STMicroelectronics STGAP2DM
- Part No.:
- STGAP2DM
- Manufacturer:
- STMicroelectronics
- Category:
- Isolators - Gate Drivers
- Package:
- -
- Datasheet:
-
STGAP2DM.pdf
- Description:
- DGTL ISO
- Quantity:
- Payment:

- Shipping:

Inventory:1,804
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STGAP2DM from STMicroelectronics is a galvanically isolated dual-channel 4 A half-bridge gate driver IC for high-voltage power stages, featuring 1700 V input-to-output isolation, ±100 V/ns CMTI, 75 ns max propagation delay, and integrated UVLO, thermal shutdown, and configurable interlocking. It drives IGBTs or SiC MOSFETs in industrial motor inverters up to 1200 V.
For engineers reviewing the STGAP2DM datasheet, STGAP2DM pinout, STGAP2DM application, or STGAP2DM equivalent, key selection criteria include isolated dual-channel timing accuracy, rail-to-rail 4 A sink/source drive capability, VH supply UVLO thresholds (9.1 V turn-on), interlocking enable/disable via iLOCK pin, and SO-16 package compatibility with high-voltage PCB creepage requirements.
Technical Context
The STGAP2DM implements two independent isolated gate driving channels with separate floating supplies (VH_A/VH_B) and grounds (GNDISO_A/GNDISO_B), enabling unipolar or bipolar gate driving configurations. Its internal level shifters and UVLO comparators operate independently per channel, supporting asymmetric topologies like three-phase inverters with split DC-link sensing.
Control logic resides on the low-voltage side (VDD/GND), while output buffers are fully isolated and rated for 1700 V transient isolation voltage. The iLOCK pin provides hardware-selectable interlocking-tied to VDD for shoot-through prevention or GND for parallel channel operation-without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 1700 V RMS (UL 1577 recognized, 4 mm clearance/creepage) |
| Output Drive Strength | 4 A sink/source per channel at 25 °C - sufficient to drive 1200 V/100 A IGBTs with <100 ns switching transitions |
| Propagation Delay | 75 ns max (ON/OFF) - enables PWM control up to 1 MHz with <20 ns pulse width distortion |
| CMTI | ±100 V/ns - maintains signal integrity during fast dV/dt transients in high-power inverter legs |
| VH Supply UVLO | 9.1 V turn-on / 8.4 V turn-off (0.75 V hysteresis) - prevents partial turn-on of power devices during brown-out |
| Standby Quiescent Current | 40–80 µA on VDD, 400–550 µA per VH rail - reduces idle power in battery-backed or energy-sensitive systems |
| Thermal Shutdown | 170 °C trip with 20 °C hysteresis - protects against sustained overloads without external thermal sensors |
Pinout & Package
STGAP2DM is housed in a SO-16 narrow-body package (9.8 × 3.9 mm, 1.27 mm pitch) with reinforced insulation and 4 mm minimum creepage/clearance between primary and secondary sides.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 VDD | Logic supply input | 5 V tolerant supply for control logic; requires local 100 nF + 1 µF bypassing |
| 2 INA / 3 INB | Channel A/B logic inputs | 3.3/5 V TTL/CMOS-compatible, active-high, with deglitch filter (20–40 ns) |
| 4 SD | Shutdown input | Active-low global disable - forces both outputs to safe state (low) regardless of other inputs |
| 5 BRAKE | Brake control input | Active-low synchronous short-circuit of both outputs - used for rapid motor deceleration |
| 6 iLOCK | Interlock enable/disable | Connect to VDD for automatic shoot-through prevention; tie to GND to allow simultaneous high outputs |
| 7 GND | Logic ground reference | Common return for VDD and all logic inputs; must be separated from isolated grounds |
| 9 VH_B / 14 VH_A | High-side gate supply inputs | Up to 26 V positive supply per channel; each has dedicated UVLO and quiescent current regulation |
| 10 GOUT_B / 15 GOUT_A | Gate drive outputs | Rail-to-rail 4 A sink/source; clamped to ≤2.3 V when VH is below UVLO threshold |
| 11 GNDISO_B / 16 GNDISO_A | Floating channel grounds | Isolated return paths for VH_B/VH_A; differential voltage rating ±1500 V between GNDISO_A and GNDISO_B |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent isolated channels | Separate VH_A/GNDISO_A and VH_B/GNDISO_B rails support asymmetrical topologies and phase-shifted modulation |
| Configurable interlocking | Hardware-selectable via iLOCK pin - eliminates need for external logic or firmware coordination to prevent shoot-through |
| Dedicated SD and BRAKE pins | SD provides fail-safe shutdown; BRAKE enables synchronized low-impedance shorting of both outputs for emergency braking |
| Temperature shutdown with hysteresis | 170 °C trip + 20 °C hysteresis ensures stable recovery after thermal overload without oscillation |
| Standby mode with filtered entry/exit | Reduces total system quiescent current by >95%; entry/exit timing (200–500 µs) prevents false triggering from noise |
Applications
| Industrial Motor Drives | UPS & Power Factor Correction |
|---|---|
|
Use Scenario: Three-phase inverter for 15–75 kW AC induction motors in CNC machines and conveyor systems. IC Role / Device Role / Timing Role: Isolated gate driver for upper/lower IGBT half-bridge legs; delivers precise 75 ns matched propagation to minimize dead-time uncertainty. Use Value: ±100 V/ns CMTI prevents false triggering during 1200 V bus commutation; dual UVLO ensures gate voltage remains valid across both channels during line sags. |
Use Scenario: Bi-directional PFC stage in 3 kW telecom rectifier with active front-end topology. IC Role / Device Role / Timing Role: Dual-channel driver for interleaved boost switches; uses iLOCK disabled to enable synchronous rectification mode. Use Value: 4 A drive strength sustains <50 ns rise/fall times into 4.7 nF gate capacitance; standby mode cuts idle loss by >1 W per channel. |
| Battery Charging Systems | Induction Heating |
|
Use Scenario: 6.6 kW on-board EV charger using dual-phase LLC resonant converter with SiC MOSFETs. IC Role / Device Role / Timing Role: Gate driver for high-side/low-side SiC switches; VH supply set to 20 V for optimal Rg_on/Rg_off balance. Use Value: 1700 V isolation withstand enables direct connection to 1000 V DC-link; thermal shutdown protects against heatsink failure during constant-current charging. |
Use Scenario: 8–12 kW resonant inverter for domestic induction cooktops operating at 20–50 kHz. IC Role / Device Role / Timing Role: Half-bridge driver with BRAKE pin activated during zero-crossing detection to suppress shoot-through during frequency sweeps. Use Value: Dedicated BRAKE function achieves <100 ns forced low-state transition - faster than software-controlled GPIO toggling - critical for burst-mode control stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel isolated gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si8239AD-IS | 2.5 A peak drive, 5 kVrms isolation, no dedicated BRAKE pin, fixed interlock only | Limited to <5 kW inverters; lacks hardware brake for fast motor stop | Choose when cost sensitivity outweighs need for 4 A drive or brake functionality |
| UCC5390SCD | 4 A drive, 5 kVrms isolation, no iLOCK pin, integrated Miller clamp, no standby mode | Suitable for SiC MOSFETs requiring active Miller clamping but not for systems needing ultra-low idle power | Prefer when Miller clamping is mandatory and thermal shutdown is handled externally |
Compared with Si8239AD-IS and UCC5390SCD, STGAP2DM uniquely combines 4 A drive, configurable interlocking, dedicated BRAKE, and sub-100 µA standby - making it optimal for industrial inverters requiring functional safety, energy efficiency, and deterministic fault response.
Availability
STGAP2DM is available at Aetrix Electronics and suitable for industrial motor drives, UPS systems, and battery charging equipment requiring stable component supply, long-term lifecycle support, and UL-recognized isolation compliance.
Supply support for STGAP2DM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.
STGAP2DM belongs to ST's STGAP family of isolated gate drivers, engineered specifically for high-reliability industrial inverters where galvanic isolation, shoot-through immunity, and robust fault handling are non-negotiable design requirements.
FAQ
What is the maximum allowable differential voltage between GNDISO_A and GNDISO_B?
The STGAP2DM supports ±1500 V DC or peak differential voltage between GNDISO_A and GNDISO_B, as specified in the recommended operating conditions. This enables use in split-bus or multi-level inverter topologies where isolated half-bridges operate at different common-mode potentials, provided PCB layout maintains ≥4 mm creepage between associated copper areas.
How does the iLOCK pin affect interlocking behavior when tied to GND versus VDD?
When iLOCK is tied to VDD, interlocking is enabled: if INA and INB are both high, both GOUT_A and GOUT_B are forced low to prevent shoot-through. When iLOCK is tied to GND, interlocking is disabled, allowing simultaneous high outputs - required for synchronous rectification or paralleled switch configurations. No external pull-up/down resistors are needed; internal biasing ensures clean logic levels.
Can STGAP2DM drive SiC MOSFETs with negative gate turn-off voltage?
Yes - STGAP2DM supports bipolar gate driving: connect VH_A to +20 V and GNDISO_A to –5 V to achieve –5 V turn-off bias. The device's rail-to-rail output stage and 26 V absolute max VH rating accommodate this configuration. Ensure external gate resistors and local filtering capacitors are sized for SiC's higher dI/dt, and verify that the chosen negative rail remains within the ±1500 V differential limit relative to other isolated grounds.
What happens to GOUT outputs during VDD undervoltage or loss?
When VDD falls below operational range (≤3.1 V), the control logic enters safe state: both GOUT_A and GOUT_B are actively driven low, regardless of input pin states. This behavior is enforced by an internal watchdog that detects LV-side communication loss and overrides output logic - ensuring fail-safe shutdown even if the MCU freezes or loses power before issuing a shutdown command.
STGAP2DM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- -
- Number of Channels:
- -
- Voltage - Isolation:
- -
- Common Mode Transient Immunity (Min):
- -
- Propagation Delay tpLH / tpHL (Max):
- -
- Pulse Width Distortion (Max):
- -
- Rise / Fall Time (Typ):
- -
- Current - Output High, Low:
- -
- Current - Peak Output:
- -
- Voltage - Forward (Vf) (Typ):
- -
- Current - DC Forward (If) (Max):
- -
- Voltage - Output Supply:
- -
- Grade:
- -
- Qualification:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Approval Agency:
- -
STGAP2DM FAQ
1.How can I place an order for STGAP2DM through Aetrix?
Please submit a Request for Quotation (RFQ) for STGAP2DM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGAP2DM reliable?
The price and inventory of STGAP2DM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGAP2DM is usually 5 days.
3.What payment methods are accepted for STGAP2DM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGAP2DM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGAP2DM?
STGAP2DM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGAP2DM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGAP2DM?
For technical support, including STGAP2DM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGAP2DM requirements.
6.How does Aetrix verify that STGAP2DM is sourced from the original manufacturer or authorized distributors?
All STGAP2DM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGAP2DM meets industry standards.
7.What is the process for return or replacement of STGAP2DM?
All STGAP2DM units undergo pre-shipment inspection (PSI). If there is an issue with STGAP2DM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGAP2DM part is unused and in its original packaging.
Return procedure for STGAP2DM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STGAP2DM Tags
-
TLP152(TPL,E
Toshiba Semiconductor and Storage

-
HT0740LG-G
Microchip Technology

-
FOD8314TR2
onsemi

-
1EDI60N12AFXUMA1
Infineon Technologies

-
1EDB7275FXUMA1
Infineon Technologies

-
UCC5350MCDR
Texas Instruments

-
2EDB7259KXUMA1
Infineon Technologies

-
UCC5304DWVR
Texas Instruments

-
SI8261BBC-C-ISR
Skyworks Solutions Inc.

-
HT0440LG-G
Microchip Technology

-
HCPL-0302-500E
Broadcom Limited

-
STGAP2HSCMTR
STMicroelectronics
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
