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STMicroelectronics STCCP27ATBR

Part No.:
STCCP27ATBR
Manufacturer:
STMicroelectronics
Category:
Specialized
Package:
25-TFBGA
Datasheet:
AetrixSTCCP27ATBR.pdf
Description:
IC INTFACE SPECIALIZED 25UTFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,140

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Product details

Overview

STCCP27ATBR from STMicroelectronics is a high-speed dual differential line receiver for Compact Camera Port (CCP) interfaces, converting subLVDS clock/data streams (up to 416 Mbps) into parallel 8-bit LVTTL/CMOS outputs with embedded frame synchronization decoding (SOF/EOF/SOL/EOL), 52 MHz output clock, and bidirectional I²C level translation. It operates from 2.65–3.6 V (VDD) and 1.65–1.95 V (VL), features 3.5 ns typical propagation delay, and supports mobile camera module-to-baseband processor links.

For engineers reviewing the STCCP27ATBR datasheet, STCCP27ATBR pinout, STCCP27ATBR application, or STCCP27ATBR equivalent, key selection criteria include subLVDS input compatibility (100 mV differential swing, 100 Ω termination), dual-supply rail operation (VDD/VL), H/V-SYNC generation logic, I²C bidirectional level-shifting capability (400 kHz), and µTFBGA25 package constraints for space-constrained imaging modules.

Technical Context

The STCCP27ATBR implements a dedicated CCP decoder architecture that recognizes 32-bit synchronization sequences (e.g., FFH 00H 00H 02H for SOF) to generate precise H-SYNC and V-SYNC signals in real time. Its differential receivers support 416 MHz input signaling rate on D+/D− and CLK+/CLK− pairs with common-mode range of 0.5–1.3 V and 10 pF load capacitance.

It integrates two independent I²C bidirectional level translators (I/OVDD/I/OVL pairs) with internal 10 kΩ pull-ups, enabling communication between 1.8 V camera sensors and 2.8 V baseband processors. Power-down control via EN pin reduces supply current to ≤10 µA, and all outputs drive ≥8 mA at 2.65 V VDD/1.8 V VL.

Key Specifications

Parameter Value and Actual Design Meaning
Input Signaling Rate 416 MHz max on D+/D− and CLK+/CLK−; enables VGA+ resolution video streaming over compact subLVDS links.
Output Clock Frequency 52 MHz max on CLK pin; matches pixel clock timing for 8-bit parallel data capture at baseband processor inputs.
Propagation Delay 6.5–8.5 ns (tpLH/tpHL); ensures tight skew control between CLK and D1–D8/H-SYNC/V-SYNC for reliable setup/hold timing.
I²C Level Translation 400 kHz max, bidirectional, with 1.8 V ↔ 2.8 V translation; supports standard-mode camera configuration without external translators.
Supply Current (Active) 3.6–7.0 mA typical (VDD=2.8 V, VL=1.8 V); balances speed and power for battery-operated mobile imaging systems.
Shutdown Current ≤10 µA with EN=GND; meets ultra-low static power requirements for display-off or sleep-state camera subsystems.
Differential Input Sensitivity 100 mV min VID with 100 Ω termination; robust against noise and impedance mismatch in flex-cable camera interconnects.

Pinout & Package

STCCP27ATBR is housed in a 3×3 mm, 25-ball µTFBGA package (RoHS-compliant, ECOPACK®), optimized for mobile camera module PCBs with fine-pitch routing and minimal footprint.

Pin/Terminal Circuit Role Design Meaning
D1–D8 Parallel Data Outputs LVTTL/CMOS outputs carrying decoded 8-bit pixel/video data; LSB-first order, synchronized to rising CLK edge.
H-SYNC / V-SYNC Frame Timing Outputs Generated from CCP sync code detection (SOF/EOF/SOL/EOL); used by baseband processor for line/frame boundary alignment.
CLK Recovered Clock Output 52 MHz LVTTL clock derived from subLVDS CLK±; strobes D1–D8 and sync signals on rising edge.
D+, D− / CLK+, CLK− Differential Inputs SubLVDS-receiver inputs with 100 Ω termination requirement; accept 416 Mbps differential data/clock streams.
EN Enable Control Input Active-high enable; pulls device into <10 µA shutdown state when low, enabling dynamic power gating in camera pipelines.
SYNC_SEL Sync Mode Select Selects enabled (VDD) or disabled (GND) sync decoding; determines whether sync codes appear on D1–D8 outputs.
I/OVDD1, I/OVDD2 I²C Bus (VDD-side) Bidirectional I²C lines referenced to VDD (2.65–3.6 V); interface with baseband processor or PMIC controllers.
I/OVL1, I/OVL2 I²C Bus (VL-side) Bidirectional I²C lines referenced to VL (1.65–1.95 V); connect directly to 1.8 V camera sensor control ports.
VDD / VL / GND Power & Reference Dual supply rails: VDD powers core logic and outputs; VL powers I/OVL and level-shift circuitry; GND provides common return.

Key Features

Feature Design Value
CCP Frame Decoder Logic Hardware-accelerated recognition of SOF/EOF/SOL/EOL 32-bit sequences to generate precise H/V-SYNC without host CPU intervention.
SubLVDS Receiver Compliance Supports 100 mV differential input swing with 100 Ω termination and 10 pF load-matches industry-standard mobile camera module outputs.
Dual-Rail I²C Level Translation Integrated bidirectional translators eliminate external level shifters; support 400 kHz I²C traffic between 1.8 V sensor and 2.8 V processor domains.
Low-Power Shutdown Mode EN-controlled shutdown draws ≤10 µA total supply current, enabling rapid entry/exit from low-power states during camera idle periods.
ESD-Protected I/O All pins rated for ±2 kV HBM ESD protection; ensures reliability in handheld device assembly and field operation environments.

Applications

Mobile Phone Camera Interface Tablet Imaging Subsystem

Use Scenario: Connecting a 5 MP CMOS image sensor to an application processor SoC via compact subLVDS link.

IC Role / Device Role / Timing Role: Receives serialized subLVDS video stream, recovers clock, decodes frame boundaries, and outputs parallel 8-bit pixel data + H/V-SYNC + CLK.

Use Value: Eliminates need for external FPGA or ASIC-based deserialization, reducing BOM cost and PCB area while maintaining 416 Mbps throughput.

Use Scenario: Integrating dual-camera modules (front/rear) into a tablet platform with shared baseband resources.

IC Role / Device Role / Timing Role: Provides deterministic latency (<9 ns) between differential input and parallel output edges, enabling synchronized multi-sensor capture.

Use Value: Enables precise inter-camera timing alignment for stereo vision or computational photography without software compensation.

Automotive Rear-View Camera Industrial Smart Camera Module

Use Scenario: Transmitting HD video from a waterproof rear-view camera over short flex cable to infotainment head unit.

IC Role / Device Role / Timing Role: Converts subLVDS signal to parallel LVTTL compatible with automotive-grade video processor inputs, including robust sync generation.

Use Value: Supports -40°C to +85°C operation and ±2 kV HBM ESD tolerance-meets AEC-Q100 stress requirements for in-vehicle deployment.

Use Scenario: Building a compact, fanless smart camera for machine vision inspection with onboard image preprocessing.

IC Role / Device Role / Timing Role: Interfaces high-speed sensor output to low-power ARM-based vision processor while providing I²C access to sensor registers.

Use Value: Dual-rail I²C translation allows direct register access to 1.8 V sensor from 3.3 V processor, avoiding discrete translator components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed differential receiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
TI SN65LVDS32 Single-channel LVDS receiver only; no CCP decoding, no I²C translation, no H/V-SYNC generation. Requires external logic for frame sync extraction and separate level shifters for sensor control. Use only if full CCP protocol handling is offloaded to FPGA or processor firmware.
ON Semi NB3N502 LVDS-to-CMOS translator with integrated PLL; lacks subLVDS input support, no sync-code recognition, no dual-supply I²C. Designed for generic clock distribution-not optimized for camera data framing or sensor control integration. Applicable only for non-CCP LVDS clock/data recovery where sync logic resides elsewhere.

Compared with SN65LVDS32 and NB3N502, STCCP27ATBR uniquely integrates CCP-specific frame decoding, dual-rail I²C translation, and subLVDS input compliance-reducing system-level component count and firmware complexity in mobile camera designs.

Availability

STCCP27ATBR is available at Aetrix Electronics and suitable for mobile phone camera modules, tablet imaging subsystems, and automotive rear-view camera interfaces requiring stable component supply and legacy design continuity.

Supply support for STCCP27ATBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, analog ICs, MEMS, and automotive-grade silicon.

The STCCP27A product line targets mobile imaging interface solutions, specifically designed to bridge high-speed subLVDS camera sensors with baseband processors while minimizing power, footprint, and system-level integration effort.

FAQ

What is the minimum differential input voltage the STCCP27ATBR can reliably detect?

The STCCP27ATBR guarantees operation with a minimum differential input voltage (VID) of 100 mV under specified conditions: RT = 100 Ω ±1%, CL = 10 pF, and common-mode voltage between 0.5 V and 1.3 V. This threshold is validated across the full operating temperature range (–40°C to +85°C) and supports robust reception in noisy mobile environments.

Can the STCCP27ATBR operate with VDD = 3.3 V and VL = 1.8 V simultaneously?

Yes. The device supports VDD from 2.65 V to 3.6 V and VL from 1.65 V to 1.95 V independently. Operation at VDD = 3.3 V and VL = 1.8 V is within specification and commonly used to interface with 3.3 V baseband processors and 1.8 V image sensors, with I²C translation fully functional across both rails.

Does the STCCP27ATBR require external termination resistors on D+/D− and CLK+/CLK− inputs?

Yes. The STCCP27ATBR requires 100 Ω differential termination (i.e., 50 Ω per line to GND) on each differential pair (D+/D−, CLK+/CLK−) as specified in the datasheet. No internal termination is provided; external resistors must be placed close to the receiver inputs to maintain signal integrity at 416 MHz.

How does SYNC_SEL affect the D1–D8 output data stream?

When SYNC_SEL = GND (disabled sync mode), D1–D8 output includes all received data-both pixel values and embedded CCP synchronization codes (e.g., SOF/EOF). When SYNC_SEL = VDD (enabled sync mode), only pixel data passes to D1–D8; sync codes are consumed internally to generate H-SYNC/V-SYNC, improving data bus cleanliness for downstream processors.

STCCP27ATBR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
25-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Receiver
Interface:
-
Voltage - Supply:
2.65V ~ 3.6V
Supplier Device Package:
25-uTFBGA (3x3)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

STCCP27ATBR FAQ

1.How can I place an order for STCCP27ATBR through Aetrix?

Please submit a Request for Quotation (RFQ) for STCCP27ATBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STCCP27ATBR reliable?

The price and inventory of STCCP27ATBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STCCP27ATBR is usually 5 days.

3.What payment methods are accepted for STCCP27ATBR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STCCP27ATBR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STCCP27ATBR?

STCCP27ATBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STCCP27ATBR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STCCP27ATBR?

For technical support, including STCCP27ATBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STCCP27ATBR requirements.

6.How does Aetrix verify that STCCP27ATBR is sourced from the original manufacturer or authorized distributors?

All STCCP27ATBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STCCP27ATBR meets industry standards.

7.What is the process for return or replacement of STCCP27ATBR?

All STCCP27ATBR units undergo pre-shipment inspection (PSI). If there is an issue with STCCP27ATBR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STCCP27ATBR part is unused and in its original packaging.

Return procedure for STCCP27ATBR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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