STMicroelectronics STEVAL-CTM015V1

Overview

STEVAL-CTM015V1 from STMicroelectronics is a fully assembled evaluation kit for three-phase switched reluctance motor (SRM) drives, integrating a driver board (STEVAL-CTM015A1), power board (STEVAL-CTM015A2), and 1 K/W heatsink. It supports 400 V_DC bus voltage, delivers up to 1 kW output, and implements asymmetric half-bridge topology using six STGB30H60DFB IGBTs and six STTH15RQ06 diodes. The kit enables soft-chopping speed control via STM32F303CBT6 MCU firmware and supports both three-shunt resistor and insulated current sensor (ACS722LLCTR-20AU-T) current sensing.

For engineers reviewing the STEVAL-CTM015V1 datasheet, STEVAL-CTM015V1 pinout, STEVAL-CTM015V1 application, or STEVAL-CTM015V1 equivalent, this kit provides validated hardware for SRM control algorithm development, gate driver timing validation, thermal protection testing with NTC networks, and three-phase current sensing architecture comparison between shunt-based and isolated sensor topologies.

Technical Context

The kit implements an asymmetric half-bridge converter topology optimized for switched reluctance motors, where each phase uses independent high-side and low-side switching controlled by L6395D gate drivers. The STM32F303CBT6 MCU executes real-time position-based commutation logic using quadrature encoder or Hall-effect rotor sensors, with ADC sampling synchronized to PWM edges for accurate current reconstruction.

Power stage thermal management relies on an insulated metal substrate (IMS) PCB with integrated NTC sensing network and LMV331ICT comparators for overcurrent protection. Current measurement supports dual architectures: TSV991IL op-amps with 0.018 Ω shunts or ACS722LLCTR-20AU-T isolated sensors with configurable 20 kHz / 80 kHz bandwidth selection via jumper settings.

Key Specifications

Availability

STEVAL-CTM015V1 is available at Aetrix Electronics and suitable for industrial motor control prototyping, SRM algorithm validation, and power electronics curriculum labs requiring stable component supply and pre-integrated thermal/mechanical assembly.

Supply support for STEVAL-CTM015V1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, analog ICs, and MEMS sensors for industrial, automotive, and consumer applications.

This kit belongs to ST's STEVAL motor control evaluation platform family, engineered to accelerate development of field-oriented control (FOC) and reluctance-based motor drives with validated hardware reference designs and open-source firmware examples.

FAQ

What firmware is included with the STEVAL-CTM015V1?

The kit ships with soft-chopping speed control firmware preloaded on the STM32F303CBT6 MCU, supporting position-sensor-based commutation using either quadrature incremental encoders or Hall-effect sensors. Source code, configuration tools, and documentation are available via ST's official GitHub repository and UM2527 user manual.

Can the current sensing method be changed after assembly?

Yes - the driver board supports hardware-selectable current sensing via solder jumpers (JMP1–JMP3) and header options (J14–J15). Users can switch between three-shunt resistor sensing with TSV991IL op-amps or ACS722LLCTR-20AU-T insulated current sensors without PCB rework, enabling direct comparison of noise immunity and bandwidth trade-offs.

Does the kit include isolation between control and power stages?

Yes - the driver board (STEVAL-CTM015A1) and power board (STEVAL-CTM015A2) are physically separated with galvanic isolation maintained through optocoupled or transformer-coupled signal paths. Gate drive signals use L6395D's integrated bootstrap and level-shifting circuitry, while current/voltage feedback employs isolated amplifiers or differential sensing networks.

What thermal interface materials are used between the IMS board and heatsink?

The kit uses a thermally conductive interface pad (not thermal paste) between the insulated metal substrate (IMS) of the power board and the 1 K/W aluminum heatsink. This pad ensures consistent thermal resistance across the interface and eliminates assembly variability associated with paste application thickness or curing time.