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STMicroelectronics STGAP2SICSANC

Part No.:
STGAP2SICSANC
Manufacturer:
STMicroelectronics
Category:
Isolators - Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSTGAP2SICSANC.pdf
Description:
DGTL ISO 2.83KV 1CH GATE DVR 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,480

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Product details

Overview

STGAP2SICSANC from STMicroelectronics is a galvanically isolated 4 A single-channel SiC MOSFET gate driver in narrow-body SO-8, featuring 4.8 kVPK isolation, 100 V/ns CMTI, and dedicated Miller clamp functionality. It delivers rail-to-rail output drive with 45 ns propagation delay and UVLO optimized for SiC gate thresholds, enabling robust half-bridge control in high-voltage industrial inverters.

For engineers reviewing the STGAP2SICSANC datasheet, STGAP2SICSANC pinout, STGAP2SICSANC application, or STGAP2SICSANC equivalent, key selection criteria include its 1200 V rail capability, dual active-low/active-high inputs for hardware interlock, thermal shutdown at 170 °C, and standby mode reducing quiescent current to 40 µA on VDD and 400 µA on VH.

Technical Context

This driver implements a reinforced isolation barrier between low-voltage logic (VDD/GND) and high-voltage floating section (VH/GNDISO), supporting unipolar or bipolar gate driving configurations. Its dual-input architecture (IN+, IN−) enables hardware-based cross-conduction prevention via truth-table-defined output states and deglitch filtering.

The integrated Miller clamp (CLAMP pin) activates below 1.3–2.6 V threshold to suppress dv/dt-induced turn-on during high-side switching transients, while UVLO on VH (14.5–16.4 V turn-on, 13.8–15.7 V turn-off) ensures safe-state entry during under-voltage conditions. Thermal shutdown (170 °C) and watchdog monitoring of LV-side communication further enforce system-level reliability.

Key Specifications

Parameter Value and Actual Design Meaning
Isolation Voltage 4.8 kVPK reinforced isolation per UL 1577; enables direct interface with 1200 V SiC power stages without external isolation components.
Output Drive Strength 4 A sink/source @ 25°C; sustains ≥2.4 A over −40 to +125 °C, ensuring reliable SiC MOSFET turn-on/turn-off under thermal stress.
Propagation Delay 45 ns typical (ON/OFF), ≤80 ns max over full temperature range; supports >500 kHz PWM with <20 ns pulse width distortion for precise timing control.
CMTI 100 V/ns minimum; rejects fast common-mode transients in noisy motor drive or inverter environments without false triggering.
Miller Clamp Threshold 1.3–2.6 V (VCLAMPth); clamps gate voltage before parasitic turn-on occurs, eliminating need for external Miller clamp diodes in half-bridge designs.
UVLO Thresholds VHon = 14.5–16.4 V, VHoff = 13.8–15.7 V; hysteresis of 0.5–0.95 V prevents oscillation near SiC gate drive supply dropout.
Standby Quiescent Current 40 µA on VDD, 400 µA on VH; reduces idle power in battery-backed or energy-sensitive systems without sacrificing wake-up responsiveness (≤35 µs).

Pinout & Package

Narrow-body SO-8 package (4.8 × 6.0 mm, 1.27 mm pitch) with reinforced creepage/clearance ≥4 mm and CTI ≥400 V per DIN IEC 112.

Pin/Terminal Circuit Role Design Meaning
1 VDD Logic supply input Provides 3.1–5.25 V power to isolated LV control logic; requires local 100 nF ceramic bypass.
2 IN+ Active-high logic input Drives GOUT HIGH when IN+ = HIGH and IN− = LOW; enables hardware interlock with IN−.
3 IN− Active-low logic input Drives GOUT LOW when IN− = HIGH and IN+ = LOW; deglitched to reject noise spikes.
4 GND LV ground reference Reference for VDD and logic inputs; must be separated from GNDISO by ≥4 mm creepage.
5 VH High-side gate drive supply Supplies up to 26 V to floating output stage; UVLO protection triggers at 13.8–15.7 V.
6 GOUT Rail-to-rail gate drive output Sinks or sources up to 4 A; connects directly to SiC MOSFET gate; enters safe state (OFF) during fault conditions.
7 CLAMP Active Miller clamp output Provides low-impedance path to GNDISO when gate voltage falls below 1.3–2.6 V, preventing unintended turn-on.
8 GNDISO Floating HV ground reference Return path for VH and GOUT/CLAMP; electrically isolated from GND by 4.8 kVPK barrier.

Key Features

Feature Design Value
Dual-input hardware interlock IN+ and IN− pins implement cross-conduction prevention via truth table (e.g., IN+=IN−=HIGH forces safe state), eliminating need for external logic.
Integrated Miller clamp CLAMP pin activates automatically below 1.3–2.6 V threshold, suppressing dv/dt-induced turn-on without external components in half-bridge topologies.
SiC-optimized UVLO VH UVLO thresholds (14.5–16.4 V turn-on) match SiC MOSFET gate drive requirements, avoiding partial turn-on and conduction losses during brownout.
Thermal shutdown with hysteresis Shuts down at 170 °C junction temperature and resumes operation only after cooling by ≥20 °C, preventing thermal runaway in enclosed drives.
Low-power standby mode Reduces total quiescent current to 440 µA (VDD + VH) while maintaining fast wake-up (<35 µs), ideal for intermittent-operation UPS or battery chargers.

Applications

Industrial Motor Inverters SiC-Based Battery Chargers

Use Scenario: 1200 V three-phase inverter driving PMSM motors in factory automation lines with 20 kHz PWM switching.

IC Role / Device Role / Timing Role: Isolated gate driver providing 4 A peak current to SiC MOSFETs, enforcing dead-time integrity via dual-input interlock and suppressing Miller-induced shoot-through with active clamp.

Use Value: Enables compact, high-efficiency motor drives by eliminating external Miller diodes and reducing gate loop inductance through integrated clamp and rail-to-rail drive.

Use Scenario: Bidirectional 6.6 kW on-board charger using SiC half-bridge modules for fast AC/DC and DC/AC conversion in EVs.

IC Role / Device Role / Timing Role: High-CMTI (100 V/ns) isolated driver ensuring reliable gate control during high dv/dt transitions across 1200 V bus, with UVLO tuned to SiC gate voltage margins.

Use Value: Guarantees system safety during input voltage sags by forcing safe-state shutdown before SiC devices enter linear region, reducing thermal stress and failure risk.

Induction Heating Systems Uninterruptible Power Supplies

Use Scenario: Resonant LLC converter operating at 100–300 kHz for domestic induction cooktops with rapid load changes.

IC Role / Device Role / Timing Role: Low-propagation-delay (45 ns typ.) driver synchronizing SiC switches with minimal timing skew, while Miller clamp prevents false turn-on during zero-voltage switching transitions.

Use Value: Improves efficiency and EMI performance by eliminating gate ringing and ensuring clean, jitter-free switching edges at high frequencies.

Use Scenario: Online double-conversion UPS delivering clean 230 VAC output from rectified 800 V DC bus during grid outages.

IC Role / Device Role / Timing Role: Standby-capable isolated driver reducing idle power consumption to <1 mW per channel while maintaining sub-35 µs wake-up for seamless transfer to battery backup.

Use Value: Extends runtime and reduces thermal load in always-on UPS systems without compromising fault response time or isolation integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar isolated SiC gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si827x (Silicon Labs) Higher CMTI (200 V/ns), but lower 2.5 A drive strength and no dedicated Miller clamp pin; relies on external circuitry for clamp function. Limited to lower-power SiC or GaN applications where clamp is implemented externally; lacks integrated safe-state sequencing during UVLO. Select when ultra-high-noise immunity is critical and gate drive current ≤2.5 A suffices; avoid where Miller-induced turn-on risk demands integrated clamp.
UCC5870-Q1 (TI) Automotive AEC-Q100 Grade 0 rated, 10 A drive, but larger SOIC-16 package and no standby mode; higher quiescent current (1.2 mA VDD). Targeted at automotive traction inverters requiring higher drive current and extended temperature range (−40 to +150 °C), not industrial cost-sensitive designs. Choose for automotive-grade systems needing >4 A drive and extended temp rating; STGAP2SICSANC preferred for industrial cost, size, and standby optimization.

Compared with Si827x and UCC5870-Q1, STGAP2SICSANC uniquely balances 4 A drive, integrated Miller clamp, SO-8 footprint, and ultra-low standby current-making it optimal for space-constrained, energy-efficient industrial SiC inverters where clamp reliability and idle power matter most.

Availability

STGAP2SICSANC is available at Aetrix Electronics and suitable for industrial motor inverters, SiC-based battery chargers, induction heating systems, and uninterruptible power supplies requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified reliability.

Supply support for STGAP2SICSANC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for industrial, automotive, and consumer markets.

STGAP2SICSANC belongs to ST's STGAP family of reinforced-isolation gate drivers, engineered specifically for high-reliability SiC and GaN power systems demanding high CMTI, fast propagation, and integrated protection in compact packages.

FAQ

What is the purpose of the CLAMP pin on STGAP2SICSANC?

The CLAMP pin provides an active Miller clamp function that monitors the gate voltage of the external SiC MOSFET. When the gate voltage drops below 1.3–2.6 V (VCLAMPth), the internal switch connects the gate to GNDISO, creating a low-impedance path that prevents parasitic turn-on caused by high dv/dt during half-bridge commutation. This eliminates the need for external Miller clamp diodes and improves system reliability in high-speed switching applications.

How does the dual-input (IN+/IN−) architecture prevent cross-conduction?

The IN+ and IN− pins implement hardware interlock via a truth table: only IN+=HIGH/IN−=LOW produces GOUT=HIGH, and only IN+=LOW/IN−=HIGH produces GOUT=LOW. All other combinations-including both HIGH (standby) or both LOW-force GOUT into a safe OFF state. This prevents simultaneous conduction in half-bridge legs even if the MCU fails or sends invalid signals, removing reliance on software-based dead-time control.

Can STGAP2SICSANC drive both unipolar and bipolar gate voltages?

Yes. The device supports unipolar gate driving (e.g., 0 V / +20 V) and bipolar gate driving (e.g., −5 V / +20 V) by configuring external components on the VH and VL rails. Its rail-to-rail output stage and independent VH supply allow flexible gate voltage swing design, while the dedicated CLAMP pin remains functional in both configurations to suppress Miller-induced turn-on during negative gate transitions.

What happens during UVLO on the VH supply?

When VH drops below 13.8–15.7 V (VHoff), the driver enters a safe state: GOUT is forced OFF and CLAMP is activated. This prevents partial turn-on of the SiC MOSFET, which could cause excessive conduction losses or thermal runaway. Once VH rises above 14.5–16.4 V (VHon), normal operation resumes with output state determined by IN+/IN− status-ensuring fail-safe behavior aligned with SiC gate voltage requirements.

STGAP2SICSANC Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Bulk
Product Status:
Active
Technology:
Capacitive Coupling
Number of Channels:
1
Voltage - Isolation:
2830Vrms
Common Mode Transient Immunity (Min):
100V/ns
Propagation Delay tpLH / tpHL (Max):
-
Pulse Width Distortion (Max):
20ns
Rise / Fall Time (Typ):
30ns, 30ns
Current - Output High, Low:
-
Current - Peak Output:
4A
Voltage - Forward (Vf) (Typ):
-
Current - DC Forward (If) (Max):
-
Voltage - Output Supply:
3.1V ~ 5.25V
Grade:
Automotive
Qualification:
AEC-Q100
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Approval Agency:
UL

STGAP2SICSANC FAQ

1.How can I place an order for STGAP2SICSANC through Aetrix?

Please submit a Request for Quotation (RFQ) for STGAP2SICSANC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGAP2SICSANC reliable?

The price and inventory of STGAP2SICSANC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGAP2SICSANC is usually 5 days.

3.What payment methods are accepted for STGAP2SICSANC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGAP2SICSANC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGAP2SICSANC?

STGAP2SICSANC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGAP2SICSANC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGAP2SICSANC?

For technical support, including STGAP2SICSANC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGAP2SICSANC requirements.

6.How does Aetrix verify that STGAP2SICSANC is sourced from the original manufacturer or authorized distributors?

All STGAP2SICSANC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGAP2SICSANC meets industry standards.

7.What is the process for return or replacement of STGAP2SICSANC?

All STGAP2SICSANC units undergo pre-shipment inspection (PSI). If there is an issue with STGAP2SICSANC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGAP2SICSANC part is unused and in its original packaging.

Return procedure for STGAP2SICSANC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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