STMicroelectronics STBB2J30-R

Overview

STBB2J30-R from STMicroelectronics is a dual-mode buck-boost DC-DC converter delivering fixed 3.0 V / 3.3 V outputs from 2.4–5.5 V input, featuring 800 mA output current, 2.5 MHz switching frequency, ±2% output voltage tolerance, and integrated N/P-channel MOSFETs in a Flip Chip 20-bump (2.1 × 1.8 mm) package - used in cellular phone power rails and memory card supplies.

For engineers reviewing the STBB2J30-R datasheet, STBB2J30-R pinout, STBB2J30-R application, or STBB2J30-R equivalent, key selection criteria include dual-mode operation (auto/PWM), bypass mode quiescent current (≤5 µA), VSEL-controlled dual-output selection, and thermal shutdown with 150 °C trip point.

Technical Context

The STBB2J30-R implements average current-mode control with feed-forward compensation to maintain stability across buck, boost, and buck-boost regions - especially critical when VIN ≈ VOUT. Its four internal switches (two P-channel, two N-channel) enable seamless transition between step-down and step-up operation without external reconfiguration.

It supports three operational states via EN, BP, and MODE pins: auto mode (pulse-skipping at light load, PWM at heavy load), forced PWM mode (fixed 2.5 MHz for best transient response), and bypass mode (VIN directly connected to VOUT via P-channels, drawing ≤5 µA). Soft-start ramps current limit from 400 mA to full scale as VOUT reaches 1.0 V.

Key Specifications

Pinout & Package

STBB2J30-R uses a Flip Chip 20-bump package (0.4 mm pitch, 2.1 × 1.8 mm footprint) with exposed thermal pad on bottom side. Power and signal grounds are separated (PGND vs GND) to minimize noise coupling between switching and control circuits.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck-boost converter applications.

Compared with TPS63020DSJR and ADP5070ACPZ-R7, STBB2J30-R uniquely combines fixed dual-output selection, 800-mA capability, 2.5-MHz operation, and sub-5-µA bypass mode in a 2.1 × 1.8 mm flip-chip package - making it optimal for space-constrained, battery-sensitive portable designs requiring minimal external components.

Availability

STBB2J30-R is available at Aetrix Electronics and suitable for cellular phone baseband supplies, SD card interfaces, Bluetooth audio modules, and portable medical sensor hubs requiring stable component supply with guaranteed long-term availability.

Supply support for STBB2J30-R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog chips for automotive, industrial, and consumer markets.

The STBB2 product line delivers highly integrated, small-footprint buck-boost converters targeting battery-powered portable electronics where input voltage varies across the output range - emphasizing efficiency, size, and ease of integration.

FAQ

What is the recommended inductor value and type for STBB2J30-R?

A 1.0 µH shielded power inductor (e.g., Murata LQH3NPN1R0NM0 or TDK VLS252010ET1R0N) is specified for optimal performance. It must handle ≥2.7 A peak current, have low DC resistance (<80 mΩ), and be placed close to SW1/SW2 pins with short, wide traces to minimize EMI and voltage spikes.

How does the VSEL pin determine output voltage in STBB2J30-R?

VSEL is a logic input: grounding it selects 3.0 V output; pulling it to VIN (or ≥1.2 V) selects 3.3 V output. The pin must be actively driven - leaving it floating violates absolute maximum ratings and causes undefined behavior. No external resistors are needed; internal trimming sets both voltages.

Can STBB2J30-R operate with input voltage equal to output voltage?

Yes - the STBB2J30-R is specifically designed for buck-boost operation where VIN can be higher than, lower than, or equal to VOUT. When VIN ≈ VOUT (e.g., 3.3 V battery powering 3.3 V rail), its feed-forward control and average current-mode architecture maintain tight regulation and fast transient response without mode switching artifacts.

What happens during thermal shutdown, and how does recovery work?

When junction temperature exceeds 150 °C, internal thermal protection disables switching and holds EN-active state. The device remains latched off until temperature falls by ≥20 °C (hysteresis), then automatically resumes normal operation. No external reset is required, and soft-start re-engages to prevent inrush current on recovery.