STMicroelectronics ST6G3237BTBR
- Part No.:
- ST6G3237BTBR
- Manufacturer:
- STMicroelectronics
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
ST6G3237BTBR.pdf
- Description:
- IC TRNSLTR BIDIR 25UTFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,879
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Product details
Overview
ST6G3237BTBR from STMicroelectronics is a dual-supply CMOS level translator IC designed for SD/MiniSD/T-Flash interfaces, enabling bidirectional voltage translation between 1.4–3.6 VB and 1.4–VCCB rails. It supports 52 Mbps data rates, features 6.2 ns max propagation delay (A→B DAT lines), 26 Ω series resistors on A-side I/Os, and operates across –40°C to +85°C for mixed-voltage memory card host systems.
For engineers reviewing the ST6G3237BTBR datasheet, ST6G3237BTBR pinout, ST6G3237BTBR application, or ST6G3237BTBR equivalent, key selection criteria include bidirectional direction control via CMD-dir/DAT0-dir/DAT123-dir inputs, VCCB = 0 V tolerance for ultra-low power-down current (≤5 µA), and µTFBGA25 package compatibility with high-density SD card slot layouts.
Technical Context
The ST6G3237BTBR implements asynchronous bidirectional level shifting using independent A-side (VCCA-tracked) and B-side (VCCB-tracked) I/O domains, with direction controlled per signal group (CMD, DAT0, DAT1–3) via dedicated DIR inputs. All I/Os feature ±2 kV HBM ESD protection and are latch-up immune (>500 mA per JESD17).
It integrates 26 Ω series termination on all A-side pins to damp signal reflections in high-speed SD bus environments, while maintaining balanced TPLH/TPHL delays (<0.5 ns skew) and supporting clock feedback (CLK-f) for timing alignment between host and card domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Propagation Delay | 6.2 ns (A→B DAT lines at VCCA=1.8 V, VCCB=3.0 V, TA=85°C) - enables 52 Mbps SD data transfer compliance |
| Supply Voltage Range | VCCA: 1.4 V to VCCB; VCCB: 1.4 V to 3.6 V - supports 1.8 V/3.0 V, 2.5 V/3.0 V, and 2.5 V/1.8 V mixed-rail systems |
| Quiescent Current | ≤5 µA per supply (ICCA, ICCB) at 85°C - ensures minimal standby power in battery-powered SD host devices |
| ESD Immunity | HBM > 2 kV (MIL STD 883 Method 3015) - protects against handling-induced discharge during assembly and field operation |
| Output Slew Rate | Rise/fall time ≤3 ns (20%–80%, CL=30 pF) - limits EMI while meeting SD timing margins |
| VCCB = 0 V Tolerance | IOFF ≤ ±10 µA when VCCB = 0 - allows safe power-gating of B-side without A-side leakage or damage |
Pinout & Package
The ST6G3237BTBR is housed in a 25-ball µTFBGA package (2.9 × 2.9 mm, 0.5 mm pitch) with 1.1 mm max height, RoHS-compliant and ECOPACK® certified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CMD-dir | Direction control input (A→B or B→A) | Configures CMD line direction independently; HIGH = A→B, LOW = B→A |
| DAT0-dir | Direction control input for DAT0 | Enables read/write mode selection for DAT0 line in SD protocol |
| DAT123-dir | Direction control input for DAT1–DAT3 | Simultaneously sets direction for 3-bit wide data path during block transfers |
| CMD.h / CMD | Bidirectional command line (A/B side) | A-side connects to host controller; B-side connects to SD card; push-pull driven |
| DAT0.h / DAT0 | Bidirectional data line 0 (A/B side) | Carries command response and single-bit data; 26 Ω series resistor on A-side only |
| DAT1.h–DAT3.h / DAT1–DAT3 | Bidirectional data lines 1–3 (A/B side) | Support 4-bit wide SD data transfers; all A-side pins include 26 Ω termination |
| CLK.h / CLK | Clock input/output (A→B) | Host-generated clock translated to card domain; includes dedicated CLK-f feedback path |
| CLK-f | Clock feedback output (A-side) | Provides delayed copy of translated CLK to host for phase compensation |
| VCCA / VCCB | Independent power supplies | VCCA powers A-side I/Os and controls; VCCB powers B-side I/Os only |
| GND | Common reference | Three dedicated ground balls (C3, C4, and shared thermal pad) minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Per-signal direction control | Separate CMD-dir, DAT0-dir, and DAT123-dir inputs allow independent flow control for command, single-data, and multi-data lanes |
| A-side integrated 26 Ω termination | Eliminates need for external series resistors on host-side traces, reducing BOM count and PCB area in space-constrained SD slots |
| VCCB = 0 V operational safety | Prevents back-powering or latch-up when B-side (card rail) is unpowered, critical for hot-plug SD card detection |
| Low-skew clock/data paths | tOSLH/tOSHL ≤ 0.5 ns ensures tight timing alignment between translated CLK and DAT signals for reliable high-speed SD mode |
| Ultra-low static current | 5 µA max ICCA/ICCB at 85°C enables >10-year battery life in always-on SD host monitoring circuits |
Applications
| Smartphone SD Card Interface | Digital Camera Memory Slot |
|---|---|
Use Scenario: Translating signals between an application processor's 1.8 V SDIO interface and a 3.0 V SD card. IC Role / Device Role / Timing Role: Bidirectional level shifter managing CMD, CLK, DAT0–DAT3 with per-lane direction control and clock feedback. Use Value: Enables interoperability without voltage conflict or timing violation, supporting UHS-I mode up to 52 Mbps. | Use Scenario: Connecting a 2.5 V image sensor SoC to a removable SDHC card in compact DSLR bodies. IC Role / Device Role / Timing Role: Dual-rail translator isolating 2.5 V host logic from 3.0 V card power domain while preserving SD timing budgets. Use Value: Prevents overvoltage damage during card insertion/removal and maintains <6.2 ns tPD for burst write performance. |
| Industrial IoT Data Logger | Medical Portable Recorder |
Use Scenario: Interfacing a low-power microcontroller (1.8 V I/O) with industrial-grade SD cards operating at 3.0 V in extended temperature environments. IC Role / Device Role / Timing Role: Level translation with –40°C to +85°C guaranteed operation and VCCB = 0 V tolerance for safe power sequencing. Use Value: Ensures reliable firmware updates and log writes under thermal stress, with ≤5 µA quiescent draw extending battery runtime. | Use Scenario: Enabling secure, low-noise SD card recording in portable EEG or ECG devices powered by coin-cell batteries. IC Role / Device Role / Timing Role: High-integrity signal translator with ±2 kV HBM ESD protection on all pins and minimized crosstalk via ground ball placement. Use Value: Maintains clinical-grade signal fidelity by preventing ESD-induced data corruption during clinician handling or patient contact. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0108E | Auto-direction sensing (no DIR pins); 3.6 V max VCCB; higher ICC (10 µA typ) | Requires no direction control logic but lacks per-lane granularity; less suitable for SD-specific timing-critical feedback paths | Select when simplifying control logic outweighs need for CLK-f and precise SD skew control |
| SN74AVC4T245 | Fixed-direction (uni/bi configurable per channel); no VCCB = 0 V tolerance; 3.6 V max both rails | Lacks SD-optimized features (e.g., CLK-f, DAT-group DIR); requires external termination resistors | Choose for general-purpose 4-bit translation where SD protocol timing and power-gating safety are not required |
Compared with TXS0108E and SN74AVC4T245, the ST6G3237BTBR uniquely provides per-signal direction control, dedicated clock feedback, and VCCB = 0 V tolerance-making it the only option qualified for robust, standards-compliant SD/MiniSD/T-Flash host interfaces requiring guaranteed timing and hot-plug resilience.
Availability
ST6G3237BTBR is available at Aetrix Electronics and suitable for smartphone memory expansion, digital camera storage modules, industrial data loggers, and medical portable recorders requiring stable component supply across long-life product cycles.
Supply support for ST6G3237BTBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.
The ST6G3237B belongs to ST's SD/Flash interface IC product line, engineered specifically to solve voltage translation, timing alignment, and hot-plug reliability challenges in portable memory card host systems.
FAQ
What is the maximum supported data rate for SD bus operation with ST6G3237BTBR?
The ST6G3237BTBR supports up to 52 Mbps bidirectional data transfer, verified by AC characterization at fmax = 52 MHz for both clock and data paths under VCCA = 1.8 V and VCCB = 3.0 V conditions. This meets the timing requirements of High-Speed SD Mode (SDR25) and is validated across –40°C to +85°C ambient.
Does ST6G3237BTBR require external pull-up or pull-down resistors on DIR inputs?
No external biasing is required: CMD-dir, DAT0-dir, and DAT123-dir inputs have defined VIH/VIL thresholds referenced to VCCA, with guaranteed switching at 0.65×VCCA (VIH) and 0.35×VCCA (VIL). Internal input structure ensures clean logic-level recognition without external components.
Can ST6G3237BTBR be used in a 1.2 V / 3.3 V system?
No - VCCA minimum is 1.4 V per datasheet Section 5, and VCCA must be ≤ VCCB. A 1.2 V host rail falls below specification and risks undefined logic behavior, increased leakage, and potential damage. Valid combinations are 1.8 V/3.0 V, 2.5 V/3.0 V, and 2.5 V/1.8 V only.
Is the µTFBGA25 package of ST6G3237BTBR compatible with standard reflow profiles?
Yes - the µTFBGA25 package is JEDEC-compliant with peak reflow temperature rated at 260°C for 10 seconds. Its ECOPACK® construction uses lead-free second-level interconnects and meets IPC/JEDEC J-STD-020D moisture sensitivity level 3 (MSL3), requiring bake-out only if exposed >168 hours at >30°C/60% RH.
ST6G3237BTBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 2
- Channels per Circuit:
- 1, 3
- Voltage - VCCA:
- 1.4 V ~ 3.6 V
- Voltage - VCCB:
- 1.4 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Non-Inverted
- Data Rate:
- 52Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Power-Off Protection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 25-TFBGA
ST6G3237BTBR FAQ
1.How can I place an order for ST6G3237BTBR through Aetrix?
Please submit a Request for Quotation (RFQ) for ST6G3237BTBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ST6G3237BTBR reliable?
The price and inventory of ST6G3237BTBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ST6G3237BTBR is usually 5 days.
3.What payment methods are accepted for ST6G3237BTBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ST6G3237BTBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ST6G3237BTBR?
ST6G3237BTBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ST6G3237BTBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ST6G3237BTBR?
For technical support, including ST6G3237BTBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ST6G3237BTBR requirements.
6.How does Aetrix verify that ST6G3237BTBR is sourced from the original manufacturer or authorized distributors?
All ST6G3237BTBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ST6G3237BTBR meets industry standards.
7.What is the process for return or replacement of ST6G3237BTBR?
All ST6G3237BTBR units undergo pre-shipment inspection (PSI). If there is an issue with ST6G3237BTBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ST6G3237BTBR part is unused and in its original packaging.
Return procedure for ST6G3237BTBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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