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STMicroelectronics STBB3JR
- Part No.:
- STBB3JR
- Manufacturer:
- STMicroelectronics
- Package:
- 20-UFBGA, FCBGA
- Datasheet:
-
STBB3JR.pdf
- Description:
- IC REG BCK BST ADJ 2A 20FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:3,052
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Product details
Overview
STBB3JR from STMicroelectronics is a high-efficiency, single-inductor buck-boost DC-DC converter supporting 1.8 V to 5.5 V input and adjustable 1.2 V to 5.5 V output, delivering up to 2 A in buck mode (VIN ≥ 3.6 V) and 800 mA in boost mode (VIN = 2.0 V), with >94% typical efficiency and automatic buck/boost transition-used in Li-ion–powered smartphones and digital cameras.
For engineers reviewing the STBB3JR datasheet, STBB3JR pinout, STBB3JR application, or STBB3JR equivalent, this page delivers verified electrical specs, Flip Chip 20 package details, dual-mode control behavior, thermal protection implementation, and real-world transient response data for battery-powered system design.
Technical Context
The STBB3JR employs peak current mode control with integrated N- and P-channel MOSFETs (RDS(on) ≤ 300 mΩ each) to maintain regulation across input voltages both above and below the output voltage. Its feed-forward architecture optimizes transient response when VIN ≈ VOUT-critical for single-cell Li-ion systems where battery voltage drifts from 4.2 V to 2.8 V.
Dual operating modes are hardware-selectable via the MODE/SYNC pin: low logic enables auto-switching between power-save burst mode (IQ < 50 µA) and fixed-frequency PWM (2.0 MHz nominal, adjustable to 2.4 MHz); high logic forces continuous PWM for best dynamic performance. Shutdown current is <1 µA, and soft-start prevents inrush during enable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 1.8 V to 5.5 V - supports full discharge curve of single Li-ion (2.8–4.2 V) and multi-cell alkaline/Ni-MH sources. |
| Output Voltage Range | 1.2 V to 5.5 V - programmable via external FB resistor divider; ±2% DC feedback tolerance ensures tight regulation. |
| Max Output Current | 2 A at 3.3 V (buck, VIN = 3.6–5.5 V); 800 mA at 3.3 V (boost, VIN = 2.0 V) - defined by internal switch current limit (IPK = 2.5 A typ). |
| Switching Frequency | 2.0 MHz fixed (typ), adjustable 1.6–2.4 MHz via external sync signal - enables compact LC filter design and EMI control. |
| Efficiency | >94% typical at 3.3 V output - achieved via low-RDS(on) switches and optimized gate drive, critical for battery runtime. |
| Quiescent Current | <50 µA in PS mode - extends standby time in always-on portable devices like memory cards and IoT sensors. |
| Protection Features | Thermal shutdown, undervoltage lockout (VUVLO = 1.5–1.7 V), short-circuit limiting, and load disconnect during shutdown - ensures robust field operation. |
Pinout & Package
STBB3JR is housed in a Flip Chip 20-bump package (2.5 mm × 1.75 mm, 0.4 mm pitch), optimized for high-density portable PCB layouts with minimal thermal resistance (Rth(JA) = 84 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VOUT (A1–A3) | Regulated output node | High-current output pad; connects directly to output capacitor and load; multiple bumps reduce IR drop and improve thermal dissipation. |
| SW1 (D1–D3), SW2 (B1–B3) | Switch node terminals | Connect to opposite ends of power inductor; carry high di/dt switching currents; require tight layout to minimize EMI and voltage spikes. |
| PGND (C1–C3) | Power ground return | Dedicated low-impedance path for switch current return; isolated from signal ground to prevent noise coupling into control circuitry. |
| EN (E4) | Enable control input | Active-high logic: >1.2 V enables device; <0.4 V shuts down with <1 µA leakage - enables system-level power sequencing. |
| MODE/SYNC (D4) | Mode selection & sync input | Low = auto PS/PWM transition; high = forced PWM; external square wave (1.6–2.4 MHz) overrides internal oscillator for synchronized switching. |
| VIN_A (C4) | Analog supply input | Powers internal control circuitry; requires RC filter to suppress noise - decoupling improves reference stability and FB accuracy. |
| VIN_SW (E1–E3) | Power input for switches | Supplies high-side and low-side MOSFETs; separate from VIN_A to isolate noisy power paths from sensitive analog blocks. |
| GND (B4) | Signal ground reference | Reference for EN, MODE, FB, and internal comparators; must be connected to PGND at single point near IC to avoid ground bounce. |
| FB (A4) | Feedback voltage input | Monitors output via resistor divider; 500 mV nominal reference ensures precise output setting; 1 µA leakage minimizes divider error. |
Key Features
| Feature | Design Value |
|---|---|
| Single-inductor buck-boost topology | Eliminates need for separate buck and boost converters - reduces BOM count, board area, and design complexity in space-constrained devices. |
| Auto-transition between buck and boost modes | Seamlessly maintains regulation as input voltage crosses output voltage - essential for stable 3.3 V rail from fading Li-ion battery (4.2 V → 2.8 V). |
| Integrated 2.5 A peak-current switches | Combines low RDS(on) P- and N-channel MOSFETs in one die - achieves >94% efficiency without external FETs or complex gate drivers. |
| Programmable switching frequency | 2.0 MHz base frequency with 1.6–2.4 MHz external sync range - allows EMI tuning and synchronization with other system clocks. |
| Power-save mode with burst operation | Reduces quiescent current to <50 µA at light load - extends battery life in always-on peripherals like SD card readers and camera sensors. |
Applications
| Smartphone Power Management | Digital Camera Core Rail |
|---|---|
|
Use Scenario: Supplying 3.3 V core voltage to image sensor and ISP in a battery-powered smartphone with single Li-ion cell. IC Role / Device Role / Timing Role: Buck-boost regulator maintaining stable 3.3 V output while battery discharges from 4.2 V to 2.8 V. Use Value: Eliminates need for discrete buck + boost stages; auto-transition avoids brownout during voltage crossover; >94% efficiency extends talk time. |
Use Scenario: Providing regulated 3.3 V to CMOS image sensor and flash controller in compact digital camera. IC Role / Device Role / Timing Role: Single-inductor DC-DC converter enabling fast load transient response during image capture bursts. Use Value: Feed-forward control and 2 MHz switching deliver <50 µs recovery from 100→300 mA load steps - prevents image corruption. |
| Memory Card Supply | Tablet System-on-Chip Rail |
|
Use Scenario: Powering SD/microSD card interface in portable media player with two-cell alkaline battery (2.0–3.2 V). IC Role / Device Role / Timing Role: Adjustable-output buck-boost supplying 2.85 V or 3.3 V from variable input, with PS mode for low-power card sleep states. Use Value: <50 µA quiescent current in PS mode preserves battery during card idle; shutdown current <1 µA enables full system hibernation. |
Use Scenario: Generating 1.2 V core voltage for ARM-based SoC in tablet using three-cell Ni-MH pack (3.0–4.5 V). IC Role / Device Role / Timing Role: High-current buck-boost stage delivering up to 2 A with thermal shutdown and soft-start for safe SoC boot. Use Value: Integrated overtemperature protection and 260 µs turn-on time ensure reliable SoC initialization without external supervision. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS63020DSJR | 2.5 A max output, 2.5 MHz fixed frequency, no external sync; higher IQ (25 µA vs. <50 µA) | Lacks programmable frequency sync; less suitable for EMI-sensitive multi-rail systems requiring clock alignment | Prefer when highest output current is required and sync is unnecessary; same Flip Chip 20 footprint but different pinout. |
| Analog Devices ADP5070ACPZ-R7 | 1.2 A max output, 1.2 MHz fixed frequency, no auto buck-boost transition; requires external compensation | Not suitable for wide-VIN applications crossing VOUT; limited to boost-only or buck-only configurations | Select only for lower-current, cost-sensitive designs where dual-mode operation is not needed and layout space permits external compensation. |
Compared with TPS63020DSJR and ADP5070ACPZ-R7, STBB3JR uniquely combines 2 A capability, 2 MHz sync-adjustable switching, true auto-transition, and sub-50 µA quiescent current in a 2.5 × 1.75 mm Flip Chip package-making it optimal for next-gen portable devices demanding efficiency, density, and dynamic responsiveness.
Availability
STBB3JR is available at Aetrix Electronics and suitable for smartphone power management, digital camera core rails, memory card supplies, and tablet SoC rails requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for STBB3JR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in power management, microcontrollers, and analog ICs for automotive, industrial, and consumer markets.
The STBB3J series targets ultra-compact, high-efficiency power conversion in battery-powered portable electronics-designed specifically to replace dual-converter solutions with a single, intelligent buck-boost IC.
FAQ
What is the minimum input voltage required for startup at 3.3 V output?
The STBB3JR requires a minimum input voltage of 1.8 V to initiate startup at 3.3 V output, with guaranteed operation beginning at 1.9 V under 600 mA load. This enables reliable boot from deeply discharged single-cell Li-ion batteries down to 2.0 V, supported by undervoltage lockout (UVLO) thresholds of 1.5–1.7 V.
How does the MODE/SYNC pin affect efficiency and transient response?
When MODE/SYNC is pulled low, the STBB3JR enters power-save mode below ~700 mA load, reducing quiescent current to <50 µA and improving light-load efficiency-but with slower transient response due to burst-mode operation. When pulled high, it operates continuously in PWM mode, delivering fastest line/load transients (<50 µs recovery) at the cost of higher light-load current.
Can STBB3JR drive a 5.0 V output from a 2.0 V input?
Yes-STBB3JR supports boost-mode operation up to 5.5 V output from inputs as low as 1.8 V. At VIN = 2.0 V, it delivers 800 mA at 3.3 V; for 5.0 V output, maximum current is reduced per efficiency and switch current limits, with typical capability of ~400 mA at 5.0 V (verified in Figure 10 of datasheet).
What thermal protection mechanisms are built into STBB3JR?
The STBB3JR integrates junction-temperature sensing with automatic thermal shutdown at 150 °C, plus overcurrent limiting (IPK = 2.5 A typ) and undervoltage lockout (1.5–1.7 V). Its Flip Chip 20 package provides 84 °C/W junction-to-ambient thermal resistance, and the split VIN_A/VIN_SW/GND/PGND architecture isolates heat-generating power switches from sensitive analog circuitry.
STBB3JR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 20-UFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 1.8V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- 5.5V
- Current - Output:
- 2A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-Flip-Chip (2.52x1.76)
STBB3JR FAQ
1.How can I place an order for STBB3JR through Aetrix?
Please submit a Request for Quotation (RFQ) for STBB3JR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STBB3JR reliable?
The price and inventory of STBB3JR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STBB3JR is usually 5 days.
3.What payment methods are accepted for STBB3JR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STBB3JR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STBB3JR?
STBB3JR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STBB3JR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STBB3JR?
For technical support, including STBB3JR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STBB3JR requirements.
6.How does Aetrix verify that STBB3JR is sourced from the original manufacturer or authorized distributors?
All STBB3JR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STBB3JR meets industry standards.
7.What is the process for return or replacement of STBB3JR?
All STBB3JR units undergo pre-shipment inspection (PSI). If there is an issue with STBB3JR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STBB3JR part is unused and in its original packaging.
Return procedure for STBB3JR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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