STMicroelectronics STEVAL-IPMNM2S

Overview

STEVAL-IPMNM2S from STMicroelectronics is a compact motor control power evaluation board built around the SLLIMM-nano intelligent power module STIPNS2M50T-H, delivering up to 100 W at 1.2 A nominal current with 125–400 VDC input. It supports field-oriented control (FOC) via triple-shunt or single-shunt current sensing, Hall/encoder interface, and hardware overcurrent/temperature protection for 3-phase inverter applications.

For engineers reviewing the STEVAL-IPMNM2S datasheet, STEVAL-IPMNM2S pinout, STEVAL-IPMNM2S application, or STEVAL-IPMNM2S equivalent, this board provides verified interface compatibility with STM32-based control boards, validated three-shunt sensing network topology, integrated bootstrap/snubber capacitor layout, and WEEE/RoHS-compliant PCB design for rapid motor drive prototyping.

Technical Context

The board implements a 3-phase inverter stage using the STIPNS2M50T-H IPM - a fully integrated SMD module containing six 500 V MOSFETs, three high-voltage half-bridge gate drivers, internal temperature sensor, NTC interface, undervoltage lockout, and embedded op-amp for current sensing. It supports both single- and three-shunt configurations with selectable signal conditioning paths.

Hardware-level protection includes dedicated short-circuit detection circuitry, fault event signaling (OD/OD1), and real-time IPM junction temperature monitoring. The 32-pin motor control connector enables direct interfacing with ST's STM32 evaluation platforms, while onboard test points (TP9–TP19) and breadboard-compatible layout support flexible validation of FOC loop performance.

Key Specifications

Availability

STEVAL-IPMNM2S is available at Aetrix Electronics and suitable for motor drive development, FOC algorithm validation, and white goods inverter qualification requiring stable component supply and reference-grade layout fidelity.

Supply support for STEVAL-IPMNM2S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power ICs, sensors, and analog/mixed-signal solutions for industrial, automotive, and consumer markets.

This board belongs to ST's STEVAL motor control evaluation platform family, engineered to accelerate adoption of SLLIMM-nano IPMs by providing production-relevant thermal, layout, and protection implementation for 3-phase inverter subsystems.

FAQ

What MCU families is STEVAL-IPMNM2S compatible with?

STEVAL-IPMNM2S is designed for direct interface with ST's STM32G4, STM32F3, and STM32F4 series motor control evaluation boards via its standardized 32-pin motor connector. It supports PWM input, fault feedback, current sense outputs, and Hall/encoder signals aligned to ST's X-CUBE-MCSDK firmware stack requirements.

Does the board include bootstrap capacitors and snubber components?

Yes - the board integrates all critical passive components for inverter operation: discrete bootstrap capacitors for high-side gate driving, a snubber capacitor across the DC bus, and current-sense shunt resistors (0.33 Ω, 1 W) for each phase. These are placed per STIPNS2M50T-H layout guidelines to minimize parasitic ringing and ensure stable switching.

Can STEVAL-IPMNM2S operate in single-shunt current sensing mode?

Yes - the board supports single-shunt configuration using the internal op-amp of the STIPNS2M50T-H IPM. Jumper settings (SW9–SW16) configure signal routing and gain, and the schematic (DB3680 Fig. 4–5) shows dedicated paths for center-aligned PWM sampling and reconstruction of all three phase currents from one shunt.

Is temperature monitoring implemented via on-die sensor or external NTC?

Both - the STIPNS2M50T-H IPM includes an internal junction temperature sensor output (TSEN pin), and the board provides an NTC thermistor footprint (R37/R38) with biasing circuitry for external temperature monitoring of heatsink or motor winding. The TSEN signal is routed to the MCU interface for real-time thermal derating.