Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Interface > Analog Switches, Multiplexers, Demultiplexers

STMicroelectronics STG4259BJR

Name: STG4259BJR
Brand: STMicroelectronics
SKU: STG4259BJR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: STG4259BJR

Manufacturer:: STMicroelectronics

Category:: Analog Switches, Multiplexers, Demultiplexers

Package:: 11-WFBGA, FCBGA

Datasheet:: STG4259BJR.pdf

Description:: IC SW SPDTX2 300MOHM 11FLIPCHIP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,858

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

STG4259BJR from STMicroelectronics is a low-voltage dual SPDT analog switch with break-before-make timing, 0.3 Ω max ON resistance at 4.3 V, 15 kV air-gap ESD protection, and independent control per channel. It operates from 1.65 V to 4.8 V and targets portable audio routing, battery-powered sensor multiplexing, and USB peripheral switching.

For engineers reviewing the STG4259BJR datasheet, STG4259BJR pinout, STG4259BJR application, or STG4259BJR equivalent, key selection criteria include verified break-before-make delay (10–66 ns), channel-to-channel crosstalk (−93 dB), ON-resistance flatness (≤170 mΩ), and Flip-Chip11 package compatibility with high-density PCB layouts.

Technical Context

The STG4259BJR implements two independent CMOS SPDT switches using silicon gate C2MOS technology, each controlled by a dedicated SEL input with complementary logic states. Its dual supply architecture separates VCC (switch rail) from VL (logic rail), enabling level-shifting between 1.65 V and 4.8 V domains while maintaining guaranteed truth table operation across the full voltage range.

Break-before-make timing is enforced via internal delay circuitry to prevent momentary shorting during state transitions, with measured tD of 10 ns minimum and 66 ns maximum at 100 kHz. All I/O pins feature integrated ESD protection structures validated per IEC-61000-4-2 (15 kV air, 9 kV contact) and JESD22 models (1500 V CDM, 500 V MM).

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	1.65 V to 4.8 V - supports Li-ion, single-cell alkaline, and regulated 3.3 V/2.5 V rails without level shifters
R_ON (max)	0.30 Ω at V_CC = 4.3 V - ensures <10 mV drop at 30 mA signal current for precision analog paths
t_D (BBM)	10–66 ns - prevents signal contention in bidirectional data lines and shared bus architectures
OIRR	−71 dB at 100 kHz - isolates off-channel signals in multi-source audio or sensor front-ends
Crosstalk	−93 dB at 100 kHz - enables simultaneous routing of stereo audio or differential sensor pairs
ESD Protection	15 kV air-gap (IEC-61000-4-2) - eliminates need for external TVS diodes in handheld device interfaces
I_CC (max)	0.2 µA at 85°C - extends battery life in always-on sensor hubs and wearables

Pinout & Package

STG4259BJR uses the Flip-Chip11 package: 11-bump, 1.57 mm × 2.07 mm footprint, 0.5 mm pitch, bottom-side solder bumps with A1 marked by a 0.1 mm clear area. Designed for reflow-compatible assembly on fine-pitch PCBs with minimal parasitic inductance.

Pin/Terminal	Circuit Role	Design Meaning
1, 3	SEL2, SEL1	Dedicated active-high control inputs - enable independent switching of S2 and S1 channels without shared logic dependency
4, 6, 10, 12	1S1, 1S2, 2S1, 2S2	Independent source terminals - support true dual 2:1 mux/demux configuration with no internal coupling
7, 9	D2, D1	Common drain outputs - routed to shared signal path (e.g., codec input, ADC channel) with ≤230 pF capacitance
2	VL	Logic supply reference - decouples control voltage domain from analog switch rail (V_CC) for mixed-signal integrity
5	GND	Analog/digital ground return - common reference for all I/O and supplies; requires low-impedance PCB plane connection
11	V_CC	Analog switch supply - sets R_ON, bandwidth, and signal swing range; independent of VL

Key Features

Feature	Design Value
Break-before-make timing	Guaranteed 10 ns minimum delay prevents signal shorting during channel switching in shared-bus systems
Independent dual control	Separate SEL1/SEL2 pins eliminate need for external inverters or logic gates in asymmetric routing
Low ON-resistance flatness	≤170 mΩ variation over full signal range - preserves linearity in audio and sensor signal paths
Ultra-low quiescent current	0.2 µA max at 85°C - reduces system standby power in battery-critical applications like IoT endpoints
Integrated ESD protection	15 kV air-gap rating on D1/D2 pins - meets IEC-61000-4-2 without adding board space or BOM cost

Applications

Portable Audio Routing

USB Peripheral Switching

Use Scenario: Selecting between headset mic and Bluetooth mic inputs in a smartphone or tablet.

IC Role / Device Role / Timing Role: Dual SPDT switch providing break-before-make isolation to prevent pop/click artifacts during mic source transition.

Use Value: 0.3 Ω R_ON minimizes insertion loss (<0.02 dB at 20 kHz), while −93 dB crosstalk prevents bleed-through between mic channels.

Use Scenario: Sharing a single USB transceiver between onboard debug interface and external USB-C port in embedded development tools.

IC Role / Device Role / Timing Role: Bidirectional analog switch enabling hot-plug-safe USB 2.0 D+/D− path selection with ESD-hardened I/O.

Use Value: 15 kV air-gap ESD protection on D1/D2 pins eliminates need for discrete TVS, and 40 MHz bandwidth supports full-speed USB signaling.

Battery-Powered Sensor Multiplexing

Wearable Biometric Signal Conditioning

Use Scenario: Routing outputs from multiple low-power environmental sensors (temperature, humidity, pressure) to a shared ADC in a wireless sensor node.

IC Role / Device Role / Timing Role: Low-leakage (±300 nA OFF-state) dual 2:1 mux enabling sequential sampling without cross-talk or offset drift.

Use Value: 0.2 µA ICC allows continuous operation for >10 years on a CR2032 coin cell when paired with duty-cycled ADC reads.

Use Scenario: Switching between ECG electrode pairs and PPG photodiode channels in a compact fitness tracker.

IC Role / Device Role / Timing Role: Precision analog switch with <100 pC charge injection and −71 dB OFF-isolation preserving signal integrity in high-gain biopotential amplifiers.

Use Value: 0.3 Ω R_ON and ≤170 mΩ flatness ensure gain accuracy remains within ±0.1% across all selected channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual SPDT analog switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TSM1012BQTR	Single-supply only (V_CC = VL); R_ON = 0.5 Ω min at 3.3 V; no break-before-make guarantee	Lacks independent control and BBM timing - unsuitable for bidirectional bus arbitration	Prefer STG4259BJR where channel isolation and timing control are mandatory
MAX4677ETE+	Higher R_ON (0.75 Ω typ), wider V_CC range (1.8–5.5 V), but no 15 kV ESD rating on signal pins	Requires external ESD protection for handheld use; larger TQFN-16 package increases layout area	Choose STG4259BJR for space-constrained, ESD-critical portable designs

Compared with TSM1012BQTR and MAX4677ETE+, STG4259BJR uniquely delivers guaranteed break-before-make timing, dual independent control, and 15 kV air-gap ESD on signal pins - critical for robust, miniaturized portable interfaces.

Availability

STG4259BJR is available at Aetrix Electronics and suitable for portable audio routing, USB peripheral switching, and battery-powered sensor multiplexing requiring stable component supply across long-lifecycle consumer electronics programs.

Supply support for STG4259BJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and consumer ICs with strong analog and power portfolio depth.

The STG4259 belongs to ST's high-performance analog switch product line, engineered specifically for low-voltage, low-power portable systems demanding precision signal routing and robust ESD immunity.

FAQ

What is the maximum recommended operating temperature for STG4259BJR?

The STG4259BJR is rated for continuous operation from −40°C to +85°C ambient temperature. Its 0.2 µA max ICC at 85°C ensures thermal stability in sealed enclosures, and the Flip-Chip11 package provides efficient heat transfer to the PCB ground plane under sustained load.

Can STG4259BJR operate with V_CC = 1.8 V and VL = 3.3 V simultaneously?

Yes - STG4259BJR supports independent V_CC and VL supplies. With V_CC = 1.8 V, R_ON is 0.49 Ω max; VL = 3.3 V satisfies the requirement VL ≤ V_CC + 0.5 V and ensures valid VIH/VIL thresholds per Table 6. This configuration enables analog signal switching from a low-voltage rail while accepting logic from a higher-voltage microcontroller.

Is the break-before-make timing guaranteed across voltage and temperature?

Yes - the break-before-make delay (t_D) is specified from 10 ns (min) to 66 ns (max) across the full operating range (−40°C to +85°C, V_CC = 1.65–4.3 V). This guarantee is validated per test circuit Figure 10 and ensures reliable channel separation even under worst-case process/voltage/temperature corners.

Does STG4259BJR require external pull-up or pull-down resistors on SEL pins?

No - the SEL inputs have defined VIH/VIL thresholds (e.g., VIH = 2.35 V min at V_CC = 3.3 V) and leakage current ≤±1 µA. Direct connection to GPIOs of 1.8 V, 2.8 V, or 3.3 V microcontrollers is supported without external biasing, provided VL matches the controller's I/O voltage.

STG4259BJR Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Switch Circuit:: SPDT

Multiplexer/Demultiplexer Circuit:: 2:1

Number of Circuits:: 2

On-State Resistance (Max):: 300mOhm

Channel-to-Channel Matching (ΔRon):: 3mOhm

Voltage - Supply, Single (V+):: 1.65V ~ 4.8V

Voltage - Supply, Dual (V±):: -

Switch Time (Ton, Toff) (Max):: 38ns, 17ns

-3db Bandwidth:: 40MHz

Charge Injection:: 103pC

Channel Capacitance (CS(off), CD(off)):: 30pF

Current - Leakage (IS(off)) (Max):: 20nA

Crosstalk:: -93dB @ 100kHz

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 11-FlipChip

STG4259BJR FAQ

1.How can I place an order for STG4259BJR through Aetrix?

Please submit a Request for Quotation (RFQ) for STG4259BJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STG4259BJR reliable?

The price and inventory of STG4259BJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STG4259BJR is usually 5 days.

3.What payment methods are accepted for STG4259BJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STG4259BJR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STG4259BJR?

STG4259BJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STG4259BJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STG4259BJR?

For technical support, including STG4259BJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STG4259BJR requirements.

6.How does Aetrix verify that STG4259BJR is sourced from the original manufacturer or authorized distributors?

All STG4259BJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STG4259BJR meets industry standards.

7.What is the process for return or replacement of STG4259BJR?

All STG4259BJR units undergo pre-shipment inspection (PSI). If there is an issue with STG4259BJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STG4259BJR part is unused and in its original packaging.

Return procedure for STG4259BJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…