STMicroelectronics STGAP2SICSACTR
- Part No.:
- STGAP2SICSACTR
- Manufacturer:
- STMicroelectronics
- Category:
- Isolators - Gate Drivers
- Package:
- 8-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
STGAP2SICSACTR.pdf
- Description:
- DGTL ISO 3.53KV 1CH GATE DVR 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:1,235
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Product details
Overview
STGAP2SICSACTR from STMicroelectronics is a galvanically isolated 4 A single-channel SiC MOSFET gate driver in SO-8W package, featuring 1200 V isolation voltage, 100 V/ns CMTI, 45 ns propagation delay, and dedicated Miller clamp pin. It enables high-efficiency, high-reliability half-bridge switching in industrial inverters and EV charging systems.
For engineers reviewing the STGAP2SICSACTR datasheet, STGAP2SICSACTR pinout, STGAP2SICSACTR application, or STGAP2SICSACTR equivalent, key selection criteria include SiC-optimized UVLO thresholds (14.5–16.4 V turn-on), rail-to-rail 4 A sink/source output, dual active-low/active-high inputs for hardware interlock, and thermal shutdown at 170 °C.
Technical Context
The device implements dual-input logic control with deglitch filtering and truth-table-defined output behavior (IN+ = H, IN− = L → GOUT = HIGH), enabling hardware-level cross-conduction prevention. Its isolated floating section integrates level-shifting, UVLO monitoring on VH, and watchdog supervision of LV-side communication.
Miller clamp activation occurs when gate voltage falls below 1.3–2.6 V (VCLAMPth), providing low-impedance discharge path during high-dV/dt commutation. Standby mode reduces quiescent current to 40 µA (VDD) and 400 µA (VH) while forcing GOUT OFF and CLAMP ON.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 1200 VPEAK working voltage per VDE 0884-11; enables safe operation in 600/1200 V inverter bridges. |
| Output Drive Strength | 4 A sink/source @ 25°C; supports fast SiC MOSFET switching with <30 ns rise/fall times into 4.7 nF load. |
| CMTI | 100 V/ns; maintains signal integrity under high-speed switching noise in motor drives and UPS systems. |
| Propagation Delay | 45 ns typ. (ON/OFF); ensures precise PWM timing control with <20 ns pulse width distortion. |
| UVLO Thresholds | VHon = 15.6 V, VHoff = 14.8 V (typ.), 0.75 V hysteresis; prevents erratic SiC gate drive during brown-out conditions. |
| Thermal Protection | Shut-down at 170 °C junction temperature with 20 °C hysteresis; guarantees fail-safe operation in enclosed industrial enclosures. |
| Input Compatibility | 3.3 V / 5 V TTL/CMOS with hysteresis; eliminates need for external level shifters in MCU- or FPGA-driven systems. |
Pinout & Package
SO-8W wide-body surface-mount package (7.59 mm × 10.32 mm, 2.64 mm height) with 8 mm creepage/clearance, UL 1577 recognized, and ECOPACK2 environmental compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VDD | Logic supply input | 5 V or 3.3 V digital interface power; requires local 100 nF + 1–10 µF bypassing. |
| 2 IN+ | Active-high logic input | Enables GOUT HIGH when IN− = LOW; used for complementary PWM control. |
| 3 IN− | Active-low logic input | Enables GOUT HIGH when IN+ = HIGH; supports hardware interlock against shoot-through. |
| 4 GND | Logic ground reference | Return path for VDD and logic inputs; must be separated from isolated side ground. |
| 5 VH | High-side gate drive supply | Up to 26 V positive rail for SiC gate driving; monitored for UVLO with 14.8 V turn-off threshold. |
| 6 GOUT | Gate drive output | Rail-to-rail 4 A source/sink output; connects directly to SiC MOSFET gate via minimal loop inductance. |
| 7 CLAMP | Miller clamp terminal | Activates low-impedance path to GNDISO when gate voltage drops below 1.3–2.6 V, suppressing Miller-induced turn-on. |
| 8 GNDISO | Isolated gate drive ground | Reference for VH, GOUT, and CLAMP; electrically separated from logic ground by 6 kV galvanic barrier. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-input polarity control | IN+ (active-high) and IN− (active-low) enable hardware interlock without external logic, eliminating shoot-through risk during controller faults. |
| SiC-optimized UVLO | Fixed 14.8 V turn-off and 15.6 V turn-on thresholds with 0.75 V hysteresis ensure stable gate drive across SiC MOSFET VGS(th) range (2.5–4 V). |
| Integrated Miller clamp | Dedicated CLAMP pin activates at 1.3–2.6 V threshold, reducing external component count and improving reliability in half-bridge topologies. |
| Standby mode | Reduces total quiescent current to 440 µA (VDD + VH), enabling low-power idle states in battery-backed or energy-sensitive systems. |
| Thermal shutdown with hysteresis | Triggers at 170 °C and resets at 150 °C, preventing thermal runaway while avoiding oscillation near trip point. |
Applications
| Industrial Motor Inverters | EV Battery Chargers |
|---|---|
|
Use Scenario: 1200 V three-phase inverter driving PMSM motors in CNC machines and robotic arms. IC Role / Device Role / Timing Role: Isolated gate driver for high-side SiC MOSFETs, delivering 45 ns propagation delay and 100 V/ns noise immunity to maintain PWM fidelity at >100 kHz switching. Use Value: Enables >99% system efficiency and compact heatsink design due to low RDS(ON) SiC devices and precise gate control. |
Use Scenario: Bidirectional AC/DC and DC/DC stages in 11–22 kW on-board chargers. IC Role / Device Role / Timing Role: Half-bridge gate driver with Miller clamp, ensuring reliable SiC switching under high dv/dt during ZVS transitions. Use Value: Eliminates external clamp diodes and reduces BOM cost by 30% while meeting CISPR-25 Class 5 EMI requirements. |
| Induction Heating Systems | Uninterruptible Power Supplies |
|
Use Scenario: Resonant LLC inverters operating at 20–100 kHz for domestic and commercial induction cooktops. IC Role / Device Role / Timing Role: High-CMTI isolated driver managing fast SiC switching with sub-50 ns timing accuracy to sustain zero-voltage switching. Use Value: Extends MOSFET lifetime by suppressing gate ringing and parasitic turn-on during hard commutation events. |
Use Scenario: Online double-conversion UPS with 600 V DC bus and IGBT/SiC hybrid output stage. IC Role / Device Role / Timing Role: Fault-tolerant gate driver with watchdog, thermal shutdown, and safe-state default on power loss or communication failure. Use Value: Guarantees uninterrupted load power by forcing outputs to safe state within 200 µs of VDD interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar isolated SiC gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si8273ACD-IS | 3.75 kVrms isolation, 4 A drive, but no dedicated CLAMP pin; relies on internal active Miller clamp with fixed 2.5 V threshold. | Lacks separate CLAMP terminal - limits flexibility in custom clamp voltage tuning for specific SiC devices. | Preferred where board space is constrained and standard 2.5 V clamp suffices; not suitable for designs requiring adjustable clamp voltage. |
| UCC5870QDWJRQ1 | 1200 VPEAK isolation, 10 A peak drive, integrated DESAT protection, but requires external bootstrap or isolated bias supply. | Includes DESAT detection but adds complexity in gate loop layout and increases component count vs. STGAP2SICSACTR's self-contained UVLO + thermal + standby. | Chosen when overcurrent protection is mandatory and higher drive current justifies added design effort and cost. |
Compared with Si8273ACD-IS and UCC5870QDWJRQ1, STGAP2SICSACTR delivers a balanced integration of Miller clamp flexibility, SiC-specific UVLO, and ultra-low standby power - making it optimal for cost-sensitive, thermally constrained industrial inverters where pin-level control of clamp behavior is required.
Availability
STGAP2SICSACTR is available at Aetrix Electronics and suitable for industrial motor drives, EV battery chargers, and uninterruptible power supplies requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified reliability.
Supply support for STGAP2SICSACTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for automotive, industrial, and consumer markets.
STGAP2SICSACTR belongs to ST's STGAP family of isolated gate drivers, engineered specifically for silicon carbide (SiC) MOSFETs in high-voltage, high-frequency power conversion systems demanding robustness, precision, and integration.
FAQ
What is the purpose of the CLAMP pin, and how does it differ from standard gate clamping?
The CLAMP pin provides an externally accessible, actively controlled Miller clamp path that engages when gate voltage falls below 1.3–2.6 V (adjustable via external resistor network). Unlike passive diode-based clamps, this dedicated terminal allows precise threshold tuning and low-impedance (<2 Ω) discharge during high-dv/dt switching, preventing false turn-on in half-bridge SiC configurations without adding external FETs or diodes.
Can STGAP2SICSACTR drive both unipolar and bipolar gate voltages for SiC MOSFETs?
Yes - the device supports both unipolar (e.g., 0 V / +20 V) and bipolar (e.g., −5 V / +20 V) gate drive schemes. VH supplies the positive rail, while a separate negative supply can be connected to GNDISO to establish negative turn-off voltage. The rail-to-rail output stage and independent UVLO on VH enable seamless configuration without redesigning the driver interface.
How does the standby mode affect output behavior and recovery timing?
In standby mode, both IN+ and IN− held HIGH for >200 µs force GOUT to OFF and CLAMP to ON while reducing VDD and VH quiescent currents to 40 µA and 400 µA respectively. Recovery requires a valid input transition (e.g., IN+ = H, IN− = L) held for >200 ns, followed by <200 µs wake-up delay before GOUT responds - ensuring glitch-free reactivation in real-time control loops.
Is STGAP2SICSACTR compatible with 3.3 V microcontrollers, and what input protection is provided?
Yes - its 3.3 V/5 V TTL/CMOS-compatible inputs include built-in hysteresis (≈0.3×VDD), 60–160 kΩ pull-down resistors, and ±2 kV HBM ESD protection. Input thresholds scale with VDD (e.g., Vil = 0.29×VDD, Vih = 0.58×VDD), ensuring robust noise immunity and direct interfacing with STM32, TI C2000, or Infineon XMC MCUs without level-shifting circuitry.
STGAP2SICSACTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Capacitive Coupling
- Number of Channels:
- 1
- Voltage - Isolation:
- 3530Vrms
- Common Mode Transient Immunity (Min):
- 100V/ns
- Propagation Delay tpLH / tpHL (Max):
- -
- Pulse Width Distortion (Max):
- 20ns
- Rise / Fall Time (Typ):
- 30ns, 30ns
- Current - Output High, Low:
- -
- Current - Peak Output:
- 4A
- Voltage - Forward (Vf) (Typ):
- -
- Current - DC Forward (If) (Max):
- -
- Voltage - Output Supply:
- 3.1V ~ 5.25V
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
- Approval Agency:
- UL
STGAP2SICSACTR FAQ
1.How can I place an order for STGAP2SICSACTR through Aetrix?
Please submit a Request for Quotation (RFQ) for STGAP2SICSACTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGAP2SICSACTR reliable?
The price and inventory of STGAP2SICSACTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGAP2SICSACTR is usually 5 days.
3.What payment methods are accepted for STGAP2SICSACTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGAP2SICSACTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGAP2SICSACTR?
STGAP2SICSACTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGAP2SICSACTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGAP2SICSACTR?
For technical support, including STGAP2SICSACTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGAP2SICSACTR requirements.
6.How does Aetrix verify that STGAP2SICSACTR is sourced from the original manufacturer or authorized distributors?
All STGAP2SICSACTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGAP2SICSACTR meets industry standards.
7.What is the process for return or replacement of STGAP2SICSACTR?
All STGAP2SICSACTR units undergo pre-shipment inspection (PSI). If there is an issue with STGAP2SICSACTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGAP2SICSACTR part is unused and in its original packaging.
Return procedure for STGAP2SICSACTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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