STMicroelectronics STEVAL-MKI172V1

Overview

STEVAL-MKI172V1 from STMicroelectronics is an evaluation board for the LSM303AGR ultracompact eCompass module, integrating a 3-axis accelerometer (±2/±4/±8/±16 g) and 3-axis magnetometer (±50 gauss) in a single LGA-12 package. It supports I²C (up to 3.4 MHz) and SPI interfaces, features embedded FIFO, programmable interrupts for motion/magnetic detection, and operates from 1.71 V to 3.6 V over –40 °C to +85 °C - enabling rapid prototyping of tilt-compensated compasses and orientation-aware handheld devices.

For engineers reviewing the STEVAL-MKI172V1 datasheet, STEVAL-MKI172V1 pinout, STEVAL-MKI172V1 application, or STEVAL-MKI172V1 equivalent, this page delivers verified hardware interface details, supported communication protocols (I²C/SPI), onboard sensor configuration options, interrupt routing, and direct integration guidance with STM32 Nucleo boards via Arduino UNO R3 headers.

Technical Context

The STEVAL-MKI172V1 implements a dedicated carrier board for the LSM303AGR system-in-package, providing regulated 3.3 V power, level-shifted I²C/SPI signal routing, configurable interrupt outputs (INT1/INT2), and solder jumpers for address selection (I²C SAD = 0x1E or 0x1C). It exposes all 12 LGA pins via 0.1" headers and includes test points for VDD, GND, SDA, SCL, CS, SDO, and INT signals.

Designed for plug-and-play evaluation with STM32 Nucleo development platforms, the board uses standard Arduino UNO R3 pinout mapping and supports both standalone operation (via micro-USB) and host-controlled operation (via ST-LINK/V2-1 debug interface). No external components are required to initialize or stream sensor data.

Key Specifications

Availability

STEVAL-MKI172V1 is available at Aetrix Electronics and suitable for industrial IoT sensor node development, wearable motion tracking validation, and automotive infotainment orientation testing requiring stable component supply and full production-grade evaluation hardware.

Supply support for STEVAL-MKI172V1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, sensors, power management, and analog ICs for industrial, automotive, and consumer applications.

The STEVAL-MKI172V1 belongs to ST's SensorEval family - purpose-built evaluation platforms designed to accelerate time-to-proof-of-concept for MEMS-based inertial and magnetic sensing solutions in portable and embedded systems.

FAQ

Does STEVAL-MKI172V1 require external programming hardware?

No. The board is a passive evaluation carrier for the LSM303AGR sensor IC and does not contain a microcontroller or firmware. It connects directly to host MCUs (e.g., STM32 Nucleo) via I²C or SPI. Communication and configuration are handled entirely by the host system using ST's X-CUBE-MEMS1 software expansion package or custom drivers.

Can STEVAL-MKI172V1 operate independently without a host MCU?

No. It lacks onboard processing or memory and functions solely as a sensor interface adapter. Power, clocking, and data acquisition must be provided by an external host controller. The micro-USB port supplies only 3.3 V power - no USB-to-I²C/SPI bridge is integrated.

What is the I²C slave address configuration on STEVAL-MKI172V1?

The LSM303AGR on STEVAL-MKI172V1 defaults to I²C address 0x1E. A solder jumper (JP1) allows switching to 0x1C by shorting pins 2–3, matching the SA0 pin configuration defined in the LSM303AGR datasheet. No pull-up resistors are required - onboard 4.7 kΩ resistors are pre-installed on SDA/SCL lines.

Is the LSM303AGR on STEVAL-MKI172V1 factory-calibrated?

Yes. Each LSM303AGR die undergoes factory calibration for zero-g offset, zero-gauss offset, sensitivity, and cross-axis misalignment. Calibration coefficients are stored in non-volatile memory and applied automatically during power-up. Hard-iron compensation can be further refined in-system using register offsets (e.g., OFFSET_X_REG_L_M).