STMicroelectronics STGIPQ3H60T-HZ

Overview

STGIPQ3H60T-HZ from STMicroelectronics is a 3-phase intelligent power module (IPM) integrating six trench-gate fieldstop IGBTs (600 V, 3 A), three half-bridge gate drivers, freewheeling diodes, an op-amp, and a fault comparator - all in a single N2DIP-26L package. It delivers compact, low-EMI motor drive for built-in appliances requiring thermal robustness, integrated protection, and direct MCU interface without optocouplers.

For engineers reviewing the STGIPQ3H60T-HZ datasheet, STGIPQ3H60T-HZ pinout, STGIPQ3H60T-HZ application, or STGIPQ3H60T-HZ equivalent, key selection criteria include its 1800 Vrms isolation rating, ±2 kV HBM ESD tolerance, NTC-based thermal monitoring, interlocking dead-time control (180 ns), and dual-function T/SD/OD pin supporting shutdown, open-drain fault reporting, and thermistor sensing.

Technical Context

This IPM implements three independent high-voltage IC (HVIC) gate drivers with bootstrap architecture, each featuring undervoltage lockout on both VCC (12.0 V turn-on threshold) and VBS (11.5 V turn-on threshold), plus internal pull-up/pull-down resistors on logic inputs. The integrated op-amp (8–12 MHz GBWP, 2.5–3.8 V/µs slew rate) and comparator (0.54 V internal reference, 90–130 ns delay) enable fast current-sensing protection circuits without external signal conditioning.

Its interlocking logic prevents shoot-through by enforcing mandatory dead time (1.5 µs recommended) between complementary HIN/LIN transitions, while the T/SD/OD pin serves triple duty: NTC thermistor terminal (UL 1434 CA2/CA4 compliant), active-low shutdown input, and open-drain fault output - all sharing one pin with configurable external RC filtering per AN4966.

Key Specifications

Pinout & Package

The STGIPQ3H60T-HZ uses the N2DIP-26L type L package: a 32.2 mm × 12.5 mm × 5.1 mm molded module with exposed thermal pad (internally connected to GND) and screw-mount capability for direct heatsink attachment. Pin 1 is marked with a dot; pins 17–26 are on the right side, pins 1–16 on the left (top view).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase IPM motor drive applications.

Compared with FSTB10CH60 and FSBB15CH60, STGIPQ3H60T-HZ trades higher current headroom for superior integration density, faster hardware fault response (<200 ns comparator-to-shutdown), and reduced system-level component count - making it optimal for sub-300 W built-in appliance motors where PCB area and certification effort are critical.

Availability

STGIPQ3H60T-HZ is available at Aetrix Electronics and suitable for dishwasher motor drives, kitchen hood fan control, refrigerator compressor modules, and PMSM washing machine inverters requiring stable component supply, long-lifecycle support, and UL-certified thermal safety.

Supply support for STGIPQ3H60T-HZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

STGIPQ3H60T-HZ belongs to the SLLIMM-nano 2nd series IPM product line - engineered specifically for compact, high-efficiency AC and BLDC motor drives in white goods and built-in appliances where thermal performance, EMI compliance, and functional safety integration are paramount.

FAQ

What is the maximum allowable DC bus voltage for STGIPQ3H60T-HZ?

The absolute maximum collector-emitter voltage (VCES) is 600 V per IGBT. Recommended operating VPN is 300–500 V, with 500 V being the upper limit under steady-state conditions. Transient overvoltage must be clamped below 600 V using external TVS or snubbers, as exceeding VCES risks irreversible IGBT failure even for sub-microsecond events.

How does the T/SD/OD pin function in shutdown versus fault reporting mode?

When driven low externally (≤0.8 V), T/SD/OD forces immediate shutdown of all three half-bridges. When left floating or pulled high, it acts as an open-drain fault output: the internal comparator pulls it low upon overcurrent detection (CIN > 0.54 V) or overtemperature (NTC resistance drop). External pull-up resistor value (1 kΩ for 3.3 V, 2.2 kΩ for 5 V) sets logic thresholds per Figure 8.

Can the integrated op-amp be used for voltage sensing instead of current sensing?

Yes - the op-amp is fully uncommitted and rail-to-rail. Its input common-mode range spans -0.3 V to VCC + 0.3 V, and output swings within 75 mV of GND and 14.7 V of VCC (at RL = 10 kΩ). It can condition DC bus voltage, NTC voltage divider outputs, or auxiliary sensor signals, provided input bias currents (100–200 nA) and offset voltage (6 mV max) are accommodated in the signal chain design.

What is the thermal resistance from junction to case, and how should heatsinking be implemented?

RthJC is 10 °C/W per IGBT (Table 5). The N2DIP-26L package features an exposed GND pad on the bottom surface, internally connected to GND - this pad must be soldered to a copper pour thermally coupled to an external heatsink. Mechanical mounting via screws through the flange (Figure 19) is required for optimal thermal transfer; thermal interface material (TIM) with ≤0.5 °C·in²/W resistance is recommended between module and heatsink.