STMicroelectronics STBB2J29-R
- Part No.:
- STBB2J29-R
- Manufacturer:
- STMicroelectronics
- Package:
- 20-UFBGA, FCBGA
- Datasheet:
-
STBB2J29-R.pdf
- Description:
- IC REG BUCK BST PROG 20FLIPCHIP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STBB2J29-R from STMicroelectronics is a dual-mode buck-boost DC-DC converter delivering fixed 2.9 V / 3.4 V outputs from 2.4–5.5 V input, featuring 2.5 MHz switching, ±2% output voltage tolerance, and integrated N/P-channel MOSFETs with <350 mΩ RDS(on). It enables battery-powered memory card and cellular phone power rails where input may fall below, equal, or exceed output voltage.
For engineers reviewing the STBB2J29-R datasheet, STBB2J29-R pinout, STBB2J29-R application, or STBB2J29-R equivalent, key selection criteria include bypass mode quiescent current (≤10 µA), auto/PWM mode control via MODE pin, VSEL-based dual-output selection, and Flip Chip 20-bump (2.1 × 1.8 mm) thermal performance (RthJA = 80 °C/W).
Technical Context
The STBB2J29-R implements average current-mode control with feed-forward compensation to stabilize regulation across buck, boost, and buck-boost transition regions-especially critical when VIN ≈ VOUT. Its four internal switches (two P-ch, two N-ch) enable seamless mode transitions without external reconfiguration.
Dual operation modes are hardware-selectable: MODE pin high forces continuous PWM for optimal transient response (e.g., RF PA bursts); MODE pin low enables automatic pulse-skipping at light load, reducing Iq to 35–50 µA while maintaining ±3% output accuracy in PS mode. Bypass mode (BP high + EN high) shorts VIN to VOUT via P-ch switches, limiting Iq to ≤10 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.4 V to 5.5 V - supports single Li-ion, multi-cell alkaline/NiMH batteries without pre-regulation. |
| Output Voltage Options | 2.9 V (VSEL = GND) or 3.4 V (VSEL = VIN) - factory-trimmed, no external feedback resistors required. |
| Switching Frequency | 2.5 MHz (±0.5 MHz) - enables use of compact 1.0 µH inductors and 0603 MLCCs (e.g., 10 µF input/output caps). |
| Max Output Current | 800 mA - sustained at VIN ≥ 2.5 V, verified across temperature (-40°C to +85°C) and line/load conditions. |
| Quiescent Current | 5 µA in bypass mode - reduces battery drain during system idle; 35 µA in pulse-skipping mode at light load. |
| Efficiency | ≥90% at 50–800 mA (PWM mode, VIN = 3.6 V, VOUT = 3.4 V) - minimizes thermal rise in space-constrained mobile PCBs. |
| Output Accuracy | ±2% in PWM mode, ±3% in PS mode - guaranteed over process, temperature (-40°C to +85°C), and full load range. |
| Thermal Protection | 150°C shutdown with 20°C hysteresis - prevents latch-up during sustained overload or poor heatsinking. |
Pinout & Package
STBB2J29-R uses a Flip Chip 20-bump package (2.1 mm × 1.8 mm, 0.4 mm pitch) with exposed thermal pad on bottom side. Pin mapping is validated per STMicroelectronics DocID022745 Rev 9 (Figure 5, Table 5).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (A1, A2) | Main power input | Connects to battery anode; requires ≥10 µF ceramic cap to PGND for EMI suppression and stability. |
| VINA (A3), VINA1 (B3) | Control-stage supply | VINA powers logic; internal 100 Ω resistor links VIN→VINA1-add 1 µF cap from VINA1 to GND for noise isolation. |
| SW1 (B1, B2), SW2 (D1, D2) | Switch node interface | Connects to opposite ends of power inductor; high di/dt paths require tight loop layout and Kelvin grounding. |
| PGND (C1, C2), GND (C3, D3, E4) | Power vs. signal ground | PGND carries switch return current; GND serves analog/feedback circuits-separate planes prevent coupling into FB path. |
| VOUT (E1, E2) | Regulated output | Direct connection to load; FB pin internally shorted to VOUT for fixed versions-no external divider needed. |
| EN (A4) | Enable control | Logic-high (>1.2 V) enables regulation; logic-low (<0.4 V) shuts down IC, reducing Iq to ≤2 µA. |
| MODE (C4) | Operation mode select | High = forced PWM (best transient response); low = auto mode (pulse-skipping at light load for efficiency). |
| VSEL (D4) | Output voltage selector | GND = 2.9 V output; VIN = 3.4 V output-determines internal reference without external components. |
| BP (B4) | Bypass activation | High (>1.2 V) with EN high connects VIN directly to VOUT via P-ch switches, cutting Iq to ≤10 µA. |
| FB (E3) | Feedback input | Internally tied to VOUT in fixed versions-must not be left floating or externally loaded. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-mode regulation (PWM/auto) | Hardware-selectable via MODE pin-enables dynamic trade-off between efficiency (PS mode) and transient response (PWM mode). |
| Battery-saving bypass function | BP pin activates direct VIN→VOUT path with ≤10 µA Iq, extending standby time in memory card or modem sleep states. |
| Integrated dual-output selection | VSEL pin selects 2.9 V or 3.4 V without external resistors-reduces BOM count and layout area in dual-voltage systems. |
| Robust protection suite | Includes soft-start (400 mA initial current limit), UVLO (2.1–2.35 V threshold), thermal shutdown (150°C), and short-circuit limiting. |
| Flip Chip thermal performance | 80 °C/W junction-to-ambient (JEDEC 2s2P) enables 800 mA operation in 2.1 × 1.8 mm footprint without heatsink. |
Applications
| Memory Card Power Supply | Cellular Phone Baseband |
|---|---|
Use Scenario: Powering SD/microSD cards requiring stable 2.9 V or 3.4 V rail from declining Li-ion battery (3.0–4.2 V). IC Role / Device Role / Timing Role: Buck-boost regulator maintaining regulated output as battery voltage drops below target rail. Use Value: Eliminates need for separate LDO or charge pump; maintains card functionality down to 2.4 V battery voltage. | Use Scenario: Supplying baseband processor core voltage (2.9 V) and I/O voltage (3.4 V) in GSM/UMTS handsets. IC Role / Device Role / Timing Role: Dual-output DC-DC converter enabling independent voltage domains from single battery source. Use Value: Reduces component count versus two discrete regulators; MODE pin allows dynamic efficiency optimization during call/data bursts. |
| Portable Media Player Audio Codec | Wireless Headset PMU Subsystem |
Use Scenario: Powering stereo audio codec with strict noise requirements in battery-operated MP3 players. IC Role / Device Role / Timing Role: High-frequency (2.5 MHz) buck-boost minimizing EMI near sensitive analog audio paths. Use Value: Enables use of small 0603 capacitors and avoids audible switching noise in audio band via feed-forward control. | Use Scenario: Managing power for Bluetooth radio, sensor hub, and touch controller in ultra-compact earbuds. IC Role / Device Role / Timing Role: Primary PMU providing regulated rails and intelligent power-state control (bypass/PS/PWM). Use Value: BP pin extends battery life >2× in standby by reducing Iq from 50 µA (PS) to 5 µA (bypass) during Bluetooth advertising intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS63020DSJR | Fixed 3.3 V output only; no VSEL-selectable dual voltage; 2.5 MHz switching; 96% peak efficiency. | Lacks 2.9 V option and bypass mode-requires external circuitry for lowest-quiescent operation. | Select if single 3.3 V rail suffices and TI ecosystem support is prioritized. |
| Analog Devices ADP5070ACPZ-R7 | Adjustable output (1.2–5.5 V) via resistor divider; 1.2 MHz switching; 85% peak efficiency at 500 mA. | Requires external feedback network; lower switching frequency demands larger magnetics and caps. | Select if programmable output voltage is mandatory and size constraints are relaxed. |
Compared with TPS63020DSJR and ADP5070ACPZ-R7, STBB2J29-R uniquely combines factory-trimmed dual-output selection, sub-10 µA bypass mode, and 2.5 MHz operation in a 2.1 × 1.8 mm Flip Chip package-making it optimal for space- and battery-life-constrained dual-rail portable designs.
Availability
STBB2J29-R is available at Aetrix Electronics and suitable for memory card power supplies, cellular phone baseband subsystems, portable media player audio codecs, and wireless headset PMU subsystems requiring stable component supply across automotive-grade temperature ranges and long production lifecycles.
Supply support for STBB2J29-R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog devices for industrial, automotive, and consumer markets.
The STBB2 product line delivers highly integrated, small-footprint buck-boost converters targeting battery-powered portable electronics where input voltage varies widely and efficiency at light load is critical.
FAQ
What is the function of the VSEL pin on STBB2J29-R?
The VSEL pin selects between the two factory-programmed output voltages: pulling VSEL low (GND) configures 2.9 V output, while pulling VSEL high (VIN) selects 3.4 V output. This eliminates external feedback resistors and enables dual-rail support from a single BOM item-confirmed in Table 9 and Section 7.4 of STMicroelectronics DocID022745 Rev 9.
How does bypass mode reduce power consumption in STBB2J29-R?
Bypass mode activates when both EN and BP pins are high, turning on internal P-channel switches to directly connect VIN to VOUT. This bypasses the switching regulator entirely, reducing quiescent current to ≤10 µA-verified in Table 6 (Bypass mode Iq = 5–10 µA) and Section 7.3. It is ideal for system idle states where regulation is unnecessary.
Can STBB2J29-R operate with input voltage lower than its output voltage?
Yes. STBB2J29-R is a true buck-boost converter capable of regulating output when VIN < VOUT (e.g., 2.4 V input → 2.9 V output), VIN = VOUT, or VIN > VOUT (e.g., 4.2 V input → 3.4 V output). This is enabled by its four-switch architecture and average current-mode control, as detailed in Section 7 General Description and Figure 14 load transient waveforms.
What thermal derating applies to STBB2J29-R at 800 mA output current?
At 800 mA continuous output, STBB2J29-R requires ≤80 °C/W junction-to-ambient thermal resistance (per Table 4) to maintain TJ ≤ 150°C. On a standard JEDEC 2s2P 4-layer PCB, this allows full-load operation up to +85°C ambient-verified by thermal shutdown threshold (150°C) and hysteresis (20°C) in Section 7.5.3 and Table 6.
STBB2J29-R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 20-UFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.4V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.9V, 3.4V
- Voltage - Output (Max):
- -
- Current - Output:
- 800mA
- Frequency - Switching:
- 2.5MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-Flip-Chip (2.1x1.8)
STBB2J29-R FAQ
1.How can I place an order for STBB2J29-R through Aetrix?
Please submit a Request for Quotation (RFQ) for STBB2J29-R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STBB2J29-R reliable?
The price and inventory of STBB2J29-R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STBB2J29-R is usually 5 days.
3.What payment methods are accepted for STBB2J29-R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STBB2J29-R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STBB2J29-R?
STBB2J29-R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STBB2J29-R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STBB2J29-R?
For technical support, including STBB2J29-R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STBB2J29-R requirements.
6.How does Aetrix verify that STBB2J29-R is sourced from the original manufacturer or authorized distributors?
All STBB2J29-R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STBB2J29-R meets industry standards.
7.What is the process for return or replacement of STBB2J29-R?
All STBB2J29-R units undergo pre-shipment inspection (PSI). If there is an issue with STBB2J29-R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STBB2J29-R part is unused and in its original packaging.
Return procedure for STBB2J29-R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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