STMicroelectronics ST6G3240TBR

Overview

ST6G3240TBR from STMicroelectronics is a dual-supply CMOS level translator IC designed for simultaneous interface between mini SD/micro SD and managed NAND memory cards. It supports bidirectional voltage translation across three independent supply domains (VCCA = 1.4–3.6 V; VCCB1/VCCB2 = 1.4–3.6 V), delivers 5 ns A→B propagation delay at 1.8 V/3.0 V, maintains ≤5 µA quiescent current per supply at 85 °C, and features automatic high-Z port disable on B-side power loss - deployed in mobile handsets and embedded storage modules.

For engineers reviewing the ST6G3240TBR datasheet, ST6G3240TBR pinout, ST6G3240TBR application, or ST6G3240TBR equivalent, key selection criteria include dual-B-port independent voltage control, MS_Insert/CD pin integrated 100 kΩ pull-ups, full low-power mode via IN1/IN2, and guaranteed 104 Mbps data rate with <1 ns output skew.

Technical Context

The ST6G3240 implements two independent bidirectional level-shifting ports (Port A ↔ Port B1 and Port A ↔ Port B2), each with dedicated direction control (CMD-dir, DAT0-dir, DAT123-dir) and supply tracking (VCCA for A-side, VCCB1/VCCB2 for respective B-sides). Its logic enables asynchronous two-way bus communication without clock domain synchronization.

Power-down detection is hardware-automated: grounding or floating either VCCB1 or VCCB2 forces the corresponding Bn port into high-impedance state while preserving A-side functionality. The device supports interchangeable voltage ordering - VCCA may be higher or lower than either VCCB1 or VCCB2 - enabling flexible system-level voltage sequencing.

Key Specifications

Pinout & Package

ST6G3240TBR uses a μTFBGA36 package (3.6 × 3.6 mm, 0.5 mm pitch) with 36 solder balls arranged in a 6×6 grid. Power and ground pins are distributed to minimize supply noise and support decoupling capacitor placement adjacent to each VCC/GND pair.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-memory-card level translation applications.

Compared with TXS02612RTWR and SN74AVC4T245PWR, ST6G3240TBR uniquely integrates dual independent B-supplies, automatic fault-isolation, and SD/NAND-specific pins (CD, MS_Insert, CLK-f), reducing system-level component count and improving reliability in memory-card-centric designs.

Availability

ST6G3240TBR is available at Aetrix Electronics and suitable for mobile handset storage interfaces, embedded industrial data loggers, automotive infotainment SD card hubs, and medical portable diagnostic devices requiring stable component supply across extended temperature and long product lifecycles.

Supply support for ST6G3240TBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, analog, MEMS, and microcontroller solutions for automotive, industrial, and consumer markets.

The ST6G3240 belongs to ST's memory interface portfolio, engineered specifically to simplify dual-memory-card integration in space-constrained portable electronics while meeting stringent power, timing, and reliability requirements.

FAQ

What is the maximum supported clock frequency for SD command and data lines?

The ST6G3240TBR supports up to 52 MHz clock frequency for both A↔B1 and A↔B2 directions, and 104 Mbps data rate for bidirectional DAT0–DAT3 lines. This meets SD 2.0 High-Speed Mode (25 MHz base clock, 50 Mbps) and exceeds requirements for most managed NAND interfaces operating below 40 MHz.

How does the device handle power sequencing when VCCA ramps before VCCB1/VCCB2?

ST6G3240TBR tolerates arbitrary power sequencing: VCCA may ramp first, last, or concurrently with VCCB1/VCCB2. When any B-side supply is unpowered (grounded or floating), its corresponding port automatically enters high-Z, preventing back-driving or leakage - no external power-good logic is required.

Can the MS_Insert and CD pins drive a microcontroller GPIO directly?

Yes - both CD and MS_Insert have internal 100 kΩ pull-up resistors to VCCA and are specified for direct connection to standard CMOS GPIOs. CD asserts low when a card closes the switch to ground; MS_Insert operates identically but is routed to both A-side and B1-side for cross-domain detection.

Is there a recommended layout practice for minimizing crosstalk on the 36-ball μTFBGA?

Yes - place 100 nF ceramic decoupling capacitors within 2 mm of each VCCA, VCCB1, and VCCB2 ball, with vias to inner ground planes directly adjacent to each capacitor. Route CMD/DAT/CLK traces differentially where possible, maintain ≥3W spacing between high-speed nets, and avoid routing critical signals under the die area.