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STMicroelectronics STEF033JR
- Part No.:
- STEF033JR
- Manufacturer:
- STMicroelectronics
- Category:
- Current Regulation/Management
- Package:
- 9-UFBGA, FCBGA
- Datasheet:
-
STEF033JR.pdf
- Description:
- IC ELECTRONIC FUSE 9FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:1,160
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Product details
Overview
STEF033JR from STMicroelectronics is a latch-type electronic fuse optimized for 3.3 V rail protection in high-reliability storage systems. It features 2.5 A continuous current (Flip Chip), 25 mΩ typical RDS(on), 4.5 V output clamping, -40 °C to 125 °C junction operation, and thermal latch at 160 °C. Used in SSDs and HDD arrays to replace mechanical fuses with resettable overcurrent/overvoltage protection.
For engineers reviewing the STEF033JR datasheet, STEF033JR pinout, STEF033JR application, or STEF033JR equivalent, this page delivers verified electrical specs, package mapping to Flip Chip 9-bump, thermal shutdown signaling via Enable/Fault pin, soft-start control limitations, and design-meaning context for current limiting, voltage clamping, and latch-mode recovery.
Technical Context
The STEF033JR integrates an N-channel power MOSFET with precision current-sensing circuitry using a Kelvin-connected internal Sense FET. Its current-limit threshold is set externally via a resistor between I-Lim+ and Source pins, enabling programmable short-circuit (1.35 A typ.) and overload (2.5 A typ.) trip points.
It implements dual-protection logic: output voltage clamping activates when input exceeds ~4.5 V, while thermal shutdown triggers at 160 °C and holds latched until supply recycle or active Enable pin reset. The Enable/Fault pin operates as a tri-state interface-floating enables operation, grounding disables output, and intermediate voltage (0.8–1.4 V) signals thermal fault to monitoring circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Current | 2.5 A (Flip Chip package); defines max sustained load current before thermal derating begins |
| RDS(on) | 25 mΩ typ. (Flip Chip, 25 °C); determines I²R power loss and voltage drop under full load |
| Output Clamp Voltage | 4.5 V typ.; limits downstream IC stress during input overvoltage transients up to 8 V |
| Thermal Latch Threshold | 160 °C typ.; ensures irreversible shutdown during sustained overload, preventing MOSFET failure |
| Undervoltage Lockout | 2.35 V typ. turn-on threshold; prevents erratic operation during brown-out or slow-ramp power-up |
| Enable/Fault Pin Logic | Tri-state interface: floating = enabled, GND = disabled, 0.8–1.4 V = thermal fault signal |
| Operating Junction Temp | -40 °C to 125 °C; supports deployment in industrial SSD enclosures and server backplanes |
Pinout & Package
STEF033JR is packaged in Flip Chip 9-bump configuration (1.19 mm × 1.19 mm, 0.4 mm pitch), optimized for high-density PCB layouts in storage modules. Exposed VCC pad provides low-inductance power entry and thermal conduction path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VOUT/Source (C1,C2,C3) | Power MOSFET source terminal | Direct connection point to protected load; Kelvin sensing node for accurate current measurement |
| I-Lim+ (A1) | Current limit reference input | Connects to external resistor that sets both short-circuit and overload current thresholds |
| En/Fault (A2) | Bi-directional enable/fault status pin | Controls device state and reports thermal fault via intermediate voltage; supports daisy-chained shutdown |
| GND (A3) | Ground reference | Return path for bias current, fault signaling, and thermal sensor reference |
| VCC (B1,B2,B3) | Positive input supply | Exposed pad tied to 3.3 V rail; primary thermal dissipation path and power input |
Key Features
| Feature | Design Value |
|---|---|
| Latching thermal protection | Prevents automatic re-engagement after fault-ensures system-level intervention before recovery |
| Kelvin current sensing | Eliminates PCB trace resistance error in current limit setting for precise 2.5 A overload trip |
| 4.5 V output clamping | Protects 3.3 V logic ICs (e.g., NAND controllers, SATA PHYs) from input surges without external TVS |
| Controlled output ramp | 1.4 ms internal dv/dt rise time prevents inrush current spikes into capacitive SSD loads |
| Tri-state Enable/Fault pin | Enables hardware-level coordination across multiple eFuses for synchronized shutdown in RAID arrays |
Applications
| SSD Power Rail Protection | HDD Array Backplane |
|---|---|
|
Use Scenario: Protecting 3.3 V VCC rail of NVMe SSD modules against hot-swap inrush and connector arcing. IC Role / Device Role / Timing Role: Series-connected electronic fuse providing current limiting, voltage clamping, and thermal latch during overloads. Use Value: Eliminates need for manual fuse replacement after field failures; maintains data integrity by cleanly disconnecting faulty drives. |
Use Scenario: Safeguarding shared 3.3 V power distribution across multi-drive enterprise HDD enclosures. IC Role / Device Role / Timing Role: Fault-isolating eFuse per drive slot, coordinated via En/Fault daisy-chain to halt entire array on single thermal event. Use Value: Prevents cascading failure; enables predictive maintenance via fault pin voltage monitoring without host CPU involvement. |
| DVD/Blu-ray Drive Motor Control | Industrial Embedded Storage |
|
Use Scenario: Securing 3.3 V logic supply feeding servo motor drivers and optical pickup ICs in optical disc drives. IC Role / Device Role / Timing Role: Overcurrent protector with fast 500 µs enable delay and 1.4 ms soft-start to avoid spindle motor startup glitches. Use Value: Suppresses false trips during high di/dt motor commutation while maintaining sub-2.5 A trip accuracy. |
Use Scenario: Providing robust 3.3 V rail protection in fanless industrial PCs with M.2 SSDs operating in extended temperature environments. IC Role / Device Role / Timing Role: High-temp-rated eFuse (125 °C TJ) with latch mode ensuring fail-safe behavior in sealed enclosures. Use Value: Guarantees no autonomous restart during thermal runaway-critical for safety-certified embedded systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar electronic fuse applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STEF033APUR | DFN10 package; auto-retry thermal response instead of latch; 3.6 A continuous rating | Suitable where automatic recovery after cooling is acceptable (e.g., consumer NAS units) | Select when board layout allows DFN10 and system firmware handles retry coordination |
| TCKE805M0L | 4.5 V clamp, 2.2 A continuous, SOT-23-6; no Enable/Fault pin or thermal latch | Basic overcurrent protection only-no fault signaling or coordinated shutdown capability | Choose only for cost-sensitive, non-critical 3.3 V rails lacking system-level monitoring |
Compared with STEF033APUR, STEF033JR offers guaranteed latch behavior and Flip Chip density but lower current rating; versus TCKE805M0L, it adds fault signaling, thermal latch, and Kelvin sensing-enabling higher reliability in mission-critical storage subsystems.
Availability
STEF033JR is available at Aetrix Electronics and suitable for solid state drives (SSD), hard disk drive (HDD) arrays, and optical disc drive power management requiring stable component supply across long-lifecycle industrial programs.
Supply support for STEF033JR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
The STEF series targets high-availability storage and computing infrastructure, delivering integrated eFuse functionality with programmable protection thresholds, fault reporting, and thermal resilience for 3.3 V system rails.
FAQ
What is the function of the En/Fault pin on STEF033JR?
The En/Fault pin serves dual roles: when left floating, it enables normal operation via internal pull-up; pulling it to GND disables the output. During thermal fault, it transitions to 0.8–1.4 V to signal the event-enabling direct connection to monitoring ICs or daisy-chaining with other STEF devices for coordinated shutdown without software intervention.
How is current limiting set on STEF033JR?
Current limiting is set by an external resistor between the I-Lim+ (A1) and VOUT/Source (C1–C3) pins. For STEF033JR, a 24 Ω resistor yields 1.35 A short-circuit limit and 2.5 A overload trip point. The device uses Kelvin sensing to reject PCB trace resistance, ensuring accurate threshold setting independent of layout parasitics.
Does STEF033JR support adjustable soft-start timing?
No-STEF033JR uses the Flip Chip 9-bump package, which omits the dv/dt pin present in DFN versions. Its output voltage ramp is fixed at ~1.4 ms (10% to 90%) and cannot be extended with external capacitance. This simplifies layout in space-constrained SSD modules but removes user-programmable inrush control.
What happens after a thermal shutdown event on STEF033JR?
STEF033JR enters a latched-off state: the power MOSFET remains open, and the En/Fault pin holds at 0.8–1.4 V. Recovery requires either cycling the VCC supply or actively pulling En/Fault below 0.5 V and releasing it. Unlike auto-retry versions, it will not self-recover-even after die cooling-ensuring deliberate system-level acknowledgment of the fault.
STEF033JR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 9-UFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Electronic Fuse
- Sensing Method:
- -
- Accuracy:
- -
- Voltage - Input:
- 3.1V ~ 8V
- Current - Output:
- 3.6A
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 9-FlipChip (1.19x1.19)
STEF033JR FAQ
1.How can I place an order for STEF033JR through Aetrix?
Please submit a Request for Quotation (RFQ) for STEF033JR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STEF033JR reliable?
The price and inventory of STEF033JR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STEF033JR is usually 5 days.
3.What payment methods are accepted for STEF033JR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STEF033JR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STEF033JR?
STEF033JR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STEF033JR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STEF033JR?
For technical support, including STEF033JR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STEF033JR requirements.
6.How does Aetrix verify that STEF033JR is sourced from the original manufacturer or authorized distributors?
All STEF033JR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STEF033JR meets industry standards.
7.What is the process for return or replacement of STEF033JR?
All STEF033JR units undergo pre-shipment inspection (PSI). If there is an issue with STEF033JR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STEF033JR part is unused and in its original packaging.
Return procedure for STEF033JR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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