STMicroelectronics STEVAL-IDB007V2

Overview

STEVAL-IDB007V2 from STMicroelectronics is a Bluetooth® Low Energy evaluation platform built around the BlueNRG-1 system-on-chip, supporting master, slave, and simultaneous dual-role operation. It integrates an LPS25HB pressure sensor, LSM6DS3 6-axis inertial module (accelerometer + gyroscope), SMA antenna connector, USB-to-serial bridge, JTAG debug interface, and three user LEDs/buttons - enabling rapid prototyping of wireless sensor node applications.

For engineers reviewing the STEVAL-IDB007V2 datasheet, STEVAL-IDB007V2 pinout, STEVAL-IDB007V2 application, or STEVAL-IDB007V2 equivalent, this board delivers verified BLE 4.2 RF performance (–88 dBm sensitivity, +8 dBm output), low-power operation (7.7 mA RX, 8.2 mA TX at 0 dBm), integrated balun (BALF-NRG-02D3), and multi-source power options (USB, battery, external supply).

Technical Context

The platform implements a complete BLE 4.2 subsystem with BlueNRG-1 SoC (ARM Cortex-M0 core, 128 KB Flash, 16 KB RAM) and companion STM32L151CBU6 microcontroller for USB bridge and sensor management. It supports concurrent BLE roles via firmware-controlled state machines and uses hardware-accelerated AES-128 encryption for secure pairing.

Sensor subsystems include I²C-connected LPS25HB (260–1260 hPa pressure, ±0.01 hPa RMS noise) and LSM6DS3 (±2/±4/±8/±16 g accelerometer full-scale, ±125/±245/±500/±1000/±2000 dps gyroscope full-scale), both with programmable interrupts and FIFO buffering for autonomous data acquisition.

Key Specifications

Availability

STEVAL-IDB007V2 is available at Aetrix Electronics and suitable for Bluetooth LE sensor node development, industrial condition monitoring, wearable device prototyping, and academic IoT curriculum requiring stable component supply and validated reference hardware.

Supply support for STEVAL-IDB007V2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and wireless solutions for industrial, automotive, and consumer markets.

The STEVAL-IDB007V2 belongs to ST's ST Evaluation Kits product line, engineered specifically to accelerate development of Bluetooth Low Energy applications using ST's BlueNRG ecosystem - emphasizing out-of-box usability, sensor fusion readiness, and interoperability with ST's STM32Cube and BlueNRG SDK tools.

FAQ

Does STEVAL-IDB007V2 support Bluetooth 5.0 or later?

No. The board is based on the BlueNRG-1 SoC, which implements Bluetooth Core Specification v4.2 only. It does not support Bluetooth 5.0 features such as long-range mode, higher throughput, or advertising extensions. Firmware updates cannot extend the underlying radio protocol stack beyond v4.2 compliance.

Can the onboard LSM6DS3 and LPS25HB be used without the BlueNRG-1?

Yes. Both sensors are connected to the STM32L151CBU6 via dedicated I²C lines (I2C2_CLK/I2C2_DAT), independent of the BlueNRG-1. The STM32 handles USB bridging and can directly read sensor registers, allowing standalone sensor data logging or custom host-side processing without BLE involvement.

What is the purpose of the BALF-NRG-02D3 balun on this board?

The BALF-NRG-02D3 is an integrated passive RF component that performs impedance matching (50 Ω to BlueNRG-1's differential RF port), single-ended conversion, and harmonic filtering. It replaces discrete matching networks, reduces PCB layout sensitivity, and ensures consistent +8 dBm output power and –88 dBm sensitivity across production units.

Is the USB interface capable of powering the BlueNRG-1 during active RF transmission?

Yes. When powered via USB Micro-B, the LDS3985PU33R LDO regulates 5 V to 3.3 V and supplies both the STM32L151 and BlueNRG-1. Measured current draw of 8.2 mA TX at 0 dBm is within the USB 2.0 specification (500 mA), ensuring reliable operation without brown-out during sustained BLE advertising or connection events.