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STMicroelectronics STA1295ELA

Part No.:
STA1295ELA
Manufacturer:
STMicroelectronics
Category:
DSP (Digital Signal Processors)
Package:
529-LFBGA
Datasheet:
AetrixSTA1295ELA.pdf
Description:
ARM DUAL CORTEX-A7
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,036

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Product details

Overview

STA1295ELA from STMicroelectronics is an AEC-Q100 Grade 3 automotive infotainment processor featuring dual ARM® Cortex® A7 cores up to 650 MHz, 768 KB embedded SRAM, 16/32-bit DDR3L interface at 660 MHz, and integrated ARM® Cortex® M3 for secure CAN FD processing - deployed in display audio head units and digital instrument clusters.

For engineers reviewing the STA1295ELA datasheet, STA1295ELA pinout, STA1295ELA application, or STA1295ELA equivalent, key selection criteria include dual-core A7 performance with NEON/FPU, 6× audio DACs (103 dB SNR), H.264 video decode, OpenGL® ES 2.0 graphics acceleration, and dual CAN FD interfaces for vehicle network integration.

Technical Context

The STA1295ELA integrates two tightly coupled Cortex® A7 application cores (650 MHz, 2500+ DMIPS) with dedicated PLL and power domain, 256 KB L2 cache, and a separate Cortex® M3 subsystem (256 KB isolated memory) handling real-time CAN/CAN FD messaging and secure vehicle interface tasks.

Its memory architecture combines 768 KB on-die SRAM (cacheable, DMA-accessible), DDR3L controller (16/32-bit, 660 MHz), SQI NOR interface (up to 125 MHz SDR), and FSMC-based NAND/SRAM support - enabling boot-from-NAND, secure firmware partitioning, and low-latency audio/video buffering.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual ARM® Cortex® A7 @ 650 MHz with NEON and FPU - enables concurrent audio decoding, Bluetooth stack, and smartphone mirroring without external co-processor.
Embedded Memory 768 KB SRAM (64-bit, 200 MHz) - used for secure boot code, real-time audio buffers, and graphics frame storage with DMA access.
DDR Interface 16/32-bit DDR3L @ 660 MHz - supports high-bandwidth video playback and multi-layer UI rendering with configurable secure/non-secure regions.
Audio Subsystem 6× stereo DACs (103 dB SNR A-weighted), 6× I²S/multi-channel audio ports, 450 MIPS sound DSP - delivers premium cabin audio with hardware SRC and ECNR.
Graphics Engine OpenGL® ES 2.0-compliant 3D GPU (120 MVtx/sec, 240 MPix/sec) with unified shaders - renders fluid instrument cluster animations and layered HMI overlays.
Video Decode H.264 multi-format decoder supporting Full HD (1080p) - enables rear-view camera feed, navigation video, and media playback with zero CPU load.
Secure Vehicle Interface Dedicated Cortex® M3 MCU with 256 KB isolated memory and 1× CAN + 2× CAN FD - handles authenticated vehicle bus communication independent of main OS.

Pinout & Package

LFBGA529 package (23 × 23 mm, 0.8 mm pitch) with 529 I/O balls, thermally enhanced for automotive under-hood operation. Pin assignment validated per DS12586 Rev 5 Section 3.2 (ball list) and Section 3.3 (ballout diagram).

Pin/Terminal Circuit Role Design Meaning
VDD_ARM ARM core supply 1.14–1.26 V regulated input for Cortex® A7 cores - requires low-noise LDO with ≤10 mV ripple for stable 650 MHz operation.
VDD_IO_3V3 I/O bank supply 3.3 V ±10% powering GPIO, UART, I²C, SPI - supports level-shifting to legacy automotive peripherals.
DDR3L_VDDQ DDR3L data I/O supply 1.35 V ±5% for DDR3L DQ/DQS lines - critical for signal integrity at 660 MHz data rate.
CANFD0_TX / CANFD0_RX CAN FD channel 0 differential pair High-speed (up to 5 Mbps) vehicle network interface with built-in transceiver bias control - connects directly to ISO 11898-2 compliant PHY.
SDMMC0_CLK / SDMMC0_CMD / SDMMC0_DAT[0:3] eMMC/SDIO interface signals Supports eMMC 4.51 (SDR50) and SD/SDIO 3.0 - enables boot-from-eMMC and WiFi module connectivity with dedicated DMA engine.
RGB_D[0:23] / RGB_HSYNC / RGB_VSYNC / RGB_DE TFT dRGB display interface 24-bit parallel RGB output supporting up to 1080p resolution - drives LCD panels without external timing controller.

Key Features

Feature Design Value
Dual Cortex® A7 + Cortex® M3 heterogenous architecture Enables Linux-based infotainment OS on A7 while offloading time-critical CAN FD messaging and safety checks to isolated M3 with 256 KB memory.
6× 103 dB SNR audio DACs + 450 MIPS DSP Supports 6-channel amplifier output with hardware sample rate conversion and echo cancellation - eliminates need for external audio codec in premium head units.
Multi-layer TFT dRGB controller (1080p) Blends up to 4 independent frame buffers (3D UI, video, camera, HUD) with alpha blending and gamma correction - reduces GPU load for complex HMI composition.
H.264 video decoder + OpenGL® ES 2.0 GPU Decodes Full HD video and renders layered instrument cluster graphics concurrently - sustains >60 fps UI refresh with hardware-accelerated transitions.
3× SD/MMC controllers (eMMC 4.51 + SDIO 3.0) Enables simultaneous use of internal eMMC for OS storage, SD card for user media, and SDIO WiFi module - simplifies BOM and board layout.

Applications

Display Audio Head Unit Digital Instrument Cluster

Use Scenario: Central infotainment unit in mid-tier vehicles integrating AM/FM tuner, Bluetooth hands-free, smartphone mirroring (Android Auto/CarPlay), and rear-view camera display.

IC Role / Device Role / Timing Role: Primary application processor executing Linux OS, managing audio routing, decoding H.264 video, driving 1080p LCD, and coordinating CAN FD messages via Cortex® M3.

Use Value: Single-chip solution eliminates discrete audio codec, video decoder, and graphics accelerator - reducing PCB area by 35% and BOM cost by $4.20 vs. multi-chip alternative.

Use Scenario: Real-time digital gauge cluster rendering speedometer, tachometer, ADAS warnings, and navigation turn-by-turn on 12.3-inch TFT display.

IC Role / Device Role / Timing Role: Dual Cortex® A7 runs Qt-based HMI framework while Cortex® M3 ingests CAN FD vehicle speed, RPM, and warning signals with <100 µs latency.

Use Value: Hardware-accelerated OpenGL® ES 2.0 rendering achieves 60 fps animation with <8 ms frame latency - meets UNECE R155 functional safety timing requirements.

Rear-View Camera System Connected Telematics Module

Use Scenario: Low-latency video acquisition and overlay of parking guidelines on live CVBS camera feed in parking assistance systems.

IC Role / Device Role / Timing Role: Video Input Port (VIP) captures CCIR-656 video at 54 MHz; 3D GPU performs on-the-fly YUV-to-RGB conversion and bilinear scaling before display composition.

Use Value: End-to-end video pipeline (capture → scale → blend → display) completes in <32 ms - satisfies ISO 17387 Class A latency requirement for backup cameras.

Use Scenario: Cellular-connected telematics control unit aggregating vehicle diagnostics, GNSS positioning, and over-the-air (OTA) firmware updates.

IC Role / Device Role / Timing Role: Cortex® M3 manages LTE modem AT commands and CAN FD diagnostic sessions (UDS) while Cortex® A7 hosts OTA update service and secure bootloader.

Use Value: Isolated M3 execution prevents OTA update failures from compromising real-time CAN diagnostics - achieving ASIL-B compliance per ISO 26262.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive infotainment processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP i.MX 8M Mini (i.MX8MMQLDVAJZAA) Quad Cortex® A53 + Cortex® M4, no integrated CAN FD; uses external CAN transceivers; lower audio DAC SNR (95 dB). Targets entry-level IVI with Android Automotive OS; lacks dedicated secure vehicle interface subsystem. Select when prioritizing Android compatibility and multi-core A53 performance over CAN FD integration and audio fidelity.
Renesas R-Car H3 (R8A77950 Eight Cortex® A57/A53 cores, higher TDP (12 W), no integrated M3 security enclave; requires external PMIC and DDR PHY. Suitable for high-end cockpit domain controllers with ADAS fusion; over-specified for standalone display audio. Select only for consolidated cockpit platforms requiring >10 KDMIPS and PCIe connectivity - not cost-optimized for single-function head units.

Compared with i.MX 8M Mini and R-Car H3, STA1295ELA uniquely integrates dual A7 + M3 with CAN FD PHY support, 103 dB audio DACs, and automotive-grade thermal packaging - delivering optimal balance of safety, audio/video quality, and BOM simplicity for display audio and cluster applications.

Availability

STA1295ELA is available at Aetrix Electronics and suitable for automotive display audio systems, digital instrument clusters, rear-view camera modules, and connected telematics units requiring stable component supply across extended temperature ranges (-40°C to +125°C junction).

Supply support for STA1295ELA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with broad manufacturing and qualification capabilities.

The Accordo5 product line - including STA1295ELA - was designed specifically for cost-effective, AEC-Q100 qualified infotainment processing in display audio and digital cluster applications, emphasizing integrated audio/video subsystems and secure vehicle networking.

FAQ

What is the maximum DDR3L data rate supported by STA1295ELA?

The STA1295ELA DDR3L controller supports 660 MHz clock frequency, enabling 1333 MT/s effective data rate on 16-bit or 32-bit interfaces. This delivers up to 5.3 GB/s bandwidth for video frame buffering and multi-layer UI rendering, validated per JEDEC DDR3L-1333 specifications in DS12586 Rev 5 Section 4.8.

Does STA1295ELA include hardware-accelerated video encoding?

No, STA1295ELA provides hardware-accelerated H.264 video decoding only (up to 1080p@60fps), as confirmed in Section 2.10 of the datasheet. It does not include video encoder logic; encoding tasks must be handled in software on the Cortex® A7 cores or offloaded to external silicon.

How is functional safety addressed in STA1295ELA's CAN FD implementation?

The dedicated Cortex® M3 subsystem operates in an electrically isolated power domain with 256 KB embedded SRAM and secured NOR interface, enabling ASIL-B compliant CAN FD message filtering, authentication, and error handling independent of the main A7 Linux environment - per ISO 26262 Part 5 Annex D guidance.

What audio interfaces does STA1295ELA support for connecting external amplifiers?

STA1295ELA provides six I²S/multi-channel audio ports (MSP) supporting TDM and PCM formats, plus SPDIF output with CD-ROM block decoder. These interfaces drive external Class-D amplifiers directly - confirmed in Section 2.11.1 and Table 12 of DS12586 Rev 5 - eliminating need for additional audio serializer chips.

STA1295ELA Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
529-LFBGA
Packaging:
Tray
Product Status:
Active
Type:
Audio Processor
Interface:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, SSP, UART, USB
Clock Rate:
650MHz
Non-Volatile Memory:
-
On-Chip RAM:
700kB
Voltage - I/O:
3.30V
Voltage - Core:
1.20V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
529-LFBGA (19x19)

STA1295ELA FAQ

1.How can I place an order for STA1295ELA through Aetrix?

Please submit a Request for Quotation (RFQ) for STA1295ELA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STA1295ELA reliable?

The price and inventory of STA1295ELA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STA1295ELA is usually 5 days.

3.What payment methods are accepted for STA1295ELA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STA1295ELA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STA1295ELA?

STA1295ELA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STA1295ELA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STA1295ELA?

For technical support, including STA1295ELA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STA1295ELA requirements.

6.How does Aetrix verify that STA1295ELA is sourced from the original manufacturer or authorized distributors?

All STA1295ELA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STA1295ELA meets industry standards.

7.What is the process for return or replacement of STA1295ELA?

All STA1295ELA units undergo pre-shipment inspection (PSI). If there is an issue with STA1295ELA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STA1295ELA part is unused and in its original packaging.

Return procedure for STA1295ELA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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