STMicroelectronics ST6G3237TBR

Overview

ST6G3237TBR from STMicroelectronics is a dual-supply, bidirectional CMOS level translator optimized for SD/MiniSD/T-Flash interfaces, supporting 1.4V–3.6V VCCA and 1.4V–3.6V VCCB operation, with 4.4ns max propagation delay at 85°C, 5µA max quiescent current, and integrated 26Ω A-side series resistors for signal integrity in memory card host systems.

For engineers reviewing the ST6G3237TBR datasheet, ST6G3237TBR pinout, ST6G3237TBR application, or ST6G3237TBR equivalent, this device addresses voltage translation between 1.8V/2.5V host controllers and 3.0V SD card buses while maintaining balanced TPLH/TPHL, power-down input/output protection, and ±2kV HBM ESD immunity - critical for portable storage interface design.

Technical Context

The ST6G3237 implements asynchronous bidirectional translation using independent direction-control inputs (CMD-dir, DAT0-dir, DAT123-dir) to dynamically route signals between A-side (VCCA-tracked) and B-side (VCCB-tracked) ports. It supports full-duplex SD command/data paths including CLK feedback (CLK-f) for timing compensation.

Its C2MOS process enables rail-to-rail I/O voltage tracking, with DC input thresholds defined as 0.65×VCC and 0.35×VCC per port, and AC performance validated up to 52MHz clock/data rates under 30pF load with 500Ω termination.

Key Specifications

Pinout & Package

ST6G3237TBR is packaged in a 25-ball µTFBGA (2.9 × 2.9 mm, 0.5 mm pitch) with exposed die pad for thermal management and space-constrained SD card socket designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0108E and SN74AVC4T245, ST6G3237TBR uniquely delivers SD-specific features - per-lane DIR inputs, CLK-f feedback, on-die 26Ω resistors, and guaranteed latch-up immunity - making it the only drop-in solution for compliant, space-constrained SD host designs.

Availability

ST6G3237TBR is available at Aetrix Electronics and suitable for smartphone SD host interfaces, digital camera memory card slots, and tablet embedded storage modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for ST6G3237TBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.

The ST6G3237 belongs to ST's SD/Flash interface product line, engineered specifically to simplify high-speed, low-power memory card integration in portable electronics with strict PCB area and reliability constraints.

FAQ

What is the maximum supported data rate for DAT lines?

The ST6G3237TBR supports bidirectional data transfer at up to 52 Mbps on DAT0–DAT3 lines, verified under AC conditions with CL = 30pF and RL = 500Ω at VCCA = 1.8V and VCCB = 3.0V. This meets the timing requirements of SD High-Speed Mode (25 MHz clock, double-data-rate capable) and ensures reliable operation in real-world PCB environments with controlled impedance routing.

Can VCCA and VCCB be powered from different supplies with independent sequencing?

Yes - ST6G3237TBR includes power-down protection on all inputs and outputs, allowing safe operation when VCCA or VCCB is unpowered or ramping independently. The device prevents back-current flow and maintains high-impedance states on inactive ports, satisfying JEDEC JESD78 latch-up immunity requirements (>500 mA) during hot-plug or partial power-up sequences typical in SD card slots.

Is the CLK-f (clock feedback) signal phase-aligned to the B-side CLK output?

CLK-f is a delayed replica of the B-side CLK output, with measured propagation delay tPHL(B→CLK-f) = 7.5–7.7 ns (max) under specified conditions. This intentional delay compensates for PCB trace skew between host CLK and returned DAT signals, enabling the host controller to sample DAT lines at optimal setup/hold margins - a feature absent in generic level shifters.

Does the µTFBGA25 package require special PCB layout considerations?

Yes - the 25-ball µTFBGA25 (2.9 × 2.9 mm, 0.5 mm pitch) requires 4-layer PCB stack-up with dedicated ground/power planes, solder mask-defined pads, and microvia-in-pad for escape routing. ST recommends 8-mil trace/space for A/B-side I/Os and placement of 100nF ceramic decoupling capacitors within 2 mm of each VCCA/VCCB ball to maintain <100 mV ripple under 52 Mbps switching.