STMicroelectronics STG4160BJR

Overview

STG4160BJR from STMicroelectronics is a low-voltage, single-pole dual-throw (SPDT) analog switch with break-before-make timing, 0.40 Ω on-resistance at 4.3 V supply, 15 kV contact ESD protection on D pin, and independent logic supply (VL) for level-shifting control. It serves as a 2:1 multiplexer/demultiplexer in portable audio routing and sensor signal path selection.

For engineers reviewing the STG4160BJR datasheet, STG4160BJR pinout, STG4160BJR application, or STG4160BJR equivalent, key selection criteria include on-resistance flatness (<220 mΩ), sub-50 ns turn-off time at 4.3 V, break-before-make delay (5–42 ns), and dual-supply operation (VCC = 1.65–4.8 V, VL = 1.65–VCC).

Technical Context

The STG4160BJR implements a CMOS transmission gate architecture using silicon gate C2MOS technology, enabling rail-to-rail analog signal switching across its S1/S2/D ports. Its break-before-make behavior is hardwired via complementary SEL-driven control logic-no external timing components required.

It features separate VCC (analog supply) and VL (logic supply) rails, allowing interface compatibility between 1.8 V logic controllers and 3.3/4.3 V analog signal chains. All pins include integrated ESD protection structures validated per IEC 61000-4-2 (15 kV contact on D), JESD22-A114 (8 kV HBM), and charged-device model (1500 V).

Key Specifications

Pinout & Package

STG4160BJR uses a Flip Chip 8-ball package (1.9 mm × 0.9 mm, 0.5 mm pitch), optimized for ultra-thin mobile PCBs. The die-down construction eliminates wire bonds and reduces parasitic inductance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPDT analog switch applications.

Compared with TSM1013BQF and MAX4680EUA+, STG4160BJR uniquely delivers guaranteed break-before-make timing, 15 kV D-pin ESD, and true dual-supply operation - critical for reliable audio routing and battery-powered sensor multiplexing.

Availability

STG4160BJR is available at Aetrix Electronics and suitable for smartphone audio routing, wearable biometric sensing, USB-C alternate mode switching, and industrial handheld scanner signal path management requiring stable component supply across extended product lifecycles.

Supply support for STG4160BJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and consumer ICs with strong analog and power portfolio depth.

The STG4160 belongs to ST's high-performance analog switch family, designed specifically for low-voltage, high-reliability portable electronics where ESD robustness, power efficiency, and signal fidelity are mandatory.

FAQ

What is the maximum allowable voltage difference between VCC and VL?

The datasheet specifies VL must be within 1.65 V to VCC, meaning VL cannot exceed VCC and must be ≥1.65 V. For example, if VCC = 3.3 V, VL may range from 1.65 V to 3.3 V. Exceeding this range risks violating absolute maximum ratings and may cause latch-up or parametric shift.

Can STG4160BJR switch negative signals?

No. The device is not rated for negative input voltages. Absolute maximum ratings specify VI and VO from –0.5 V to VCC + 0.5 V, but recommended operating conditions limit analog signal range to 0 V to VCC. Negative excursions risk forward-biasing internal ESD diodes and causing leakage or damage.

Is the break-before-make timing adjustable?

No. Break-before-make delay is fixed by internal circuit design and process parameters. Datasheet Table 7 lists it as 5–12 ns (min–max) at VCC = 4.3 V, with no external control or trimming capability. This timing is guaranteed across voltage, temperature, and process corners.

Does the Flip Chip 8 package require underfill or special reflow profile?

ST's Flip Chip 8 package is qualified for standard lead-free reflow (J-STD-020). No underfill is required for typical mobile applications. Recommended peak temperature is ≤260 °C for 10 seconds. Board layout must follow Figure 14 footprint (1.9 × 0.9 mm, 0.5 mm pitch) and thermal pad grounding per ST's ECOPACK guidelines.