STMicroelectronics STHVUP32
- Part No.:
- STHVUP32
- Manufacturer:
- STMicroelectronics
- Category:
- Specialized ICs
- Package:
- 168-LFBGA, FCBGA
- Datasheet:
-
STHVUP32.pdf
- Description:
- IC ULTRASOUND PULSER 168FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STHVUP32 from STMicroelectronics is a 32-channel monolithic high-voltage ultrasound pulser IC with integrated transmit beamformer, designed for ultra-portable medical ultrasound imaging systems. It delivers ±100 V output waveforms in 3- or 5-level configurations, supports programmable source/sink currents up to ±800 mA (3-level) or ±400 mA (5-level), and features on-chip 23 Ω clamping and TR switches compliant with receiver multiplexing.
For engineers reviewing the STHVUP32 datasheet, STHVUP32 pinout, STHVUP32 application, or STHVUP32 equivalent, key selection considerations include its 200 MHz clock frequency, 5 ns delay resolution for beam steering, embedded 32-state waveform memory, QSPI control interface, and FCBGA168 package thermal performance in low-power portable imaging platforms.
Technical Context
The STHVUP32 integrates 32 independent high-voltage analog channels, each with four HV P/N-MOSFET half-bridges, a 23 Ω clamping-to-ground circuit (0.64 A peak), and a dedicated T/R switch for XDCR signal isolation. Its digital core operates at up to 200 MHz and manages delay profiles, waveform sequencing, and global protection logic.
Beamforming is implemented via per-channel programmable delays (5 ns–20 µs range, 5 ns resolution) and configurable output states (32 stored per channel). Waveform definition uses a compression algorithm supporting up to four distinct waveforms per channel, while power management enables dynamic current scaling (±200/400/600/800 mA in 3-level mode).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Range | ±100 V - Enables direct drive of piezoelectric transducers without external level-shifting stages |
| Channel Count | 32 - Supports full-array beamforming in portable linear or phased-array ultrasound probes |
| Max Clock Frequency | 200 MHz - Allows precise timing control for sub-5 ns delay steps across all channels |
| Delay Resolution | 5 ns - Enables fine-grained beam steering and focal point adjustment in real time |
| Clamp Resistance | 23 Ω - Provides fast, controlled discharge path to ground during receive phase |
| Peak Output Current | ±800 mA (3-level), ±400 mA (5-level) - Matches transducer impedance and excitation energy requirements |
| Waveform Memory | 32 states/channel with compression - Reduces host controller bandwidth and offloads pattern generation |
Pinout & Package
STHVUP32 is housed in a 11.5 mm × 10.5 mm × 1.35 mm FCBGA168 package with 0.8 mm ball pitch and optimized thermal resistance for high-density portable probe assemblies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| XDCR<31:0> | High-voltage output channel | 32 bidirectional HV pins driving piezoelectric transducers in TX/RX modes |
| VH+, VH− | High-voltage supply rails | ±100 V analog supplies powering internal half-bridge drivers |
| VDDP3V3 / VDDM3V3 | Digital I/O supply | 3.3 V dual-rail supply for QSPI interface and logic core |
| DVDD | Digital core supply | 3.3 V supply for internal state machine and delay engine |
| TRIG | Global TX/RX phase trigger | Single-edge-sensitive input initiating synchronized transmission and automatic receive switching |
| QSPI_SCK / QSPI_IO0–3 | Quad SPI interface | 4-wire serial bus for configuration, delay table loading, and waveform programming |
| INT | Interrupt output | Open-drain alert signal indicating fault conditions (thermal, UVLO, checksum error) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 23 Ω clamp-to-ground | Ensures rapid, low-impedance discharge of transducer capacitance before RX sampling |
| Programmable 3-/5-level output | Enables trade-off between output power (±800 mA) and power efficiency (±200 mA) per channel |
| On-chip 200 MHz delay engine | Eliminates need for external FPGA-based beamformer timing logic |
| Embedded 32-state waveform memory | Reduces host processor load and simplifies real-time waveform updates during scanning |
| HV SOI process technology | Guarantees latch-up immunity and robust operation under repeated HV pulsing stress |
Applications
| Portable Ultrasound Probes | Phased-Array Beamforming Systems |
|---|---|
Use Scenario: Handheld ultrasound devices requiring battery-operated, low-thermal-footprint transducer pulsing. IC Role / Device Role / Timing Role: Primary HV pulser and real-time beamformer controlling 32-element linear arrays. Use Value: Integrated power management and 5 ns delay resolution enable sub-millisecond focal depth adjustment without external timing hardware. | Use Scenario: Compact cart-based systems performing dynamic receive focusing with multi-line acquisition. IC Role / Device Role / Timing Role: Channel-aligned high-speed pulser with per-channel programmable delay for transmit beam steering. Use Value: On-chip 200 MHz delay engine and 32-state waveform memory reduce FPGA resource usage by >40% in multi-channel designs. |
| Point-of-Care Imaging | Ultrasound Elastography |
Use Scenario: Emergency or veterinary use where rapid setup, low weight, and silent operation are critical. IC Role / Device Role / Timing Role: Low-noise, low-glitch pulser managing TX/RX switching via single TRIG input. Use Value: Anti-glitch TRIGGER logic and integrated noise-blocking diodes suppress false echoes during mode transitions. | Use Scenario: Shear-wave elastography requiring precise, repeatable burst sequences with microsecond timing accuracy. IC Role / Device Role / Timing Role: High-fidelity waveform generator delivering identical ±100 V pulses across all 32 channels. Use Value: Matched channel-to-channel delay and amplitude response (<±1.5% gain variation) ensure consistent mechanical wave propagation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage ultrasound pulser applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Texas Instruments TX7332 | 32-channel, ±70 V max output, no integrated beamformer delay engine | Requires external FPGA for beam steering; lower voltage limits transducer selection | Preferred when system already includes high-performance FPGA and transducer voltage demand is ≤±70 V |
| Analog Devices AD9412 | 16-channel, ±120 V, no integrated T/R switch or clamp; separate HV driver + switch required | Higher voltage but modular architecture increases PCB area and interconnect complexity | Selected for high-end diagnostic systems needing >±100 V and custom analog front-end partitioning |
Compared with TX7332 and AD9412, STHVUP32 uniquely integrates beamforming delay, clamping, and T/R switching into a single FCBGA168 device-reducing BOM count by ≥7 components and enabling true single-chip 32-channel portable probe designs.
Availability
STHVUP32 is available at Aetrix Electronics and suitable for portable ultrasound probes, phased-array beamforming systems, point-of-care imaging devices, and ultrasound elastography equipment requiring stable component supply and long-term production continuity.
Supply support for STHVUP32 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and medical-grade analog and mixed-signal ICs.
The STHVUP32 belongs to ST's high-voltage medical imaging product line, engineered specifically to replace discrete HV pulser + FPGA beamformer combinations in battery-powered, handheld ultrasound systems.
FAQ
What is the maximum safe operating temperature for STHVUP32?
The STHVUP32 incorporates thermal protection circuitry that triggers shutdown at 125 °C junction temperature. Its FCBGA168 package achieves 12.5 °C/W thermal resistance (θJA) under standard 4-layer board conditions, enabling sustained 32-channel pulsing at 1 kHz PRF without active cooling in handheld enclosures.
Does STHVUP32 require external level shifters for QSPI communication?
No. The QSPI interface (SCK, IO0–IO3) operates natively at 3.3 V logic levels, matching standard microcontroller or FPGA I/O voltages. Internal level translators isolate the digital core from HV domains, eliminating need for external level-shifting components or isolation buffers.
How is waveform compression implemented in STHVUP32 memory?
Waveform compression uses run-length encoding on state transitions across the 32 output channels. Each 32-bit word stores one time step, with shared state bits reducing memory footprint by ~60% versus raw storage-enabling full 32-state patterns for all channels within the embedded SRAM block.
Can STHVUP32 operate in standalone mode without host processor intervention?
No. The device requires continuous QSPI configuration for delay tables, waveform states, and operational modes. However, once programmed, it executes fully autonomous TX/RX sequences triggered by a single edge on the TRIG pin-no runtime host interaction needed during scanning.
STHVUP32 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 168-LFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Type:
- Ultrasound Pulser
- Applications:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 168-FCBGA (11.5x10.5)
- Grade:
- -
- Qualification:
- -
STHVUP32 FAQ
1.How can I place an order for STHVUP32 through Aetrix?
Please submit a Request for Quotation (RFQ) for STHVUP32 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STHVUP32 reliable?
The price and inventory of STHVUP32 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STHVUP32 is usually 5 days.
3.What payment methods are accepted for STHVUP32?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STHVUP32 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STHVUP32?
STHVUP32 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STHVUP32 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STHVUP32?
For technical support, including STHVUP32 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STHVUP32 requirements.
6.How does Aetrix verify that STHVUP32 is sourced from the original manufacturer or authorized distributors?
All STHVUP32 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STHVUP32 meets industry standards.
7.What is the process for return or replacement of STHVUP32?
All STHVUP32 units undergo pre-shipment inspection (PSI). If there is an issue with STHVUP32, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STHVUP32 part is unused and in its original packaging.
Return procedure for STHVUP32:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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