STMicroelectronics STBB3JCCR
- Part No.:
- STBB3JCCR
- Manufacturer:
- STMicroelectronics
- Package:
- 20-UFBGA, FCBGA
- Datasheet:
-
STBB3JCCR.pdf
- Description:
- IC REG BCK BST ADJ 2A 20FLIPCHIP
- Quantity:
- Payment:

- Shipping:

Inventory:1,497
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STBB3JCCR from STMicroelectronics is a 2 A, high-efficiency single-inductor buck-boost DC-DC converter and high-brightness white LED driver in Flip Chip 20 (2.5 × 1.75 mm) package. It operates across 1.8–5.5 V input, delivers adjustable 1.2–5.5 V output, supports auto mode transition between buck/boost, and achieves >94% typical efficiency at 3.3 VOUT - used in smartphones and digital cameras for battery-voltage-agile power rails and HB WLED backlighting.
For engineers reviewing the STBB3JCCR datasheet, STBB3JCCR pinout, STBB3JCCR application, or STBB3JCCR equivalent, key selection criteria include its 100 mV feedback threshold, 2.0 MHz fixed switching frequency (extendable to 2.4 MHz), <50 µA quiescent current, load disconnect during shutdown, and dual-mode operation enabling stable regulation across Li-ion, alkaline, and Ni-MH battery discharge curves.
Technical Context
The STBB3JCCR integrates four internal MOSFETs (2 P-channel + 2 N-channel) to enable seamless buck-boost topology with single inductor, eliminating need for separate buck and boost stages. Its peak-current-mode control ensures stability across wide VIN/VOUT ratios, including VIN ≈ VOUT "crossover" region where conventional converters suffer poor transient response.
It features split power/ground routing (VIN_SW, PGND, GND) to minimize noise coupling between power switches and analog control circuitry, and includes feed-forward compensation optimized for line/load transients in battery-powered systems. The MODE/SYNC pin enables either automatic pulse-skipping (PS) at light load or forced PWM for constant-frequency dynamic performance - mandatory high logic for HB WLED constant-current operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input voltage range | 1.8 V to 5.5 V - supports full discharge of single-cell Li-ion (2.7–4.2 V), two/three-cell alkaline/Ni-MH (2.0–4.5 V), and memory card supply rails. |
| Output voltage range | 1.2 V to 5.5 V - programmable via external resistor divider on FB pin; enables direct replacement of multiple fixed-output regulators. |
| Max output current | 2 A @ 3.3 VOUT in buck mode (VIN = 3.6–5.5 V); 800 mA @ 3.3 VOUT in boost mode (VIN ≥ 2.0 V) - defines usable power envelope per operating mode. |
| Feedback voltage | 100 mV ±10 mV - low VFB reduces resistive divider power loss and improves accuracy under light-load PS mode. |
| Switching frequency | 2.0 MHz fixed (typ.), up to 2.4 MHz sync-capable - enables compact 1.5 µH inductor and small ceramic capacitors; avoids AM radio band. |
| Quiescent current | <50 µA - extends battery life in always-on or standby subsystems (e.g., camera sensor bias, touchscreen controller). |
| Shutdown current | <1 µA - ensures negligible drain during system sleep or battery removal. |
Pinout & Package
STBB3JCCR is housed in Flip Chip 20 bump package (2.5 × 1.75 mm, 0.4 mm pitch), with solder bumps on bottom side for direct PCB mounting and optimal thermal path to ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VOUT (A1–A3) | Regulated output node | High-current output pad; connects to output capacitor and load; shared across all four internal switches. |
| SW1 (D1–D3), SW2 (B1–B3) | Switching nodes | Internal H-bridge connection points; inductor placed between SW1 and SW2; requires low-inductance layout. |
| PGND (C1–C3) | Power ground return | Low-impedance return path for switch currents; must be connected directly to power ground plane, separate from signal GND. |
| VIN_SW (E1–E3) | Main power input | Supplies energy to power switches; decoupled with ≥10 µF ceramic capacitor near package. |
| VIN_A (C4) | Analog supply input | Powers control circuitry; requires dedicated 100 nF bypass capacitor to GND for noise immunity. |
| EN (E4) | Enable control | Active-high logic input; <0.4 V disables device with load disconnect; >1.2 V enables with soft-start. |
| MODE/SYNC (D4) | Mode selection & clock sync | Low = auto PS/PWM transition; high = forced PWM (required for HB WLED); external square wave synchronizes oscillator. |
| FB (A4) | Feedback input | 100 mV reference input; connects to resistor divider from VOUT to set output voltage or LED current sense resistor. |
| GND (B4) | Signal ground reference | Reference for EN, MODE, FB pins; must be routed separately from PGND and tied at single point near IC. |
Key Features
| Feature | Design Value |
|---|---|
| Single-inductor buck-boost architecture | Eliminates need for separate buck + boost converters; reduces BOM count, board area, and EMI sources in space-constrained portable devices. |
| Auto mode transition | Seamlessly switches between buck, buck-boost, and boost regions without output disturbance - critical for battery-powered systems with varying VIN. |
| HB WLED constant-current capability | Configurable as high-brightness LED driver using FB pin for current-sense feedback; MODE pin forced high ensures fast dimming response and stable current regulation. |
| Split VIN and ground routing | VIN_SW/PGND handle high di/dt switch currents; VIN_A/GND isolate sensitive analog control - minimizes ground bounce and improves PSRR. |
| Integrated protection suite | Includes undervoltage lockout (1.5–1.7 V), overtemperature shutdown, cycle-by-cycle current limit (2.3–2.7 A peak), and soft-start - enables robust, maintenance-free operation. |
Applications
| Smartphone Power Management | Digital Camera Backlight Driver |
|---|---|
|
Use Scenario: Regulating 3.3 V rail for image sensor, ISP, and touch controller from single-cell Li-ion battery (2.8–4.2 V). IC Role / Device Role / Timing Role: Buck-boost DC-DC converter maintaining stable output despite battery voltage crossing VOUT during discharge. Use Value: Eliminates need for pre-regulator or dual-stage conversion; >94% efficiency preserves battery runtime; 2 MHz switching enables ultra-compact 0603 passives. |
Use Scenario: Driving 8–12 white LEDs in series for LCD backlight in compact digital camera. IC Role / Device Role / Timing Role: Constant-current HB WLED driver with PWM dimming support and fast transient response to exposure changes. Use Value: MODE pin forced high enables full PWM mode for flicker-free 100 Hz dimming; 100 mV FB threshold improves current-sense accuracy at low LED currents. |
| Memory Card Supply | Tablet System Rail Generator |
|
Use Scenario: Generating 1.8 V or 3.3 V supply for SD/microSD card interface from variable alkaline/Ni-MH source (2.0–4.5 V). IC Role / Device Role / Timing Role: Adjustable-output buck-boost regulator with load disconnect during card ejection or sleep. Use Value: Shutdown current <1 µA prevents battery drain when card is unmounted; soft-start prevents inrush into card's internal LDOs. |
Use Scenario: Providing 1.2 V core voltage for ARM Cortex-A processor and 3.3 V I/O rail from shared Li-Po battery pack. IC Role / Device Role / Timing Role: Dual-rail generator using two STBB3JCCR units - one for core, one for I/O - each independently adjustable and mode-controlled. Use Value: Independent EN pins allow staggered power-up sequencing; <50 µA IQ extends standby time in always-connected tablet modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost DC-DC converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS63020DSJR | 2 A continuous output, 1.8–5.5 V input, but uses 3.5 MHz switching and requires external compensation; no integrated HB WLED current-sense mode. | Lacks native constant-current LED driver configuration; requires external op-amp and sense resistor for WLED use. | Prefer when higher switching frequency is needed for smallest inductors, and LED driving is not required. |
| Analog Devices ADP5070ACPZ-R7 | 1.2 A output, 2.85–15 V input, inverting/non-inverting configurable; fixed 1.2 MHz frequency; no auto buck-boost transition logic. | Requires manual mode selection; less suited for battery-input systems with wide VIN variation across discharge curve. | Prefer for industrial or wired applications with stable input and need for negative/positive dual outputs. |
Compared with TPS63020DSJR and ADP5070ACPZ-R7, STBB3JCCR uniquely combines 2 A buck-boost capability, 100 mV FB for precision current sensing, auto mode transition, and integrated HB WLED driver functionality - making it optimal for portable consumer devices requiring both system rail generation and display backlighting from a single battery source.
Availability
STBB3JCCR is available at Aetrix Electronics and suitable for smartphone power management, digital camera backlighting, memory card supply, and tablet system rail generation requiring stable component supply, long-lifecycle availability, and automotive-grade reliability screening.
Supply support for STBB3JCCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.
The STBB3JCC belongs to ST's high-efficiency power conversion portfolio targeting portable and battery-powered applications; it was engineered specifically to solve voltage-crossover challenges in single-cell Li-ion and multi-cell alkaline systems while integrating LED driver functionality.
FAQ
What is the recommended inductor value and type for STBB3JCCR?
STMicroelectronics specifies a 1.5 µH shielded power inductor (e.g., Coilcraft XFL4020-152MEB or TDK VLF403215MT-1R5N) rated for ≥3 A saturation current. Inductor DCR must be minimized to preserve efficiency, and shielding is required to suppress radiated EMI from the high-di/dt switching nodes SW1 and SW2.
How does the MODE pin affect HB WLED driver operation?
When MODE is pulled high (>1.2 V), STBB3JCCR operates exclusively in fixed-frequency PWM mode - essential for stable constant-current regulation and clean 100 Hz PWM dimming of white LEDs. In auto mode (MODE low), pulse-skipping causes current ripple and audible noise, degrading LED brightness consistency and user experience.
Can STBB3JCCR drive multiple parallel LED strings?
No - STBB3JCCR is designed for single-string HB WLED operation using FB pin feedback. Driving parallel strings requires external current-matching circuitry (e.g., individual sense resistors + op-amps) due to forward voltage mismatch; ST recommends series string configuration for uniform current distribution and thermal stability.
What layout practices prevent instability or EMI in STBB3JCCR designs?
Key practices include: (1) placing VIN_SW and PGND pads directly over solid internal ground plane; (2) routing SW1/SW2 traces as short, wide, symmetric copper pours; (3) separating analog (VIN_A, FB, GND) and power (VIN_SW, PGND, VOUT) ground nets, joined at single point near IC; (4) locating 100 nF VIN_A bypass capacitor <2 mm from C4 pin.
STBB3JCCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 20-UFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 1.8V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- 5.5V
- Current - Output:
- 2A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-Flip-Chip (2.52x1.76)
STBB3JCCR FAQ
1.How can I place an order for STBB3JCCR through Aetrix?
Please submit a Request for Quotation (RFQ) for STBB3JCCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STBB3JCCR reliable?
The price and inventory of STBB3JCCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STBB3JCCR is usually 5 days.
3.What payment methods are accepted for STBB3JCCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STBB3JCCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STBB3JCCR?
STBB3JCCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STBB3JCCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STBB3JCCR?
For technical support, including STBB3JCCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STBB3JCCR requirements.
6.How does Aetrix verify that STBB3JCCR is sourced from the original manufacturer or authorized distributors?
All STBB3JCCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STBB3JCCR meets industry standards.
7.What is the process for return or replacement of STBB3JCCR?
All STBB3JCCR units undergo pre-shipment inspection (PSI). If there is an issue with STBB3JCCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STBB3JCCR part is unused and in its original packaging.
Return procedure for STBB3JCCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STBB3JCCR Tags

-
TPS562201DDCR
Texas Instruments

-
MC34063ABD-TR
STMicroelectronics

-
TPS561201DDCR
Texas Instruments

-
MC33063ADR
Texas Instruments

-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments

-
AP3012KTR-G1
Diodes Incorporated

-
TLV61048DBVR
Texas Instruments

-
AZ34063UMTR-G1
Diodes Incorporated

-
TPS562200DDCR
Texas Instruments

-
AP62300TWU-7
Diodes Incorporated

-
MC34063EBD-TR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

