STMicroelectronics STHVUP64

Overview

STHVUP64 from STMicroelectronics is a 64-channel monolithic high-voltage ultrasound pulser IC with integrated transmit beamformer, designed for ultra-portable medical ultrasound imaging systems. It delivers ±100 V output waveforms in 3- or 5-level configurations, supports ±400 mA source/sink current (3-level), features 45 Ω integrated clamping and TR switches, and operates with up to 200 MHz clock frequency for programmable beam steering.

For engineers reviewing the STHVUP64 datasheet, STHVUP64 pinout, STHVUP64 application, or STHVUP64 equivalent, key selection considerations include its 64-channel ±100 V pulsed output capability, 5 ns delay resolution for beamforming, QSPI-based control interface, integrated thermal/undervoltage protection, and FCBGA196 package compatibility with compact ultrasound probe designs.

Technical Context

The STHVUP64 integrates 64 independent analog channels, each with dual high-voltage half-bridges (P/N-channel SOI MOSFETs), 45 Ω clamping-to-ground, and TR switching circuitry compliant with receiver multiplexing. Its digital core runs at up to 200 MHz and manages waveform sequencing, delay profiling, and global safety functions including thermal shutdown and undervoltage detection on VDDP3V3, VDDM3V3, and DVDD.

Beamforming is implemented per channel via programmable single-channel delays (5 ns resolution, 5 ns–20 µs range) with ≤3 µs table write time. Waveform definition uses embedded memory storing up to 32 states per channel, supporting up to 4 distinct waveforms per channel using compression algorithms - enabling precise pulse shaping for echo-time discrimination in portable ultrasound transducers.

Key Specifications

Pinout & Package

STHVUP64 is housed in a 10 mm × 10 mm FCBGA196 package with 0.65 mm ball pitch and optimized thermal resistance for high-density ultrasound probe integration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage ultrasound pulser applications.

Compared with TX7332 and AD9412, STHVUP64 uniquely combines 64-channel ±100 V pulsing, on-chip beamforming, integrated 45 Ω clamping/TR switching, and ultra-portable power management - making it the only single-package solution for high-channel-count, low-SWaP ultrasound probes.

Availability

STHVUP64 is available at Aetrix Electronics and suitable for portable ultrasound probes, handheld diagnostic scanners, ultrasound research platforms, and therapeutic ultrasound drivers requiring stable component supply and long-term production continuity.

Supply support for STHVUP64 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in intelligent power, sensing, and microcontroller technologies for industrial, automotive, and medical applications.

The STHVUP64 belongs to ST's high-voltage medical ASIC product line, engineered specifically to enable miniaturized, battery-efficient ultrasound systems with clinical-grade image quality and real-time beamforming capability.

FAQ

What is the maximum allowable pulse repetition frequency (PRF) for STHVUP64 in continuous wave (CW) mode?

The STHVUP64 does not support true continuous wave (CW) mode as a primary operating mode; its architecture is optimized for pulsed wave (PW) operation. In PW mode, maximum PRF depends on delay table write time (≤3 µs), waveform state count (up to 32), and clock frequency (200 MHz). Typical clinical ultrasound PRFs (1–10 kHz) are fully supported with margin.

Does STHVUP64 require external level shifters for QSPI communication?

No. The STHVUP64 integrates dedicated high-voltage level translators for all digital control signals, including QSPI lines. The DVDD (3.3 V) I/O domain is electrically isolated from the ±100 V analog domain, eliminating need for external level shifters or isolation buffers in standard probe designs.

How is thermal protection implemented, and what is the trip threshold?

Thermal protection is implemented via an on-die temperature sensor with automatic shutdown when junction temperature exceeds 125 °C. Recovery occurs after temperature falls below 110 °C with hysteresis. The INT pin asserts low during thermal shutdown, and the device retains configuration memory during brief overtemperature events.

Can STHVUP64 drive capacitive loads larger than typical piezoelectric transducers?

Yes - the ±400 mA output current and 45 Ω clamping resistance are designed to handle typical 1–5 nF transducer capacitances. Driving significantly larger loads (>10 nF) may exceed safe SOA limits during fast transitions; ST recommends verifying transient current and power dissipation using the provided thermal models in DB4800 Rev 2.