STMicroelectronics STEVAL-STWINKT1

Overview

STEVAL-STWINKT1 from STMicroelectronics is a wireless industrial IoT development kit and reference design built around the STM32L4R9ZIJ6 ultra-low-power ARM Cortex-M4F MCU (120 MHz, 2048 KB Flash), integrating nine industrial-grade sensors-including IIS3DWB vibration sensor (6 kHz bandwidth), ISM330DHCX 6-axis IMU with machine learning core, LPS22HH pressure, HTS221 humidity/temperature, and dual MEMS microphones (IMP34DT05 digital + MP23ABS1 analog)-for condition monitoring and predictive maintenance in rotating machinery.

For engineers reviewing the STEVAL-STWINKT1 datasheet, STEVAL-STWINKT1 pinout, STEVAL-STWINKT1 application, or STEVAL-STWINKT1 equivalent, this kit supports BLE 4.2 (onboard SPBTLE-1S), RS485 (STR485LV), USB OTG, MicroSD logging, and optional Wi-Fi via STEVAL-STWINWFV1 expansion-enabling distributed edge analytics, ultrasound detection, and secure firmware updates with STSAFE-A110 footprint.

Technical Context

The STEVAL-STWINKT1 implements a decentralized sensing architecture where the STM32L4R9ZIJ6 executes real-time vibration analysis using DFSDM for microphone data and dedicated motion processing engines in the ISM330DHCX (finite state machine + machine learning core). Sensor fusion across 9 DoF (accelerometer, gyroscope, magnetometer) and wideband acoustic capture (up to ~40 kHz via MP23ABS1 analog mic + TS922 opamp) enables high-fidelity mechanical fault signature extraction.

Power management includes STBC02 Li-ion charger, ST1PS01EJR buck converter (2.7 V @ 7 A), and LDK130 LDO (3.3 V @ 150 mA), supporting autonomous operation on 480 mAh Li-Po battery. Connectivity layers are hardware-isolated: BLE uses SPI interface (DIO0–DIO14 pins), RS485 employs STR485LV transceiver with DE/RE control, and USB OTG uses USBLC6-2P6 ESD protection.

Key Specifications

Availability

STEVAL-STWINKT1 is available at Aetrix Electronics and suitable for predictive maintenance systems, industrial vibration analyzers, and wireless condition monitoring gateways requiring stable component supply, long-term firmware support, and validated sensor fusion firmware stacks.

Supply support for STEVAL-STWINKT1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, power, and IoT applications with emphasis on energy efficiency and system-level integration.

This kit belongs to ST's STWIN (SensorTile Wireless Industrial Node) product line, engineered specifically for edge-based industrial IoT-emphasizing ultra-low-power multi-sensor synchronization, on-node AI inference, and robust wired/wireless connectivity for harsh factory environments.

FAQ

What firmware and software tools are included with STEVAL-STWINKT1?

The kit ships with STSW-STWINKT01 firmware package containing pre-validated drivers for all onboard sensors, FreeRTOS-based edge analytics examples (vibration FFT, anomaly detection), BLE GATT services for sensor streaming, and cloud dashboard integration templates. ST's Unicleo-GUI and X-CUBE-MEMS1 software expansions provide GUI-based configuration and real-time sensor data visualization.

Does STEVAL-STWINKT1 support Wi-Fi out of the box?

No-Wi-Fi is not onboard. It requires the STEVAL-STWINWFV1 expansion board, which plugs into the 40-pin flex connector and integrates an ESP32-WROOM-32 module. The core board provides UART and power routing to the expansion, and firmware support for Wi-Fi is included in STSW-STWINKT01 v2.0+ with AT command handling and TLS-secured MQTT transport.

Can the STSAFE-A110 secure element be soldered and used on this board?

Yes-the board includes a footprint and routed I²C lines (I2C3_SCL/SDA) for STSAFE-A110, though the IC is not mounted by default. Once installed, it enables ECDSA signature verification for firmware updates, secure boot authentication, and cryptographic key storage compliant with Common Criteria EAL4+, supporting brand protection and anti-cloning in certified industrial deployments.

What is the maximum sampling rate achievable for synchronized multi-sensor acquisition?

Using the STM32L4R9's DFSDM peripheral with oversampling and the ISM330DHCX's ODR-configurable FIFO, synchronized 9-DoF motion data can be acquired at up to 6.66 kHz (accel + gyro), while the IIS3DWB supports 6.4 kHz vibration sampling. Combined with IMP34DT05 (16–48 kHz PCM) and MP23ABS1 (via SAI + TS922 amplifier), true simultaneous capture across acoustic and inertial domains is supported at 48 kHz with hardware-triggered alignment.