STMicroelectronics STEVAL-IFP017V3

Overview

STEVAL-IFP017V3 from STMicroelectronics is an evaluation board for the L6362A IO-Link transceiver, supporting COM1/COM2/COM3 physical layer modes with 7–36 V operation, 300 mA drive capability, and configurable push-pull/high-side/low-side output topology. It enables robust testing of fast demagnetization, reverse polarity protection, overload cutoff, and overtemperature shutdown in industrial sensor interface applications.

For engineers reviewing the STEVAL-IFP017V3 datasheet, STEVAL-IFP017V3 pinout, STEVAL-IFP017V3 application, or STEVAL-IFP017V3 equivalent, this board provides validated IEC 61000-4-2/4-4/4-5 compliance, screw-terminal connectivity, real-time status/diagnostic LED feedback, and heatsink-integrated L6362A mounting for rapid IO-Link device prototyping and EMC validation.

Technical Context

The STEVAL-IFP017V3 implements the L6362A's full protection suite-including overcurrent cutoff with delayed response for capacitive loads, 500 mJ inductive load handling, and full reverse polarity protection on VCC, GND, OUTH, OUTL, and I/Q pins-without external components. Its floating-copper heatsink design thermally isolates the L6362A's exposed pad while maintaining electrical safety.

Board-level compliance with IEC 61000-4-2 (±8 kV contact/±15 kV air ESD), IEC 61000-4-4 (4 kV burst), and EN60947-5-2/IEC 61000-4-5 (2 kV surge) is achieved through layout-integrated filtering and grounding, enabling direct use in harsh industrial environments without add-on transient suppression.

Key Specifications

Availability

STEVAL-IFP017V3 is available at Aetrix Electronics and suitable for IO-Link sensor development, industrial fieldbus interface validation, and EMC pre-compliance testing requiring stable component supply and traceable reference hardware.

Supply support for STEVAL-IFP017V3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog/mixed-signal solutions for industrial, automotive, and consumer markets.

The STEVAL-IFP017V3 belongs to ST's IO-Link evaluation platform family, engineered to accelerate adoption of smart industrial sensors by providing turnkey, standards-compliant hardware for L6362A-based transceiver integration and system-level validation.

FAQ

What IO-Link physical layer modes does the STEVAL-IFP017V3 support?

The board supports all three standardized IO-Link physical layer modes: COM1 (1.2 kbps), COM2 (38.4 kbps), and COM3 (230.4 kbps). Mode selection is implemented via onboard jumpers per the L6362A configuration guidelines, enabling direct interoperability testing with master devices across speed classes.

How is thermal management handled on the STEVAL-IFP017V3?

The L6362A's exposed pad is soldered to an electrically floating copper area on the PCB, acting as a passive heatsink. This design provides thermal relief without grounding the pad, preserving isolation integrity while enabling sustained 300 mA operation under ambient temperatures up to 85°C.

Does the board include built-in EMC protection components?

Yes-the STEVAL-IFP017V3 achieves full IEC 61000-4-2/4-4/4-5 compliance without external TVS diodes, RC filters, or surge suppressors. Protection is realized through optimized PCB layout, ground plane segmentation, and integrated transient energy dissipation paths aligned with L6362A's internal architecture.

Can the STEVAL-IFP017V3 drive inductive loads like solenoids or valves?

Yes-it is rated for inductive loads up to 500 mJ, with active demagnetization control and overcurrent foldback. The board's delayed cutoff function prevents false triggering during initial energization, making it suitable for industrial actuators including 24 V DC solenoids and pneumatic valves.