STMicroelectronics STEVAL-OET004V1

Overview

STEVAL-OET004V1 from STMicroelectronics is an evaluation kit comprising four PCB variants (A–D) for validating ESD protection and common-mode filtering solutions targeting USB Type-C interfaces, supporting 0201, 400 µm, and 500 µm discrete ESD devices across VBUS, CC, SBU, DP/DN, and SuperSpeed (SSTX/SSRX) lines.

For engineers reviewing the STEVAL-OET004V1 datasheet, STEVAL-OET004V1 pinout, STEVAL-OET004V1 application, or STEVAL-OET004V1 equivalent, this kit enables rapid validation of multi-line ESD clamping performance, common-mode noise suppression on USB 2.0/3.1 differential pairs, and mechanical insertion compatibility with both USB Type-C plug and receptacle configurations.

Technical Context

The kit implements full-line protection architecture covering all 24-pin USB Type-C signal paths: power (VBUS), configuration channel (CC1/CC2), sideband use (SBU1/SBU2), USB 2.0 (DP/DN), and USB 3.1 Gen 1 SuperSpeed lanes (SSTXp/n1/2, SSRXp/n1/2). Each variant uses ST's dedicated ESD arrays-ESDALC5-1BF4, ESDAULC5-1BF4, ESDARF02-1BU2CK, HSP051-4N10, HSP061-2N4, ECMF04-4HSWM10-selected per package size and line function.

STEVAL-OET004V1D integrates dual-stage filtering: low-capacitance ESD diodes (<0.5 pF) on high-speed lanes plus common-mode chokes (ECMF series) for USB 2.0 and USB 3.1, achieving >30 dB common-mode rejection at 100 MHz while maintaining <0.3 pF differential capacitance to preserve signal integrity up to 5 Gbps.

Key Specifications

Availability

STEVAL-OET004V1 is available at Aetrix Electronics and suitable for USB Type-C interface validation, ESD robustness testing, and high-speed signal integrity qualification requiring stable component supply and documented reference layouts.

Supply support for STEVAL-OET004V1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer applications.

This kit belongs to ST's USB Interface Solutions product line, engineered specifically to accelerate adoption of USB Type-C by providing validated, application-ready protection and filtering reference designs.

FAQ

What is the primary purpose of STEVAL-OET004V1?

STEVAL-OET004V1 is an evaluation kit-not a production component-designed to validate ST's ESD protection and common-mode filtering solutions for USB Type-C interfaces. It enables engineers to test real-world ESD immunity, signal integrity, and mechanical integration across four distinct PCB variants optimized for different ESD device package sizes.

Which USB Type-C signal lines does it protect and filter?

The kit protects and filters all mandatory USB Type-C lines: VBUS power rail, CC1/CC2 configuration channels, SBU1/SBU2 sideband use lines, DP/DN USB 2.0 differential pairs, and SSTX/SSRX SuperSpeed lanes (both lane 1 and lane 2). Each variant applies appropriate ESD arrays and common-mode chokes per line function and speed requirement.

Can STEVAL-OET004V1 be used for production deployment?

No. STEVAL-OET004V1 is strictly an evaluation platform with non-optimized thermal relief, unshielded connectors, and no conformal coating. Its PCBs lack production-grade reliability certifications (e.g., IPC Class 3, AEC-Q200) and are intended only for lab-based validation of protection topologies and component selection-not end-product integration.

How do the four variants (A–D) differ in functionality?

Variants A and B use discrete ESD arrays only (no common-mode filters); C adds common-mode chokes for USB 2.0; D combines ESD arrays with dual ECMF filters for both USB 2.0 and USB 3.1 lanes. Variant D also supports mixed-package placement (0201 + 500 µm), enabling direct comparison of footprint scalability and performance trade-offs.