STMicroelectronics STLVDS050BDR

Overview

STLVDS050BDR from STMicroelectronics is a dual-channel LVDS line driver and receiver IC compliant with ANSI/EIA/TIA-644-1995, supporting 400 Mbps signaling rates, 3.3 V single-supply operation, and 100 Ω differential termination. It integrates two drivers and two receivers in one TSSOP16 package, used for high-speed point-to-point data transmission across PCB traces or backplanes in industrial communication systems.

For engineers reviewing the STLVDS050BDR datasheet, STLVDS050BDR pinout, STLVDS050BDR application, or STLVDS050BDR equivalent, key selection criteria include differential output voltage (247–454 mV), propagation delay (2 ns driver / 3 ns receiver), ESD tolerance (±6 kV HBM), fail-safe receiver behavior, and LVTTL-compatible 5 V-tolerant inputs.

Technical Context

The STLVDS050BDR implements fully independent dual-driver/dual-receiver channels with separate enable controls (DE/RE), enabling flexible bus direction management. Each driver delivers 247–454 mV differential output into 100 Ω, while each receiver detects ≥100 mV differential input with open-circuit fail-safe (outputs high when inputs float).

It operates over –40 °C to +85 °C with 3.0–3.6 V supply, supports 5 V-tolerant LVTTL logic inputs, and features low skew (≤40 ps channel-to-channel output skew) and fast switching (rise/fall times ≤1 ns), making it suitable for synchronous high-speed serial links requiring deterministic timing.

Key Specifications

Pinout & Package

TSSOP16 (Thin Shrink Small Outline Package, 4.4 mm × 5.0 mm, 0.65 mm pitch), RoHS-compliant, ECOPACK® certified, lead-free second-level interconnect.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LVDS transceiver applications.

Compared with SN65LVDS048A and MAX9122, STLVDS050BDR uniquely balances dual-channel density, 400 Mbps performance, 5 V-tolerant inputs, and fail-safe operation-making it optimal for compact, robust, medium-complexity LVDS links where reliability and interface compatibility are prioritized over channel count or integrated termination.

Availability

STLVDS050BDR is available at Aetrix Electronics and suitable for industrial backplane interconnect, FPGA-to-FPGA high-speed links, and medical imaging data buses requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for STLVDS050BDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog/mixed-signal products for industrial, automotive, and consumer markets.

The STLVDS series targets high-speed digital interconnect applications, specifically engineered to deliver EIA/TIA-644-compliant LVDS performance with robustness, low power, and ease of integration in noise-sensitive embedded systems.

FAQ

What is the maximum recommended PCB trace length for reliable 400 Mbps operation with STLVDS050BDR?

At 400 Mbps, reliable operation is achievable up to 25 cm on controlled-impedance 100 Ω FR4 traces with proper termination and grounding. Signal integrity depends on trace loss, crosstalk, and connector quality; for lengths beyond 15 cm, pre-emphasis or receiver equalization may be needed-though STLVDS050BDR itself provides no equalization, so system-level design must compensate.

Does STLVDS050BDR support hot-swap or live-insertion on powered backplanes?

Yes-its 5 V-tolerant inputs and high-impedance enable controls (DE/RE) allow safe insertion into live 3.3 V backplanes. The receiver's open-circuit fail-safe ensures defined outputs during plug-in transient, and ±6 kV HBM ESD rating protects against contact discharge during handling. However, VCC sequencing should still follow ST's recommended power-up order (GND → VCC → signals).

Can STLVDS050BDR drive a 100 Ω load differentially while also terminating a second 100 Ω line on the same pair?

No-STLVDS050BDR's driver outputs are designed for point-to-point use with a single 100 Ω differential termination at the far end. Driving multiple parallel 100 Ω loads would reduce effective termination impedance, degrading signal integrity, increasing reflections, and violating EIA/TIA-644 common-mode voltage specifications. Daisy-chaining or multidrop topologies require active repeaters or specialized multi-drop LVDS variants.

Is there a recommended bypass capacitor layout for STLVDS050BDR's VCC pin?

Yes-place a 100 nF X7R ceramic capacitor within 3 mm of pin 16 (VCC) and pin 8 (GND), plus a 1 µF tantalum or ceramic bulk capacitor within 1 cm. Use short, wide traces and avoid vias in the power loop. ST's layout guidelines specify separate ground planes for analog (receiver) and digital (driver) sections, joined only at a single point near the IC to minimize noise coupling.