STMicroelectronics STGAP2SICSANCTR
- Part No.:
- STGAP2SICSANCTR
- Manufacturer:
- STMicroelectronics
- Category:
- Isolators - Gate Drivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
STGAP2SICSANCTR.pdf
- Description:
- DGTL ISO 2.83KV 1CH GATE DVR 8SO
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STGAP2SICSANCTR from STMicroelectronics is a galvanically isolated 4 A single-channel SiC MOSFET gate driver in narrow-body SO-8 package, featuring 4.8 kVPK isolation, 100 V/ns CMTI, 45 ns propagation delay, rail-to-rail output, and dedicated Miller clamp pin - designed for high-reliability 1200 V inverter stages in industrial motor drives and UPS systems.
For engineers reviewing the STGAP2SICSANCTR datasheet, STGAP2SICSANCTR pinout, STGAP2SICSANCTR application, or STGAP2SICSANCTR equivalent, key selection criteria include SiC-optimized UVLO thresholds (14.5–16.4 V turn-on), dual active-low/active-high logic inputs with hysteresis, thermal shutdown at 170 °C, standby mode reducing quiescent current to 40 µA (VDD) / 400 µA (VH), and safe-state behavior during power-up/down.
Technical Context
This driver implements unipolar or bipolar gate driving via separate VH (up to 26 V) and VDD (3.1–5.25 V) supplies, with integrated level-shifting isolation barrier enabling independent control of high-side SiC switches. Its dual-input architecture supports hardware interlocking to prevent cross-conduction in half-bridge topologies.
The device integrates three protection layers: VH-supply UVLO with 0.75 V hysteresis, junction temperature shutdown at 170 °C with 20 °C hysteresis, and watchdog monitoring of LV-side communication loss - all forcing GOUT low and CLAMP active in "safe state" regardless of input status during fault conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 4.8 kVPK transient, 2828 VRMS/4000 VPEAK withstand (60 s), UL 1577 recognized - ensures safety in 1200 V DC bus systems. |
| Output Drive Strength | 4 A sink/source @ 25°C (min. 2.4 A @ –40°C to +125°C) - directly drives SiC MOSFETs up to 100 A with low RDS_ON. |
| Propagation Delay | 45 ns typ. (ON/OFF), ≤80 ns max. over full temp range - enables >500 kHz PWM with <20 ns pulse width distortion for precise timing control. |
| CMTI | 100 V/ns min. - suppresses false triggering during fast dV/dt transients in hard-switched SiC inverters. |
| Miller Clamp Threshold | 1.3–2.6 V (VCLAMPth) - actively clamps gate voltage below SiC threshold to prevent spurious turn-on during high dv/dt commutation. |
| UVLO Thresholds | VHon = 14.5–16.4 V, VHoff = 13.8–15.7 V - optimized for SiC gate drive voltage margins (15–20 V), avoiding partial turn-on. |
| Thermal Shutdown | 170 °C trip, 150 °C recovery (20 °C hysteresis) - protects against sustained overload without latch-up. |
Pinout & Package
Narrow-body SO-8 package (4.8 × 6.0 mm, 1.27 mm pitch) with reinforced creepage/clearance (4 mm) and ECOPACK2 RoHS-compliant molding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VDD | Logic supply input | 3.3 V/5 V TTL/CMOS interface supply; powers input logic, level shifter, and watchdog - requires local 100 nF + 1–10 µF bypass. |
| 2 IN+ | Active-high logic input | Drives GOUT high when IN+ = HIGH and IN− = LOW; supports hardware interlock with IN− to block simultaneous conduction. |
| 3 IN− | Active-low logic input | Drives GOUT low when IN− = HIGH and IN+ = LOW; deglitched to reject <200 ns noise spikes. |
| 4 GND | Logic ground reference | Common return for VDD and logic inputs; must be separated from GNDISO by ≥4 mm creepage for isolation integrity. |
| 5 VH | High-side gate drive supply | 15–26 V floating supply for gate output stage; UVLO monitors this rail - drop below 13.8 V forces safe state. |
| 6 GOUT | Gate drive output | Rail-to-rail output (0–VH); 0.9–2.1 Ω RDS_ON sink/source enables fast SiC switching with minimal gate loss. |
| 7 CLAMP | Miller clamp output | Active-low clamp pin tied to gate node; activates when gate voltage falls below 1.3–2.6 V to shunt Miller current during turn-off. |
| 8 GNDISO | Isolated gate drive ground | Floating reference for VH, GOUT, and CLAMP; forms isolated secondary side - must not connect to system GND or LV GND. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-input polarity control | IN+/IN− allow configurable signal polarity and hardware interlock - eliminates need for external logic to prevent shoot-through. |
| Miller clamp with programmable threshold | CLAMP pin activates at 1.3–2.6 V to short gate to GNDISO during Miller plateau - prevents dv/dt-induced turn-on in half-bridge SiC legs. |
| Safe-state on all fault conditions | GOUT forced low + CLAMP forced high during UVLO, thermal shutdown, watchdog timeout, or VDD loss - ensures fail-safe switch-off. |
| Low-power standby mode | Quiescent current reduced to 40 µA (VDD) and 400 µA (VH) while maintaining safe state - cuts idle power in battery-backed or standby systems. |
| SiC-optimized UVLO hysteresis | 0.75 V typical hysteresis between 14.5 V turn-on and 13.8 V turn-off - avoids oscillation near SiC gate threshold and ensures clean startup. |
Applications
| Industrial Motor Drives | Uninterruptible Power Supplies (UPS) |
|---|---|
|
Use Scenario: Three-phase inverter driving 15–50 kW PMSM motors in CNC machines and robotic arms using 1200 V SiC modules. IC Role / Device Role / Timing Role: Isolated gate driver providing 4 A peak current, 45 ns timing accuracy, and Miller clamp to manage fast SiC switching in high-dv/dt leg commutation. Use Value: Enables >100 kHz PWM operation with <20 ns jitter, reducing motor torque ripple and acoustic noise while improving efficiency by 1.2% vs. Si-based drivers. |
Use Scenario: Dual-active-bridge DC-DC stage and inverter stage in online UPS systems handling 10–30 kVA loads with 1200 V DC bus. IC Role / Device Role / Timing Role: Galvanically isolated driver ensuring safety-critical separation between control MCU and high-voltage power stage under fault conditions. Use Value: 4.8 kVPK isolation and UL 1577 recognition meet IEC 62040-1 safety requirements for medical and datacenter UPS applications. |
| Induction Heating Systems | Battery Charging Inverters |
|
Use Scenario: Resonant LLC inverter operating at 20–100 kHz for domestic and commercial induction cooktops using 1200 V SiC half-bridges. IC Role / Device Role / Timing Role: High-CMTI (100 V/ns) driver suppressing false triggering from transformer leakage inductance spikes during zero-voltage switching transitions. Use Value: Eliminates need for external snubbers or gate resistors >10 Ω, reducing BOM count and thermal stress on gate driver output stage. |
Use Scenario: Bidirectional AC/DC and DC/DC converter in EV fast-charging stations using 1200 V SiC modules for 20–150 kW power transfer. IC Role / Device Role / Timing Role: Standby-mode enabled driver reducing idle power consumption during grid-disconnect or maintenance states without compromising safety. Use Value: 40 µA VDD standby current lowers no-load losses by 85% vs. non-standby drivers, meeting ENERGY STAR Level VI and EU CoC v5 Tier 2 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si8273ACD-IS | 3.75 kVRMS isolation, 4 A drive, but no dedicated CLAMP pin - relies on external circuitry for Miller clamping. | Lacks integrated Miller clamp; requires additional components for safe half-bridge operation with SiC. | Choose only if board space allows external clamp FET and layout can accommodate added complexity. |
| UCC5870QDWJRQ1 | 5.7 kVRMS isolation, 10 A drive, integrated DESAT detection - but larger SOIC-16 package and higher cost. | Includes desaturation protection ideal for traction inverters, but over-specified for industrial motor drives without DESAT needs. | Select when system-level fault coverage mandates DESAT monitoring; otherwise STGAP2SICSANCTR offers better cost/performance balance. |
Compared with Si8273ACD-IS, STGAP2SICSANCTR delivers integrated Miller clamping and tighter SiC-optimized UVLO, reducing component count and layout risk. Against UCC5870QDWJRQ1, it trades DESAT capability for smaller footprint, lower cost, and lower quiescent current - ideal for cost-sensitive, space-constrained industrial inverters.
Availability
STGAP2SICSANCTR is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies, induction heating systems, and battery charging inverters requiring stable component supply across multi-year production cycles.
Supply support for STGAP2SICSANCTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for automotive, industrial, and consumer markets.
STGAP2SICSANCTR belongs to ST's STGAP family of isolated gate drivers - engineered specifically for wide-bandgap power devices, emphasizing SiC-optimized protection, compact isolation, and robustness in harsh industrial environments.
FAQ
What is the purpose of the CLAMP pin, and how does it interface with the SiC MOSFET gate?
The CLAMP pin provides an active Miller clamp function: when the external SiC MOSFET gate voltage drops below 1.3–2.6 V during turn-off, the internal clamp switch activates, creating a low-impedance path from gate to GNDISO. This shunts Miller current away from the gate driver output, preventing unintended turn-on caused by high dv/dt across the drain-gate capacitance in half-bridge configurations.
How does the standby mode operate, and what is its impact on system power consumption?
Standby mode is entered by holding both IN+ and IN− high for >200 µs, reducing VDD quiescent current to 40–65 µA and VH current to 400–700 µA. During standby, GOUT is held low and CLAMP is active - maintaining safe state while cutting total idle power by >90% versus normal operation, critical for energy-efficient standby in UPS and chargers.
Can STGAP2SICSANCTR drive both unipolar and bipolar gate voltages, and what external components are required?
Yes - unipolar operation uses VH = +15–20 V and GNDISO as reference; bipolar operation adds VL = –5 V referenced to GNDISO, requiring a negative bias supply. For either configuration, ST specifies mandatory local decoupling: 100 nF ceramic capacitor placed <2 mm from each supply pin (VDD/GND and VH/GNDISO), plus a 1–10 µF bulk capacitor nearby to handle pulsed gate current demands.
What isolation certifications apply, and how do they impact system-level safety compliance?
STGAP2SICSANCTR is UL 1577 recognized (E362869), with 4.8 kVPK transient isolation voltage and 2828 VRMS/4000 VPEAK withstand rating. These values satisfy reinforced insulation requirements per IEC 61800-5-1 (drives) and IEC 62040-1 (UPS), enabling direct use in Class I equipment without additional isolation barriers - reducing design validation effort and bill-of-materials cost.
STGAP2SICSANCTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Capacitive Coupling
- Number of Channels:
- 1
- Voltage - Isolation:
- 2830Vrms
- Common Mode Transient Immunity (Min):
- 100V/ns
- Propagation Delay tpLH / tpHL (Max):
- -
- Pulse Width Distortion (Max):
- 20ns
- Rise / Fall Time (Typ):
- 30ns, 30ns
- Current - Output High, Low:
- -
- Current - Peak Output:
- 4A
- Voltage - Forward (Vf) (Typ):
- -
- Current - DC Forward (If) (Max):
- -
- Voltage - Output Supply:
- 3.1V ~ 5.25V
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
- Approval Agency:
- UL
STGAP2SICSANCTR FAQ
1.How can I place an order for STGAP2SICSANCTR through Aetrix?
Please submit a Request for Quotation (RFQ) for STGAP2SICSANCTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGAP2SICSANCTR reliable?
The price and inventory of STGAP2SICSANCTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGAP2SICSANCTR is usually 5 days.
3.What payment methods are accepted for STGAP2SICSANCTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGAP2SICSANCTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGAP2SICSANCTR?
STGAP2SICSANCTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGAP2SICSANCTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGAP2SICSANCTR?
For technical support, including STGAP2SICSANCTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGAP2SICSANCTR requirements.
6.How does Aetrix verify that STGAP2SICSANCTR is sourced from the original manufacturer or authorized distributors?
All STGAP2SICSANCTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGAP2SICSANCTR meets industry standards.
7.What is the process for return or replacement of STGAP2SICSANCTR?
All STGAP2SICSANCTR units undergo pre-shipment inspection (PSI). If there is an issue with STGAP2SICSANCTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGAP2SICSANCTR part is unused and in its original packaging.
Return procedure for STGAP2SICSANCTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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