific land pattern.

Is the SST39WF800B-70-4C-MAQE compatible with Common Flash Interface (CFI)?

Yes, the SST39WF800B-70-4C-MAQE supports both SST-specific and general CFI Query modes per Table 5 and Section "Common Flash Memory Interface". It responds to 98H command at 5555H (SST mode) or 55H (general mode) and returns full geometry, timing, and command-set descriptors-enabling auto-detection in CFI-aware bootloaders and programming tools.

SST39WF800B-70-4C-MAQE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-WFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
40µs
Access Time:
70 ns
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-WFBGA (6x4)

SST39WF800B-70-4C-MAQE FAQ

1.How can I place an order for SST39WF800B-70-4C-MAQE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39WF800B-70-4C-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39WF800B-70-4C-MAQE reliable?

The price and inventory of SST39WF800B-70-4C-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF800B-70-4C-MAQE is usually 5 days.

3.What payment methods are accepted for SST39WF800B-70-4C-MAQE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF800B-70-4C-MAQE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39WF800B-70-4C-MAQE?

SST39WF800B-70-4C-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39WF800B-70-4C-MAQE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39WF800B-70-4C-MAQE?

For technical support, including SST39WF800B-70-4C-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF800B-70-4C-MAQE requirements.

6.How does Aetrix verify that SST39WF800B-70-4C-MAQE is sourced from the original manufacturer or authorized distributors?

All SST39WF800B-70-4C-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF800B-70-4C-MAQE meets industry standards.

7.What is the process for return or replacement of SST39WF800B-70-4C-MAQE?

All SST39WF800B-70-4C-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF800B-70-4C-MAQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39WF800B-70-4C-MAQE part is unused and in its original packaging.

Return procedure for SST39WF800B-70-4C-MAQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39WF800B-70-4C-MAQE Tags

  • SST39WF800B-70-4C-MAQE
  • SST39WF800B-70-4C-MAQE PDF
  • SST39WF800B-70-4C-MAQE Datasheet
  • SST39WF800B-70-4C-MAQE Specifications
  • SST39WF800B-70-4C-MAQE Images
  • Microchip Technology
  • Microchip Technology SST39WF800B-70-4C-MAQE
  • Buy SST39WF800B-70-4C-MAQE
  • SST39WF800B-70-4C-MAQE Price
  • SST39WF800B-70-4C-MAQE Distributor
  • SST39WF800B-70-4C-MAQE Supplier
  • SST39WF800B-70-4C-MAQE Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER