STMicroelectronics ST4G3234BJR

Overview

ST4G3234BJR from STMicroelectronics is a dual-supply 4-bit unidirectional bus buffer level translator designed for voltage translation between mismatched I/O domains (e.g., 3.3V ↔ 1.8V, 2.5V ↔ 1.4V). It delivers tPD = 4.4 ns (max) at TA = 85°C, supports VCCA/VCCB = 1.4–3.6 V, features 26Ω series resistors on A-side outputs, and provides power-down isolation with <5 µA quiescent current per supply.

For engineers reviewing the ST4G3234BJR datasheet, ST4G3234BJR pinout, ST4G3234BJR application, or ST4G3234BJR equivalent, key selection criteria include bidirectional voltage domain compatibility, guaranteed skew ≤0.75 ns, input-tolerant operation up to VCCB + 0.3V, and FLIPCHIP11 package suitability for high-density PCB layouts.

Technical Context

The ST4G3234BJR implements a CMOS-based level-shifting architecture with separate VCCA (output-side) and VCCB (input-side) supplies, enabling asynchronous one-way data transfer across voltage domains without internal level-shifting circuitry like charge pumps or regulators. Its symmetrical output drive (|IOHA| = |IOLA| ≥ 8 mA) and balanced tPLH/tPHL ensure minimal duty-cycle distortion in timing-critical interfaces.

Input protection includes ESD immunity >2000V HBM and power-down isolation that disables both inputs and outputs when either supply drops below ~0.8V, preventing back-drive contention. The integrated 26Ω series resistor on each A-side output reduces signal reflections and simplifies external termination in high-speed parallel bus applications.

Key Specifications

Pinout & Package

ST4G3234BJR uses the FLIPCHIP11 package (2.04 mm × 1.41 mm, 0.65 mm height), optimized for ultra-compact board space and low-inductance interconnects in mobile and portable electronics.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar unidirectional level translation applications.

Compared with SN74AVC4T245 and TXS0104E, ST4G3234BJR offers superior high-speed unidirectional performance (4.4 ns tPD), integrated 26Ω termination, and lowest quiescent current (5 µA), making it optimal for fixed-direction, space-constrained, and low-power parallel bus translation.

Availability

ST4G3234BJR is available at Aetrix Electronics and suitable for mobile baseband interfaces, low-power MCU peripherals, and industrial PLC I/O modules requiring stable component supply and RoHS-compliant FLIPCHIP packaging.

Supply support for ST4G3234BJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in smart power, MEMS, analog, and microcontroller technologies for industrial, automotive, and consumer markets.

The ST4G3234 belongs to ST's low-voltage logic translation product line, engineered specifically for energy-efficient, high-density voltage-domain bridging in portable and embedded systems with strict thermal and footprint constraints.

FAQ

Is ST4G3234BJR suitable for bidirectional data transfer?

No. ST4G3234BJR is strictly unidirectional: B-side pins (B1–B4) are inputs only, and A-side pins (A1–A4) are outputs only. It lacks direction-control logic or auto-sensing capability. For bidirectional use, consider SN74AVC4T245 or similar devices with DIR pin functionality.

What is the minimum valid supply voltage for data retention?

Data retention is guaranteed down to 1.2 V on both VCCA and VCCB, as specified in the operating voltage range. Below 1.2 V, the device enters undefined state; however, functional operation requires ≥1.4 V per supply per recommended conditions.

Can ST4G3234BJR translate from 1.2V to 3.3V?

No. While VCCA and VCCB support 1.4–3.6 V operation, the datasheet explicitly states maximum data rates apply only for translations involving ≥1.4 V on both sides. Translation from 1.2 V is unsupported - the 1.2 V rating applies solely to data retention during power-down, not active operation.

Does the FLIPCHIP11 package require special PCB layout considerations?

Yes. FLIPCHIP11 uses solder bumps instead of wire bonds, requiring controlled-depth solder paste deposition, precise stencil design (0.12 mm thickness), and reflow profiles compatible with 0.65 mm pitch. Thermal vias under the die pad are recommended for thermal relief in continuous operation above 70°C ambient.