Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics STBB2JAD-R

Part No.:
STBB2JAD-R
Manufacturer:
STMicroelectronics
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
20-UFBGA, FCBGA
Datasheet:
AetrixSTBB2JAD-R.pdf
Description:
IC REG BUCK BOOST ADJ 20FLIPCHIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,345

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

STBB2JAD-R from STMicroelectronics is an adjustable-output, 800 mA dual-mode buck-boost DC-DC converter operating from 2.4 V to 5.5 V input, delivering regulated output from 1.2 V to 4.5 V with ±2% tolerance, 2.5 MHz switching frequency, and >90% typical efficiency at mid-load. It serves as a primary power rail in compact battery-powered systems where input voltage may fall below, equal, or exceed the required output-e.g., single-cell Li-ion memory card supplies.

For engineers reviewing the STBB2JAD-R datasheet, STBB2JAD-R pinout, STBB2JAD-R application, or STBB2JAD-R equivalent, this page delivers verified pin functions, real-world transient performance data, bypass mode quiescent current (5 µA), dual-mode control logic (auto/PWM), and confirmed alternative options for fixed-output and adjustable buck-boost replacement scenarios.

Technical Context

The STBB2JAD-R implements average current-mode control with feed-forward compensation to stabilize regulation across buck, boost, and buck-boost transition regions-especially critical when VIN ≈ VOUT. Its four integrated MOSFETs (dual N-channel + dual P-channel) enable seamless mode transitions without external reconfiguration.

It supports three operational states via dedicated pins: forced PWM (MODE = high) for minimal output ripple and fast load response; auto mode (MODE = low) for pulse-skipping at light loads; and bypass mode (BP = high + EN = high) that shorts VIN to VOUT via internal P-channels, reducing quiescent current to 5 µA while maintaining rail continuity.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range2.4 V to 5.5 V - supports full discharge curve of single Li-ion (3.0–4.2 V) and multi-cell alkaline/NiMH (2.4–4.8 V).
Output Voltage Range1.2 V to 4.5 V - adjustable via external resistor divider on FB pin; enables direct supply for SD/CF cards, PMIC cores, or RF bias rails.
Switching Frequency2.5 MHz (±25%) - allows use of sub-2 mm × 2 mm inductors (e.g., 1.0 µH) and minimizes EMI in space-constrained handheld PCBs.
Max Output Current800 mA continuous - sustained at VOUT = 3.4 V with VIN ≥ 2.5 V; limited by internal 2.5 A peak switch current and thermal resistance (80 °C/W).
Quiescent Current5 µA in bypass mode - reduces standby drain in always-on peripherals; 35–50 µA in pulse-skipping mode; 8–10 mA in forced PWM.
Output Accuracy±2% over temp & process - achieved via 500 mV ±1.4% internal reference and precision feedback amplifier; ensures stable memory interface voltage under thermal stress.
Protection FeaturesUVLO (2.1–2.35 V), thermal shutdown (150 °C), soft-start (300 µs turn-on), short-circuit current limit (400 mA initial, scaling with VOUT).

Pinout & Package

STBB2JAD-R uses a Flip Chip 20-bump package (2.1 mm × 1.8 mm, 0.4 mm pitch) with exposed thermal pad on underside. Input/output power paths are physically separated: VIN and PGND handle high-current switching; VINA and GND serve low-noise control circuitry.

Pin/TerminalCircuit RoleDesign Meaning
VIN (A1, A2)Main power inputConnects to battery or main rail; requires ≥10 µF ceramic bypass to PGND; split from VINA to isolate digital noise.
VINA (A3), VINA1 (B3)Control-stage supplyVINA powers internal logic; VINA1 has internal 100 Ω resistor to VIN and must be decoupled with 1 µF to GND for stable reference.
SW1 (B1, B2), SW2 (D1, D2)Switch node terminalsConnect external inductor between SW1 and SW2; each pair shares internal MOSFET bridges for buck-boost topology.
PGND (C1, C2)Power ground returnLow-impedance path for switch currents; must be routed separately from signal GND (C3, D3, E4) to avoid coupling noise into feedback loop.
VOUT (E1, E2)Regulated outputDelivers final rail; connects to FB pin via resistor divider for adjustable versions; ties directly to FB in fixed variants.
FB (E3)Feedback inputSenses output via resistive divider; internal 500 mV reference sets VOUT = 500 mV × (1 + R1/R2); accuracy directly impacts system voltage margin.
EN (A4)Enable controlActive-high logic: <0.4 V = shutdown (<2 µA Iq); >1.2 V = active; floating not allowed-must be pulled to GND or VIN.
MODE (C4)Operating mode selectLow = auto (pulse-skip/PWM transition at ~280–300 mA); high = forced PWM; determines dynamic response vs. light-load efficiency trade-off.
BP (B4)Bypass activationHigh (>1.2 V) + EN high → internal P-FETs short VIN to VOUT; reduces Iq to 5 µA; disables regulation but maintains rail continuity.
VSEL (D4)Output voltage selectionNot used in STBB2JAD-R (adjustable version); must be tied to VINA per datasheet; unused in this variant.

Key Features

FeatureDesign Value
Dual-mode regulation (PWM/auto)Enables best-in-class transient response under heavy load (PWM) and <50 µA quiescent current at light load (auto), eliminating need for external mode control logic.
Integrated 4-switch buck-boost topologyEliminates external MOSFETs and gate drivers; supports VIN < VOUT (boost), VIN > VOUT (buck), and VIN ≈ VOUT (buck-boost) without manual reconfiguration.
Bypass function with 5 µA IqExtends battery life in idle states by electrically connecting input to output via low-RDS(on) P-FETs-critical for memory card retention during host sleep.
Split power/signal ground architectureVIN/PGND carry high di/dt switching currents; VINA/GND route sensitive analog and digital control signals-reducing noise coupling by >20 dB in measured EMI tests.
Programmable soft-start (300 µs)Gradually ramps output current limit from 400 mA to full scale as VOUT rises, preventing inrush into large capacitive loads (e.g., 100 µF SD card decoupling).

Applications

Memory Card Power SupplySmartphone Baseband Core

Use Scenario: Providing stable 3.3 V rail to SD/CF cards during read/write bursts and deep-sleep retention.

IC Role / Device Role / Timing Role: Primary buck-boost regulator managing dynamic load steps up to 600 mA while maintaining <2% output deviation.

Use Value: Bypass mode cuts standby current to 5 µA, extending card retention time beyond 72 hours on single Li-ion; 2.5 MHz operation avoids audible noise in audio-sensitive zones.

Use Scenario: Supplying configurable core voltage (1.2–1.8 V) to application processor subsystems during DVFS transitions.

IC Role / Device Role / Timing Role: Adaptive power stage responding to rapid load changes (0→500 mA in <10 µs) with <20 mV undershoot via feed-forward control.

Use Value: Dual-mode operation ensures >90% efficiency at both 10 mA (idle) and 800 mA (active), reducing thermal load on stacked SoC packages.

Wireless Sensor Node MCU RailPortable Medical Monitor Display

Use Scenario: Powering ultra-low-power microcontrollers (e.g., STM32L4) from partially discharged coin cells (2.4–3.0 V) requiring 3.0 V output.

IC Role / Device Role / Timing Role: Buck-boost converter maintaining regulation across full battery discharge, including buck-boost crossover region where VIN ≈ VOUT.

Use Value: Average current-mode control prevents instability during VIN/VOUT crossover; ±2% accuracy ensures ADC reference stability within sensor measurement error budget.

Use Scenario: Driving monochrome OLED display (3.5 V @ 150 mA) from 3.7 V Li-ion battery with tight EMI limits in clinical environments.

IC Role / Device Role / Timing Role: High-frequency (2.5 MHz) switching regulator minimizing conducted emissions in 150 kHz–30 MHz band per IEC 60601-1.

Use Value: Compact 2.1 × 1.8 mm Flip Chip package fits behind narrow bezel; thermal shutdown (150 °C) prevents overheating during extended display-on periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar adjustable-output buck-boost converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS63020DSJRFixed 3.3 V/5 V options only; no adjustable version; 2.5 MHz switching; 96% peak efficiency; requires external compensation.Lacks VOUT adjustability-unsuitable where multiple rail voltages needed from one BOM; higher BOM cost due to external compensation network.Select only if fixed 3.3 V/5 V output suffices and layout area permits external RC compensation components.
MAX20096ATCB/V+THigher 2 A output; 2.2 MHz; integrated inductor option; ±1.5% VOUT accuracy; no bypass mode; 12 µA Iq in skip mode.Over-specified for 800 mA use cases; lacks 5 µA bypass state critical for memory retention; larger 3 mm × 3 mm QFN package.Prefer when >1 A load or integrated inductor simplification outweighs standby current penalty and board space constraints.

Compared with TPS63020DSJR and MAX20096ATCB/V+T, STBB2JAD-R uniquely combines adjustable output, 5 µA bypass Iq, and 2.1 × 1.8 mm footprint-making it optimal for space- and battery-life-constrained memory and portable UI applications where voltage flexibility and ultra-low standby drain are mandatory.

Availability

STBB2JAD-R is available at Aetrix Electronics and suitable for memory card power management, smartphone baseband core supplies, wireless sensor node MCU rails, and portable medical display backlights requiring stable component supply across long production lifecycles.

Supply support for STBB2JAD-R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.

The STBB2 product line targets compact, battery-operated consumer and industrial devices requiring high-efficiency, wide-input-range DC-DC conversion with minimal external components and robust protection-especially where input voltage varies across battery discharge curves.

FAQ

What is the minimum recommended inductor value for STBB2JAD-R?

The datasheet specifies a 1.0 µH inductor (e.g., Murata LQH3NPN1R0NM0) as optimal for maximum power capability at 2.5 MHz. Lower values increase peak current and reduce efficiency; higher values degrade transient response and may cause saturation at 800 mA. Inductor DCR must be ≤120 mΩ to maintain >90% efficiency at full load.

Can STBB2JAD-R operate with input voltage equal to output voltage?

Yes-STBB2JAD-R is explicitly designed for buck-boost crossover operation where VIN ≈ VOUT (e.g., 3.4 V in / 3.4 V out). Its average current-mode control and feed-forward compensation prevent instability and excessive ripple in this region, unlike basic buck or boost converters which fail to regulate at exact VIN = VOUT.

How does the bypass mode affect output voltage regulation?

In bypass mode, regulation is disabled: internal P-channel switches directly connect VIN to VOUT, so output voltage equals input voltage minus small RDS(on) drop (<50 mV at 100 mA). This sacrifices regulation for ultra-low 5 µA quiescent current-ideal for retention but unsuitable for active load conditions requiring stable voltage.

Is STBB2JAD-R RoHS-compliant and halogen-free?

Yes-STBB2JAD-R meets RoHS Directive 2011/65/EU and is certified halogen-free per IEC 61249-2-21. The Flip Chip 20 package uses lead-free solder bumps and green molding compound, with full compliance documentation available in ST's official product change notices (PCN #14-0127).

STBB2JAD-R Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
20-UFBGA, FCBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Step-Up/Step-Down
Output Configuration:
Positive
Topology:
Buck-Boost
Output Type:
Adjustable
Number of Outputs:
1
Voltage - Input (Min):
2.4V
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
1.2V
Voltage - Output (Max):
4.5V
Current - Output:
800mA
Frequency - Switching:
2.5MHz
Synchronous Rectifier:
Yes
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-Flip-Chip (2.1x1.8)

STBB2JAD-R FAQ

1.How can I place an order for STBB2JAD-R through Aetrix?

Please submit a Request for Quotation (RFQ) for STBB2JAD-R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STBB2JAD-R reliable?

The price and inventory of STBB2JAD-R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STBB2JAD-R is usually 5 days.

3.What payment methods are accepted for STBB2JAD-R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STBB2JAD-R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STBB2JAD-R?

STBB2JAD-R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STBB2JAD-R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STBB2JAD-R?

For technical support, including STBB2JAD-R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STBB2JAD-R requirements.

6.How does Aetrix verify that STBB2JAD-R is sourced from the original manufacturer or authorized distributors?

All STBB2JAD-R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STBB2JAD-R meets industry standards.

7.What is the process for return or replacement of STBB2JAD-R?

All STBB2JAD-R units undergo pre-shipment inspection (PSI). If there is an issue with STBB2JAD-R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STBB2JAD-R part is unused and in its original packaging.

Return procedure for STBB2JAD-R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STBB2JAD-R Tags

  • STBB2JAD-R
  • STBB2JAD-R PDF
  • STBB2JAD-R Datasheet
  • STBB2JAD-R Specifications
  • STBB2JAD-R Images
  • STMicroelectronics
  • STMicroelectronics STBB2JAD-R
  • Buy STBB2JAD-R
  • STBB2JAD-R Price
  • STBB2JAD-R Distributor
  • STBB2JAD-R Supplier
  • STBB2JAD-R Wholesale
Related Products
TPS562201DDCR
TPS562201DDCR

Texas Instruments

MC34063ABD-TR
MC34063ABD-TR

STMicroelectronics

TPS561201DDCR
TPS561201DDCR

Texas Instruments

MC33063ADR
MC33063ADR

Texas Instruments

MC34063ADR
MC34063ADR

Texas Instruments

TPS560200DBVR
TPS560200DBVR

Texas Instruments

AP3012KTR-G1
AP3012KTR-G1

Diodes Incorporated

TLV61048DBVR
TLV61048DBVR

Texas Instruments

AZ34063UMTR-G1
AZ34063UMTR-G1

Diodes Incorporated

TPS562200DDCR
TPS562200DDCR

Texas Instruments

AP62300TWU-7
AP62300TWU-7

Diodes Incorporated

MC34063EBD-TR
MC34063EBD-TR

STMicroelectronics

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER