NXP Semiconductors SSTUH32866EC/G,557
- Part No.:
- SSTUH32866EC/G,557
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialty Logic
- Package:
- 96-LFBGA
- Datasheet:
-
SSTUH32866EC/G,557.pdf
- Description:
- IC BUFFER 1.8V 25BIT SOT536-1
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SSTUH32866EC/G,557 from NXP Semiconductors (formerly Philips Semiconductors) is a 1.8 V configurable DDR2 registered buffer with integrated parity checking, designed for RDIMM applications. It supports two modes: 25-bit 1:1 or 14-bit 1:2 topology, delivers ≤1.8 ns single-bit propagation delay, operates up to 450 MHz, and features open-drain QERR output for active-LOW parity error indication in even-parity systems.
For engineers reviewing the SSTUH32866EC/G,557 datasheet, SSTUH32866EC/G,557 pinout, SSTUH32866EC/G,557 application, or SSTUH32866EC/G,557 equivalent, this device is critical for DDR2 memory subsystems requiring robust data integrity, high-drive capability for stacked DRAM loads, and JEDEC-compliant timing in registered DIMM designs.
Technical Context
The SSTUH32866EC/G,557 uses differential CK/CK inputs synchronized at the crossing of CK rising and CK falling edges to register SSTL_18 data inputs (D1–D25 or subsets per configuration). Its parity logic computes even parity across DIMM-independent data inputs plus PAR_IN, latching QERR LOW for two clock cycles upon error detection.
Configuration is controlled by LVCMOS C0/C1 pins: C1 selects 1:1 (C1=0) vs. 1:2 (C1=1); C0 selects Register A (C0=0) or Register B (C0=1) in 1:2 mode. Chip-select gating (DCS/CSR) disables outputs to reduce dynamic power, while RESET asynchronously clears registers and forces all outputs LOW.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.7 V to 1.9 V - Ensures compatibility with DDR2 SSTL_18 I/O standards and stable operation under VDD tolerance. |
| Max Clock Frequency | 450 MHz - Supports high-speed DDR2 data rates without timing violation in registered DIMM channel design. |
| Propagation Delay (tPDM) | 1.41–1.8 ns - Guarantees tight setup/hold margins for DDR2 timing budgets with minimal skew. |
| Output Drive Strength | ±12 mA - Enables reliable signal integrity driving heavy capacitive loads (e.g., stacked DRAMs) without waveform degradation. |
| Parity Logic | Even-parity checking on DIMM-independent data + PAR_IN - Detects single-bit errors in memory controller-to-DIMM data path. |
| QERR Output Type | Open-drain, active LOW - Allows wired-OR fault signaling across multiple buffers and interface with standard pull-up termination. |
| Input Compatibility | SSTL_18 data/control; LVCMOS RESET/C0/C1 - Simplifies integration into mixed-signal DDR2 controller interfaces. |
Pinout & Package
Package: 96-ball LFBGA (13.5 mm × 5.5 mm, 0.8 mm pitch), SOT536-1 footprint - Optimized for high-density DDR2 module layout with thermal and electrical performance for memory subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK | Differential clock input pair | Master timing reference; registers data on CK↑/CK↓ crossing - enables precise DDR2 edge-aligned sampling. |
| PAR_IN | Parity input | Accepts parity bit one clock cycle after corresponding data - enables real-time even-parity validation against D-inputs. |
| QERR | Open-drain error output | Asserts LOW on parity mismatch and holds for two clocks - provides glitch-free, latchable fault indication for system monitoring. |
| C0 / C1 | Configuration control inputs | Select 1:1/1:2 mode and Register A/B assignment - enables flexible DIMM topology support without hardware change. |
| RESET | Asynchronous reset | Forces all outputs LOW and disables receivers - ensures known state during power-up and system recovery. |
| VREF | Reference voltage input | Provides 0.9 V bias for SSTL_18 input threshold - maintains consistent switching point across process/voltage/temperature. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable 1:1 or 1:2 topology | Supports both 25-bit unidirectional and 14-bit dual-channel DIMM routing - reduces PCB layer count and improves signal routing density. |
| High-output-drive CMOS drivers | ±12 mA drive strength - maintains signal integrity across long traces and high-capacitance DDR2 nets (e.g., >30 pF). |
| Controlled output impedance | Optimized driver design minimizes reflections and overshoot - eliminates need for external series termination in most DIMM layouts. |
| Partial Parity Out (PPO) | Generates intermediate parity for cascaded configurations - enables correct multi-buffer parity checking without external logic. |
| Low-power standby gating | DCS/CSR jointly disable outputs when HIGH - cuts dynamic current by >90% during idle DIMM cycles. |
Applications
| DDR2 Registered DIMMs with Parity | High-Density Stacked DRAM Modules |
|---|---|
Use Scenario: DDR2 RDIMM used in enterprise servers requiring ECC-adjacent parity checking for early error detection before full ECC correction. IC Role / Device Role / Timing Role: Acts as registered buffer and parity validator between memory controller and DRAM ranks; synchronizes data on CK/CK edges and validates PAR_IN against D-inputs. Use Value: Enables cost-effective parity-level data integrity without full ECC silicon, reducing system-level latency versus software-based checks. |
Use Scenario: 4-rank or 8-rank RDIMM with vertically stacked DRAM packages increasing net capacitance beyond standard buffer limits. IC Role / Device Role / Timing Role: Provides high-drive registered buffering with <1.8 ns tPDM to maintain timing margin despite >40 pF load per net. Use Value: Eliminates signal integrity degradation and timing closure issues caused by heavy capacitive loading on address/command buses. |
| Cascaded Parity Validation Systems | Industrial DDR2 Memory Subsystems |
Use Scenario: Two SSTUH32866EC/G,557 devices deployed on same DIMM to validate full 28-bit data path using PPO-to-PAR_IN cascade. IC Role / Device Role / Timing Role: First device (Register A) computes partial parity; second device (Register B) performs final parity check and asserts QERR. Use Value: Achieves complete parity coverage across extended data widths while preserving JEDEC-compliant pinout and timing behavior. |
Use Scenario: Ruggedized DDR2 memory modules for industrial automation controllers operating in 0°C to +70°C ambient with strict supply stability requirements. IC Role / Device Role / Timing Role: Delivers guaranteed 1.7–1.9 V operation and ±5 µA input leakage - ensures reliable function under wide VDD tolerance and temperature drift. Use Value: Reduces field failure risk from supply variation or thermal stress, supporting long-lifecycle deployments without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 registered buffer with parity applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2235L15PF | 3.3 V operation, non-configurable 18-bit 1:1 only, no parity logic | Lacks parity checking and DDR2-specific SSTL_18 I/O; requires level-shifting for DDR2 interface | Select only if legacy 3.3 V system architecture prohibits 1.8 V adoption and parity is handled externally. |
| ON Semiconductor NB3N502DR2G | 1.8 V, 25-bit 1:1 only, no 1:2 mode or PAR_IN/QERR functionality | Supports DDR2 clock distribution but omits parity validation - requires external error logic | Choose when DIMM topology is fixed 1:1 and parity is implemented upstream in controller or FPGA. |
Compared with IDT72V2235L15PF and NB3N502DR2G, the SSTUH32866EC/G,557 uniquely integrates configurable topology, on-die parity checking, and DDR2-optimized drive strength - eliminating external components and enabling JEDEC-compliant RDIMM designs with built-in data integrity.
Availability
SSTUH32866EC/G,557 is available at Aetrix Electronics and suitable for DDR2 registered DIMM manufacturing, server memory module refurbishment, and industrial embedded memory subsystems requiring stable component supply and long-term lifecycle support.
Supply support for SSTUH32866EC/G,557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, formerly Philips Semiconductors, is a global leader in high-performance analog and mixed-signal ICs for memory, automotive, and industrial applications.
The SSTUH32866EC/G,557 belongs to NXP's DDR2 registered buffer product line, engineered specifically to meet JEDEC JESD82-7 requirements for parity-enabled RDIMMs in high-reliability computing environments.
FAQ
What is the primary function of the SSTUH32866EC/G,557 in a DDR2 memory system?
The SSTUH32866EC/G,557 serves as a configurable registered buffer with integrated even-parity checking for DDR2 RDIMMs. It registers address, command, and data signals using differential CK/CK inputs, drives heavy capacitive loads with ±12 mA output strength, and validates parity via PAR_IN comparison to generate QERR on mismatch - all within a single 96-ball LFBGA package.
How does the SSTUH32866EC/G,557 support both 1:1 and 1:2 topologies?
The SSTUH32866EC/G,557 uses two LVCMOS configuration pins: C1 selects mode (C1=0 → 25-bit 1:1; C1=1 → 14-bit 1:2), and C0 selects register identity in 1:2 mode (C0=0 → Register A; C0=1 → Register B). Pin mappings differ per mode (see Figures 4–6), and data input/output sets are redefined accordingly - e.g., D2–D25 in 1:1 vs. D2–D14 in Register A 1:2.
What is the timing relationship between PAR_IN and its corresponding data inputs on the SSTUH32866EC/G,557?
PAR_IN arrives one clock cycle after the data inputs it validates - for example, PAR_IN sampled at clock edge m corresponds to D-inputs sampled at edge m−1. In cascaded 1:2 configurations, PAR_IN for the second device is driven by PPO from the first device, maintaining correct temporal alignment across the chain.
Can the SSTUH32866EC/G,557 operate without an external VREF source?
No - the SSTUH32866EC/G,557 requires an externally supplied VREF at 0.49×VDD to 0.51×VDD (typically 0.9 V at 1.8 V VDD) to bias its SSTL_18 input receivers. VREF must be held at a valid level before RESET release and maintained during operation; floating VREF causes undefined input thresholds and potential functional failure.
What happens to QERR output when a parity error occurs on the SSTUH32866EC/G,557?
When a parity error is detected, the SSTUH32866EC/G,557 drives QERR LOW and latches it for two full clock cycles. The output remains LOW until either two clocks elapse or RESET is asserted LOW. This behavior ensures reliable capture by system monitoring logic without requiring strobing or edge detection.
SSTUH32866EC/G,557 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 96-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Logic Type:
- 1:1, 1:2 Configurable Registered Buffer with Parity
- Supply Voltage:
- 1.7V ~ 1.9V
- Number of Bits:
- 25, 14
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-LFBGA (13.5x5.5)
SSTUH32866EC/G,557 FAQ
1.How can I place an order for SSTUH32866EC/G,557 through Aetrix?
Please submit a Request for Quotation (RFQ) for SSTUH32866EC/G,557 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SSTUH32866EC/G,557 reliable?
The price and inventory of SSTUH32866EC/G,557 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SSTUH32866EC/G,557 is usually 5 days.
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SSTUH32866EC/G,557 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SSTUH32866EC/G,557 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SSTUH32866EC/G,557?
For technical support, including SSTUH32866EC/G,557 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SSTUH32866EC/G,557 requirements.
6.How does Aetrix verify that SSTUH32866EC/G,557 is sourced from the original manufacturer or authorized distributors?
All SSTUH32866EC/G,557 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SSTUH32866EC/G,557 meets industry standards.
7.What is the process for return or replacement of SSTUH32866EC/G,557?
All SSTUH32866EC/G,557 units undergo pre-shipment inspection (PSI). If there is an issue with SSTUH32866EC/G,557, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SSTUH32866EC/G,557 part is unused and in its original packaging.
Return procedure for SSTUH32866EC/G,557:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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