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STMicroelectronics STGAP2SICSTR

Part No.:
STGAP2SICSTR
Manufacturer:
STMicroelectronics
Category:
Isolators - Gate Drivers
Package:
8-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixSTGAP2SICSTR.pdf
Description:
DIGITAL ISO 5KV 1CH GATE DVR 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:950

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Product details

Overview

STGAP2SICSTR from STMicroelectronics is a galvanically isolated 4 A single-channel SiC MOSFET gate driver in wide-body SO-8W package, featuring 100 V/ns CMTI, 75 ns max input-output propagation delay, and dual-input logic with hysteresis for hardware interlocking. It supports both separated-sink/source (GON/GOFF) and Miller-clamp (GOUT/CLAMP) configurations for half-bridge SiC inverter stages in industrial motor drives and UPS systems.

For engineers reviewing the STGAP2SICSTR datasheet, STGAP2SICSTR pinout, STGAP2SICSTR application, or STGAP2SICSTR equivalent, key selection criteria include SiC-optimized UVLO thresholds (14.6–16.4 V turn-on), thermal shutdown at 170°C, standby quiescent current as low as 400 µA on VH, and IEC 60747-17 / UL 1577 certified isolation up to 3.5 kVRMS.

Technical Context

The device implements dual isolated power domains: logic side (VDD/GND) and floating gate-drive side (VH/GNDISO), with level-shifting across a reinforced dielectric barrier. Its dual-input architecture enables active hardware interlock-preventing cross-conduction by forcing GOFF ON when both IN+ and IN- are low, regardless of controller state.

Two functional variants are supported via pin configuration: one with separate GON/GOFF outputs for independent gate resistor tuning, and another with GOUT + CLAMP for active Miller clamping during high-dV/dt commutation. Both share identical UVLO (14.6–16.4 V turn-on), thermal shutdown (170°C), and 4 A sink/source capability at 25°C.

Key Specifications

Parameter Value and Actual Design Meaning
CMTI 100 V/ns - immune to fast common-mode transients in SiC-based 600–1200 V inverters
Propagation delay 75 ns max - enables precise PWM timing control up to 1 MHz switching frequency
VH UVLO threshold 14.6–16.4 V - optimized for SiC MOSFET gate drive stability and safe turn-off
Output current 4 A sink/source - sufficient to drive >100 nC SiC gate charge with low RDS(on) (1.0–1.5 Ω)
Isolation rating 3.5 kVRMS - certified per IEC 60747-17 and UL 1577 for industrial safety compliance
Thermal shutdown 170°C with 20°C hysteresis - prevents latch-up and ensures graceful recovery in overload conditions
Standby current 400 µA on VH - reduces idle power in battery-backed or energy-sensitive systems

Pinout & Package

Package: Wide-body SO-8W (8-pin, 5.9 mm × 4.9 mm, creepage/clearance ≥8 mm), IEC 60747-17 certified for basic insulation.

Pin/Terminal Circuit Role Design Meaning
1 VDD Logic supply input 5 V tolerant TTL/CMOS interface supply; powers control logic and input buffers
2 IN+ Active-high logic input Enables GON or GOUT when asserted; used with IN− for HW interlock and polarity selection
3 IN− Active-low logic input Forces GOFF ON when low; combined with IN+ enables safe-state override and fault blocking
4 GND Logic ground reference Return path for VDD and logic inputs; electrically isolated from GNDISO
5 VH High-side gate drive supply Up to 26 V rail-to-rail output supply; powers floating output stage and UVLO monitoring
6 GOUT / GON Gate drive output (configurable) GOUT: unified sink/source output; GON: dedicated source output (separate config)
7 CLAMP / GOFF Miller clamp or sink output CLAMP: activates below 1.3–2.6 V to suppress Miller-induced turn-on; GOFF: dedicated sink output
8 GNDISO Floating ground reference Return for VH, GOUT/GON/GOFF/CLAMP; galvanically isolated from GND by reinforced barrier

Key Features

Feature Design Value
Dual-input hardware interlock IN+/IN− truth table forces GOFF ON during controller faults, eliminating need for external logic
SiC-optimized UVLO 14.6–16.4 V turn-on with 750 mV hysteresis prevents oscillation near SiC gate threshold voltage
Configurable output topology Selectable between GON/GOFF (independent turn-on/turn-off tuning) or GOUT/CLAMP (Miller spike suppression)
Active Miller clamp CLAMP pin triggers at 1.3–2.6 V to short gate-to-GNDISO during dV/dt events, preventing false turn-on
Thermal + standby protection 170°C shutdown with 20°C hysteresis and sub-µA standby entry/exit sequencing for system-level power management

Applications

Industrial Motor Inverters UPS Half-Bridge Stages

Use Scenario: Driving 1200 V SiC MOSFETs in 3-phase PMSM inverters for factory automation conveyors.

IC Role / Device Role / Timing Role: Isolated gate driver providing 4 A peak current, 75 ns propagation delay, and hardware interlock to prevent shoot-through during position-sensor failure.

Use Value: Enables >20 kHz switching with stable gate control under 100 V/ns bus transients, reducing heatsink size by 30% vs. optocoupler-based solutions.

Use Scenario: Controlling high-side/low-side SiC switches in online double-conversion UPS output stage.

IC Role / Device Role / Timing Role: Galvanically isolated driver with Miller clamp (CLAMP pin) suppressing dv/dt-induced turn-on during rapid AC line transitions.

Use Value: Eliminates external clamp diodes and RC snubbers, cutting BOM count by 4 components while maintaining <10 ns timing skew between legs.

Battery Charger DC-DC Stages Induction Heating Resonant Inverters

Use Scenario: Gate driving SiC half-bridges in 3.3 kW LLC resonant DC-DC converters for EV charging stations.

IC Role / Device Role / Timing Role: High-CMTI (100 V/ns) driver ensuring reliable operation amid 100+ kHz switching noise and ground bounce in high-power PCB layouts.

Use Value: Maintains <20 ns pulse width distortion across temperature, enabling precise ZVS control and improving efficiency by 1.2% at full load.

Use Scenario: Driving 600 V SiC modules in 20–100 kHz series-resonant inverters for industrial cooktops and metal hardening.

IC Role / Device Role / Timing Role: Standby mode (400 µA VH current) reduces idle losses during standby cycles; thermal shutdown protects against coil overcurrent faults.

Use Value: Enables 98.3% peak efficiency and meets IEC 61000-4-4 Level 4 surge immunity without additional isolation margining.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si827x (Silicon Labs) Higher CMTI (200 V/ns), but only 2.5 A output; no integrated Miller clamp; requires external UVLO resistors Limited to lower-power SiC (<50 A) due to lower drive strength; lacks CLAMP pin for half-bridge reliability Prefer when ultra-high-noise immunity is critical and gate charge ≤60 nC; avoid for >100 nC SiC modules
UCC5870-Q1 (TI) Automotive-grade AEC-Q100, 10 A drive, but larger SOIC-16 package; higher cost; no standby mode Targeted at traction inverters; over-specified for industrial UPS/motor drives where cost and footprint matter Choose only for automotive OEM programs requiring AEC-Q100; not cost-effective for industrial BOMs

Compared with Si827x and UCC5870-Q1, STGAP2SICSTR delivers optimal balance of 4 A drive, integrated Miller clamp, standby power savings, and SO-8W compactness-making it the preferred choice for cost-sensitive, high-reliability industrial SiC inverters where board space and thermal margin are constrained.

Availability

STGAP2SICSTR is available at Aetrix Electronics and suitable for industrial motor drives, UPS systems, and SiC-based DC-DC converters requiring stable component supply, long lifecycle support, and certified galvanic isolation.

Supply support for STGAP2SICSTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in power management, analog, MEMS, and microcontrollers for industrial, automotive, and consumer markets.

STGAP2SICSTR belongs to ST's STGAP family of reinforced-isolation gate drivers, designed specifically for robust, high-efficiency SiC and GaN power conversion in harsh industrial environments.

FAQ

What is the purpose of the CLAMP pin in STGAP2SICSTR?

The CLAMP pin provides active Miller current suppression during high-dV/dt switching events in half-bridge topologies. When the external SiC MOSFET's gate voltage falls below 1.3–2.6 V (VCLAMPth), the internal clamp switch turns on, creating a low-impedance path from gate to GNDISO. This prevents unintended turn-on caused by capacitive coupling through the Miller capacitance (CGD) when the complementary switch commutates.

How does the dual-input (IN+/IN−) architecture improve system reliability?

The IN+/IN− inputs implement hardware interlocking: when both pins are low, GOFF is forced ON and GON is placed in high-impedance-regardless of MCU state. This eliminates shoot-through risk during controller lockup, reset, or firmware crash. The truth table also allows polarity inversion and enables safe-state entry without software intervention, meeting IEC 61800-5-2 functional safety requirements.

Can STGAP2SICSTR drive both SiC and silicon MOSFETs?

Yes-STGAP2SICSTR is compatible with both SiC and Si MOSFETs. Its 4 A sink/source capability, 26 V gate drive range, and rail-to-rail outputs suit high-speed SiC devices (e.g., 100 nC gate charge), while its 3.3 V/5 V TTL/CMOS inputs and 75 ns propagation delay also support standard Si MOSFETs in lower-frequency industrial applications like motor starters and power supplies.

What isolation certifications apply to STGAP2SICSTR?

STGAP2SICSTR is certified to IEC 60747-17 (VDE 0884-17) for reinforced galvanic isolation and recognized under UL 1577. It achieves VISO = 3.5 kVRMS, VIORM = 1.2 kVPEAK, and VIOTM = 5.0 kVPEAK, with 8 mm creepage/clearance and CTI ≥400 V. These ratings meet industrial safety standards for 600–1200 V systems including IEC 61800-5-1 and UL 61800-5-1.

STGAP2SICSTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
8-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Capacitive Coupling
Number of Channels:
1
Voltage - Isolation:
5000Vrms
Common Mode Transient Immunity (Min):
100V/ns
Propagation Delay tpLH / tpHL (Max):
90ns, 90ns
Pulse Width Distortion (Max):
20ns
Rise / Fall Time (Typ):
30ns, 30ns
Current - Output High, Low:
4A, 4A
Current - Peak Output:
4A
Voltage - Forward (Vf) (Typ):
-
Current - DC Forward (If) (Max):
-
Voltage - Output Supply:
3V ~ 5.5V
Grade:
-
Qualification:
-
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Approval Agency:
UL

STGAP2SICSTR FAQ

1.How can I place an order for STGAP2SICSTR through Aetrix?

Please submit a Request for Quotation (RFQ) for STGAP2SICSTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGAP2SICSTR reliable?

The price and inventory of STGAP2SICSTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGAP2SICSTR is usually 5 days.

3.What payment methods are accepted for STGAP2SICSTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGAP2SICSTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGAP2SICSTR?

STGAP2SICSTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGAP2SICSTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGAP2SICSTR?

For technical support, including STGAP2SICSTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGAP2SICSTR requirements.

6.How does Aetrix verify that STGAP2SICSTR is sourced from the original manufacturer or authorized distributors?

All STGAP2SICSTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGAP2SICSTR meets industry standards.

7.What is the process for return or replacement of STGAP2SICSTR?

All STGAP2SICSTR units undergo pre-shipment inspection (PSI). If there is an issue with STGAP2SICSTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGAP2SICSTR part is unused and in its original packaging.

Return procedure for STGAP2SICSTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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