STMicroelectronics STEVAL-MKI241KA

Overview

STEVAL-MKI241KA from STMicroelectronics is an evaluation kit comprising two PCBs - a main LSM6DSV16B-based DIL24 adapter board and a compact earphone-style board - designed for bone conduction verification in true wireless stereo (TWS) hearables. It integrates full LSM6DSV16B pinout, on-board decoupling (1 µF + 100 nF per supply rail), and dual interface support via STEVAL-MKIGI06A for SPI/I²C/TDM audio routing.

For engineers reviewing the STEVAL-MKI241KA datasheet, STEVAL-MKI241KA pinout, STEVAL-MKI241KA application with bone conduction sensing, or STEVAL-MKI241KA equivalent evaluation platforms, this kit delivers verified hardware integration for LSM6DSV16B sensor fusion, TDM audio synchronization (BCLK/WCLK/TDMOUT), and interrupt-driven motion event handling in compact hearable form factors.

Technical Context

The kit implements a dual-board architecture: one board serves as a standard DIL24 socket adapter for the LSM6DSV16B 6-axis IMU, while the second is a miniaturized earphone-compatible board enabling mechanical vibration coupling tests. Both boards expose identical LSM6DSV16B signal mapping including INT1/INT2, CS/SDO/SA0, SCL/SDA, and full TDM interface pins (BCLK, WCLK, TDMOUT).

It interfaces exclusively through the STEVAL-MKIGI06A bridge board to the STEVAL-MKI109D host platform (STM32-based) or X-NUCLEO-IKS4A1 expansion board, supporting MEMS Studio GUI operation and custom firmware development via standardized SWD/JTAG and USB-VCP connectivity.

Key Specifications

Availability

STEVAL-MKI241KA is available at Aetrix Electronics and suitable for true wireless stereo (TWS) hearable development, bone conduction transducer validation, and LSM6DSV16B sensor fusion prototyping requiring stable component supply and rapid lab-to-firmware iteration.

Supply support for STEVAL-MKI241KA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in MEMS sensors, microcontrollers, power management, and automotive-grade ICs.

This kit belongs to ST's Professional MEMS Tools product line, engineered specifically to accelerate evaluation and integration of ST's motion and environmental sensors in space-constrained, low-power, and audio-synchronized applications like hearables and wearables.

FAQ

Does STEVAL-MKI241KA include the LSM6DSV16B sensor?

Yes - the kit contains two physical LSM6DSV16B devices: one mounted on the DIL24 adapter board and another on the earphone-style board. Both are fully populated, powered, and routed with matching pin configurations and decoupling networks as specified in DB4938 Rev 4.

Can STEVAL-MKI241KA operate without STEVAL-MKI109D?

No - the kit lacks onboard MCU or USB interface; it requires connection via STEVAL-MKIGI06A to either STEVAL-MKI109D or X-NUCLEO-IKS4A1 to enable communication, power regulation, and MEMS Studio interaction. Standalone operation is not supported.

What TDM audio capabilities does this kit demonstrate?

The kit exposes all three TDM signals (BCLK, WCLK, TDMOUT) from the LSM6DSV16B, enabling time-division multiplexed sensor data streaming. It supports configurable sample rates and frame sync alignment verified in MEMS Studio, critical for synchronized motion-audio processing in hearables.

Is bone conduction testing supported out-of-the-box?

Yes - the included earphone-style board is mechanically optimized for direct bone conduction coupling, with dedicated mounting points and minimized mass. When driven by the LSM6DSV16B's high-resolution accelerometer output (±2/±4/±8/±16g range, 16-bit data), it enables quantitative vibration transmission analysis without external transducers.