STMicroelectronics ST2378ETTR

Overview

ST2378ETTR from STMicroelectronics is an 8-bit dual-supply bidirectional level translator supporting 1.71 V to 5.5 V logic domains, with ±15 kV HBM ESD protection on I/O_VCC pins, 13 Mbps guaranteed data rate, and TSSOP20 package. It enables voltage-domain bridging between low-voltage microcontrollers (e.g., 1.8 V I²C peripherals) and higher-voltage systems (e.g., 5 V host controllers) without direction control pins.

For engineers reviewing the ST2378ETTR datasheet, ST2378ETTR pinout, ST2378ETTR application, or ST2378ETTR equivalent, key selection criteria include bidirectional translation capability, open-drain/totem-pole I²C compatibility, 15 ns max propagation delay at 85 °C, 1 µA high-impedance quiescent current, and 5 V tolerance on the OE pin.

Technical Context

The ST2378E employs a transmission-gate-based architecture enabling true asynchronous bidirectional data flow per channel-no direction pin required. Each of its eight channels independently translates signals either VL → VCC or VCC → VL depending on instantaneous logic state and supply configuration.

It supports two distinct driving modes: totem-pole (for high-speed operation up to 13 Mbps) and open-drain (for I²C bus compatibility), with separate AC timing specifications for each. The OE pin is 5 V tolerant and referenced to VL, allowing direct interfacing with 5 V enable logic while powered from lower VL supplies.

Key Specifications

Pinout & Package

TSSOP20 (Thin Shrink Small Outline Package, 20-pin, 0.65 mm pitch) with exposed thermal pad option; RoHS-compliant, ECOPACK2 certified; body dimensions 6.5 × 6.4 × 1.05 mm (L × W × H).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0108E and SN74AVC8T245, the ST2378ETTR uniquely combines bidirectional autonomy, integrated ±15 kV ESD, I²C-ready open-drain mode, and ultra-low disable current - making it optimal for compact, robust, low-power mixed-voltage I²C systems.

Availability

ST2378ETTR is available at Aetrix Electronics and suitable for industrial sensor interfaces, automotive body control modules, portable medical devices, and I²C bus expansion requiring stable component supply across extended temperature ranges (-40 °C to +85 °C).

Supply support for ST2378ETTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensing solutions for industrial, automotive, and consumer markets.

The ST2378E belongs to ST's level translation product line, engineered specifically for robust, low-power, mixed-voltage digital interface bridging in space-constrained and ESD-sensitive applications.

FAQ

What voltage combinations are supported between VL and VCC?

The ST2378ETTR supports VL from 1.71 V up to VCC, and VCC from 1.71 V to 5.5 V, with VL ≤ VCC required. Valid pairs include 1.8 V/3.3 V, 1.8 V/5.0 V, and 3.3 V/5.0 V. Operation with VL > VCC is not permitted during normal use but will not damage the device during power-up transients.

Can the ST2378ETTR be used for I²C communication without external pull-up resistors?

Yes - when configured in open-drain mode (per datasheet AC characteristics Table 7), the ST2378ETTR supports standard I²C bus operation with internal weak pull-downs. External pull-ups are still required on both sides of the bus per I²C specification, but no additional level-shifting components are needed.

How does the OE pin behave when driven with 5 V logic while VL is 1.8 V?

The OE pin is explicitly 5 V tolerant and referenced to VL. When VL = 1.8 V, VIH-TS = 0.75 × VL = 1.35 V (min), so a 5 V high signal safely exceeds this threshold. No level-shifting circuitry is required, simplifying interface with legacy 5 V enable sources.

Is thermal performance affected by the TSSOP20 package in high-density layouts?

The TSSOP20 package has a typical θ_JA of ≈120 °C/W. With max power dissipation of 300 mW at 85 °C, junction temperature rise can reach ~36 °C above ambient. For high-density boards, adding thermal vias under the exposed pad (if present) and copper pour improves heat dissipation and maintains reliability within spec.