STMicroelectronics STHV800L

Overview

STHV800L from STMicroelectronics is an octal ±90 V, ±2 A high-speed ultrasound pulser IC with real-time clamping-to-ground (RTZ), 3-level output architecture, and integrated TR switch. It integrates eight independent half-bridge channels, each supporting both pulsed-wave (PW) and continuous-wave (CW) modes, and is designed for medical ultrasound transducer driving with <20 ps jitter on CW path and <20 ps on PW path. Used in portable point-of-care imaging systems requiring precise timing and low RX-phase power.

For engineers reviewing the STHV800L datasheet, STHV800L pinout, STHV800L application, or STHV800L equivalent, key selection criteria include its dual-supply HV_CW/HV architecture, 8 Ω TR-switch ON resistance, ±2 A clamp current capability, self-biasing RX-phase power down to 200 µW, and TFLGA-56LD package compatibility with high-density ultrasound probe layouts.

Technical Context

The STHV800L implements a fully monolithic SOI-based architecture with eight independent channels, each containing two separately powered half-bridges: one for high-current pulsed operation (±2 A, 0–±90 V) and a dedicated low-jitter CW bridge (±0.3 A, <10 ps jitter). Its RTZ clamping uses synchronous 8 Ω active circuitry directly at the output node, enabling zero-volt settling without external components.

Each channel integrates a thermally protected TR switch (8 Ω R_ON, 300 MHz BW), noise-blocking diodes, anti-leakage logic, and self-biasing circuitry that reduces RX-phase global power to 200 µW. Input interface supports 1.8 V–3.6 V CMOS logic, and optional external clock synchronization (CK pin) enables deterministic multi-channel timing alignment up to 20 MHz.

Key Specifications

Pinout & Package

TFLGA-56LD (8 mm × 8 mm × 0.9 mm, 0.5 mm pitch) land-grid array package with exposed thermal pad; RoHS-compliant, moisture-sensitive level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage ultrasound pulser applications.

Compared with TX7332 and AD9401, the STHV800L uniquely combines octal RTZ clamping, dual-path HV bridges, and integrated TR switching in a single 56-pin package-reducing component count by ≥12 parts per channel and enabling true single-chip duplex ultrasound front-ends.

Availability

STHV800L is available at Aetrix Electronics and suitable for medical ultrasound imaging, portable point-of-care diagnostics, and industrial NDT systems requiring stable component supply, long-term lifecycle support, and traceable HV analog sourcing.

Supply support for STHV800L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power-efficient analog/mixed-signal solutions.

The STHV800L belongs to ST's high-voltage ultrasound pulser product line, engineered specifically for miniaturized, low-power, high-fidelity medical and industrial transducer driving with integrated protection and timing precision.

FAQ

What is the maximum operating frequency of the STHV800L?

The STHV800L supports up to 20 MHz input signal frequency for synchronized operation, with internal timing paths optimized for sub-20 ps jitter. Its 3-level RTZ output architecture maintains clean transitions even at 15 MHz burst rates typical in high-frame-rate ultrasound imaging, and the CW bridge operates with <10 ps jitter independent of PW timing.

Does the STHV800L require external high-voltage decoupling capacitors?

Yes - each HV supply rail (HVP, HVM, HVP_CW, HVM_CW) requires local ceramic decoupling: minimum 100 nF X7R 0805 in parallel with 10 µF tantalum or polymer capacitor placed within 2 mm of the respective pins. ST recommends 2×100 nF + 1×10 µF per rail to suppress switching noise and maintain <100 mV ripple under ±2 A peak load.

Can the CW and main HV supplies be tied together?

Yes - HVP_CW and HVM_CW may be shorted to HVP and HVM respectively using 0 Ω resistors or direct PCB traces. This simplifies power design but sacrifices independent CW voltage scaling and increases thermal coupling between PW and CW paths. ST's reference design permits shorting only if CW amplitude requirements match PW levels and thermal derating is verified.

How does the THSD pin function in thermal protection?

The THSD pin is an open-drain output that asserts low when internal die temperature exceeds 155 °C. It must be pulled up externally (typically 10 kΩ to 3.3 V); multiple STHV800L devices can share one pull-up resistor. When asserted, all output drivers disable and digital logic enters safe state - recovery occurs automatically after die cools below 140 °C hysteresis.