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STMicroelectronics STGAP2SICSNTR

Part No.:
STGAP2SICSNTR
Manufacturer:
STMicroelectronics
Category:
Isolators - Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSTGAP2SICSNTR.pdf
Description:
DIGITAL ISO 4KV 1CH GATE DVR 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,837

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Product details

Overview

STGAP2SICSNTR from STMicroelectronics is a galvanically isolated 4 A single-channel SiC MOSFET gate driver in narrow-body SO-8, featuring 4.8 kVPK isolation, ±100 V/ns CMTI, and 75 ns max input-output propagation delay. It supports both separated-sink/source (GON/GOFF) and Miller Clamp (GOUT/CLAMP) configurations for half-bridge SiC power stages in industrial inverters and UPS systems.

For engineers reviewing the STGAP2SICSNTR datasheet, STGAP2SICSNTR pinout, STGAP2SICSNTR application, or STGAP2SICSNTR equivalent, key selection criteria include SiC-optimized UVLO thresholds (14.6–16.4 V turn-on), dual-input logic polarity control, thermal shutdown at 170 °C, and standalone Miller clamp with 1.3–2.6 V activation threshold.

Technical Context

This driver implements reinforced galvanic isolation via capacitive coupling, enabling safe operation across ±1700 VDC input-to-output working voltage. Its dual-input architecture (IN+, IN−) supports hardware interlocking to prevent cross-conduction, while deglitch filtering (20–40 ns) rejects noise-induced false triggering.

The device integrates three protection layers: VH-supply UVLO with 750 mV hysteresis, junction thermal shutdown at 170 °C with 20 °C hysteresis, and active Miller clamp with 4 A sink capability and sub-120 mV low-level output. Standby mode reduces VDD and VH quiescent current to 40–65 µA and 400–550 µA respectively.

Key Specifications

Parameter Value and Actual Design Meaning
Isolation Voltage 4.8 kVPK, UL 1577 recognized - enables safe operation in 1700 V SiC systems with reinforced insulation barrier
Output Drive Strength 4 A sink/source @25 °C - sufficient to drive high-Qg SiC MOSFETs up to 1200 V with fast switching
CMTI ±100 V/ns over full temperature range - ensures reliable operation in noisy high-dV/dt motor drive environments
Propagation Delay 75 ns max (tDon/tDoff) - supports PWM frequencies up to 1 MHz with tight timing control
VH UVLO Threshold 14.6–16.4 V turn-on, 13.9–15.7 V turn-off - optimized for SiC gate drive voltage requirements and stable biasing
Miller Clamp Threshold 1.3–2.6 V on CLAMP pin - actively suppresses Miller-induced turn-on during high-side switching transitions
Thermal Shutdown 170 °C trip, 20 °C hysteresis - protects against sustained overload or poor heatsinking in enclosed drives

Pinout & Package

Narrow-body SO-8 package (5.0 × 6.0 mm, 1.75 mm height) with 4 mm creepage/clearance, CTI ≥ 400 V, and UL 1577 recognition. Reinforced isolation barrier separates LV control (pins 1–4) from HV floating section (pins 5–8).

Pin/Terminal Circuit Role Design Meaning
1 VDD Logic supply 5 V tolerant TTL/CMOS interface supply; powers control logic and input buffers
2 IN+ Active-high logic input Enables GON or GOUT when high; used with IN− for HW interlock and polarity selection
3 IN− Active-low logic input Complementary to IN+; truth table defines ON/OFF/safe state; enables glitch immunity
4 GND Logic ground Reference for VDD and logic inputs; must be decoupled with 100 nF ceramic capacitor
5 VH Gate drive supply Up to 26 V positive rail for output stage; UVLO monitoring applied here
6 GON / GOUT Source output / Combined output GON: dedicated source path (separated config); GOUT: combined sink/source (Clamp config)
7 GOFF / CLAMP Sink output / Miller clamp GOFF: dedicated sink path; CLAMP: active low-impedance gate clamp during Miller region
8 GNDISO Isolated ground Floating reference for VH, GON/GOUT, GOFF/CLAMP; critical for isolation integrity and layout

Key Features

Feature Design Value
Configurable Output Topology Two pin-compatible variants: separated GON/GOFF for independent gate resistor tuning, or GOUT/CLAMP for integrated Miller suppression in half-bridges
SiC-Optimized UVLO Fixed 15.5 V typ turn-on with 750 mV hysteresis - prevents partial turn-on of SiC devices under brownout conditions
Hardware Interlock Logic Dual IN+/IN− inputs enable direct controller-level cross-conduction prevention without software intervention
Standby Mode Reduces total quiescent current to ≤65 µA (VDD) + ≤550 µA (VH) while holding outputs in safe state - lowers idle losses in battery-backed systems
Safe State Architecture Guaranteed GOFF = ON / GON = Hi-Z / CLAMP = ON during power-up, UVLO, thermal shutdown, or LV-side failure - eliminates shoot-through risk

Applications

Industrial Motor Inverters UPS & Battery Chargers

Use Scenario: 600–1200 V SiC-based 3-phase inverters for HVAC compressors and factory automation servo drives.

IC Role / Device Role / Timing Role: Isolated gate driver providing 4 A peak current to switch 1700 V-class SiC MOSFETs with <75 ns timing accuracy.

Use Value: Enables >50 kHz switching with minimal dead-time penalty and robust dV/dt immunity in compact PCB layouts.

Use Scenario: High-efficiency bidirectional AC/DC and DC/DC conversion in modular UPS systems and EVSE chargers.

IC Role / Device Role / Timing Role: Half-bridge driver with Miller clamp preventing parasitic turn-on during fast SiC commutation in LLC resonant topologies.

Use Value: Eliminates external clamp circuitry while maintaining <2.6 V clamp threshold and 4 A clamp current capability.

Induction Heating Welding Power Supplies

Use Scenario: Resonant tank drivers in 20–100 kW induction cooktops and metal heating systems using discrete SiC modules.

IC Role / Device Role / Timing Role: High-CMTI isolated driver synchronizing gate signals across multiple paralleled SiC switches in phase-shifted topologies.

Use Value: ±100 V/ns transient immunity ensures reliable operation despite rapid bus voltage transients during zero-voltage switching.

Use Scenario: IGBT/SiC hybrid inverters in inverter-based arc welding equipment requiring precise pulse-width control and fault resilience.

IC Role / Device Role / Timing Role: Gate driver with thermal shutdown and UVLO protecting against short-circuit events during electrode stick conditions.

Use Value: 170 °C shutdown with 20 °C hysteresis allows temporary overload tolerance while preventing irreversible die damage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si827x (Silicon Labs) Higher CMTI (125 V/ns), lower drive strength (2.5 A), no integrated Miller clamp Requires external clamp circuit for half-bridge SiC; better suited for space-constrained low-power designs Choose when ultra-high noise immunity is prioritized over integrated protection and drive capability
UCC5870-Q1 (TI) Automotive AEC-Q100 qualified, higher isolation rating (5 kVRMS), 10 A drive, but larger SOIC-16 package Targets automotive traction inverters; lacks standby mode and has higher quiescent current Choose for automotive-grade reliability and higher current needs, accepting larger footprint and no standby

Compared with Si827x and UCC5870-Q1, STGAP2SICSNTR delivers optimal balance of SiC-specific protection (integrated clamp, SiC-tuned UVLO), industrial-grade isolation (4.8 kVPK), and power efficiency (standby mode), all in compact SO-8 - making it ideal for cost-sensitive, high-volume industrial power converters.

Availability

STGAP2SICSNTR is available at Aetrix Electronics and suitable for industrial motor inverters, UPS systems, and SiC-based battery chargers requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for STGAP2SICSNTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.

STGAP2SICSNTR belongs to ST's STGAP family of isolated gate drivers, engineered specifically for wide-bandgap power devices - emphasizing SiC-optimized UVLO, integrated Miller clamp, and high-CMTI isolation for next-generation power conversion.

FAQ

What is the difference between STGAP2SICSNTR and STGAP2SICSNCTR?

STGAP2SICSNTR uses the separated-output configuration (GON/GOFF pins), enabling independent optimization of turn-on and turn-off gate resistors. STGAP2SICSNCTR uses the single-output + Miller Clamp configuration (GOUT/CLAMP pins), integrating active Miller current suppression for half-bridge SiC applications. Both share identical SO-8 packaging and isolation specs, but differ in pin function mapping and internal routing.

Does STGAP2SICSNTR support bipolar gate driving?

Yes - the device supports unipolar (0 V to VH) and bipolar (−VL to VH) gate driving via external negative bias generation on the isolated side. The GNDISO pin serves as the floating reference, allowing connection of a negative supply (e.g., −5 V) to enable enhanced dV/dt immunity and faster turn-off in high-side configurations.

How does the standby mode affect output behavior?

In standby mode - activated by holding both IN+ and IN− high for >200 µs - the driver forces outputs into safe state: GOFF remains actively ON, GON enters high-impedance, and CLAMP activates if present. Quiescent currents drop to ≤65 µA (VDD) and ≤550 µA (VH), reducing idle power without compromising fault-safe behavior.

Can STGAP2SICSNTR drive 1700 V SiC MOSFETs directly?

Yes - its 4.8 kVPK isolation rating, ±1700 VDC working voltage, and ±100 V/ns CMTI are validated for direct use with 1700 V SiC MOSFETs in industrial inverters. The 4 A drive strength, rail-to-rail outputs, and SiC-optimized UVLO ensure robust gate control without external level-shifting or buffering.

STGAP2SICSNTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Capacitive Coupling
Number of Channels:
1
Voltage - Isolation:
4000Vrms
Common Mode Transient Immunity (Min):
100V/ns
Propagation Delay tpLH / tpHL (Max):
90ns, 90ns
Pulse Width Distortion (Max):
20ns
Rise / Fall Time (Typ):
30ns, 30ns
Current - Output High, Low:
4A, 4A
Current - Peak Output:
4A
Voltage - Forward (Vf) (Typ):
-
Current - DC Forward (If) (Max):
-
Voltage - Output Supply:
16.4V ~ 26V
Grade:
-
Qualification:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Approval Agency:
UL

STGAP2SICSNTR FAQ

1.How can I place an order for STGAP2SICSNTR through Aetrix?

Please submit a Request for Quotation (RFQ) for STGAP2SICSNTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGAP2SICSNTR reliable?

The price and inventory of STGAP2SICSNTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGAP2SICSNTR is usually 5 days.

3.What payment methods are accepted for STGAP2SICSNTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGAP2SICSNTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGAP2SICSNTR?

STGAP2SICSNTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGAP2SICSNTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGAP2SICSNTR?

For technical support, including STGAP2SICSNTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGAP2SICSNTR requirements.

6.How does Aetrix verify that STGAP2SICSNTR is sourced from the original manufacturer or authorized distributors?

All STGAP2SICSNTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGAP2SICSNTR meets industry standards.

7.What is the process for return or replacement of STGAP2SICSNTR?

All STGAP2SICSNTR units undergo pre-shipment inspection (PSI). If there is an issue with STGAP2SICSNTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGAP2SICSNTR part is unused and in its original packaging.

Return procedure for STGAP2SICSNTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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