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STMicroelectronics STM32F100RDT6B

Part No.:
STM32F100RDT6B
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixSTM32F100RDT6B.pdf
Description:
IC MCU 32BIT 384KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:510

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Product details

Overview

STM32F100RDT6B from STMicroelectronics is a high-density value-line Arm® Cortex®-M3 microcontroller with 384 KB Flash, 32 KB SRAM, 24 MHz max CPU frequency, dual 12-bit DACs, and 16-channel 12-bit ADC - deployed in industrial motor control interfaces requiring real-time PWM generation, analog sensing, and serial communication.

For engineers reviewing the STM32F100RDT6B datasheet, STM32F100RDT6B pinout, STM32F100RDT6B application, or STM32F100RDT6B equivalent, key selection criteria include Flash/SRAM capacity, 100-pin LQFP package compatibility, integrated RTC with VBAT support, SWD/JTAG debug interface, and full peripheral set including CEC, FSMC, and LCD parallel interface.

Technical Context

The STM32F100RDT6B implements an Arm Cortex-M3 core with single-cycle multiplication and hardware division, delivering 1.25 DMIPS/MHz at 24 MHz. Its clock system integrates dual oscillators (4–24 MHz HSE + 32.768 kHz LSE), programmable PLL, and factory-trimmed 8 MHz HSI for flexible timing source selection.

It features a flexible static memory controller (FSMC) supporting SRAM, PSRAM, and NOR devices across four chip selects, plus an 8080/6800-mode LCD parallel interface - enabling direct connection to character/graphic displays without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M3, 24 MHz max - enables deterministic real-time execution with NVIC priority-based interrupt handling.
Flash Memory 384 KB - sufficient for complex control algorithms with bootloader, firmware updates, and parameter storage.
SRAM 32 KB - supports large data buffers for sensor fusion, communication stacks, and DMA-accelerated peripherals.
ADC 1 × 12-bit, 1.2 µs conversion, 16 channels - captures analog signals from temperature sensors, current shunts, and potentiometers at ≥833 kSPS aggregate rate.
DAC 2 × 12-bit - generates precise analog reference voltages or waveform outputs for calibration, biasing, or audio signaling.
Timers Up to 16 timers including advanced-control timer with dead-time generation - essential for 3-phase motor gate drive and power supply PWM control.
Communication Interfaces Up to 11: 3 USARTs (LIN/IrDA), 2 I²C, 3 SPI, 1 CEC - supports multi-protocol fieldbus connectivity and consumer electronics control.

Pinout & Package

LQFP100 package (14 × 14 mm, 0.5 mm pitch), RoHS-compliant, operating junction temperature range –40°C to +85°C.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Core and I/O supply pins - require local 100 nF decoupling per pair; supports 2.0–3.6 V operation with 5 V-tolerant I/Os.
PA0–PA15, PB0–PB15, etc. General-purpose I/O 112 total fast I/Os - all mappable to 16 EXTI lines; most are 5 V-tolerant, enabling direct interfacing with legacy logic.
OSC_IN / OSC_OUT External crystal oscillator input/output Supports 4–24 MHz quartz crystals - used for high-accuracy system clock and USB-free timing-critical applications.
NRST Active-low reset input Asynchronous reset pin - accepts external push-button or supervisor IC assertion; internal pull-up enabled after reset release.
SWDIO / SWCLK Serial Wire Debug interface 2-pin debug port - replaces JTAG for space-constrained designs while retaining full flash programming and real-time trace capability.

Key Features

Feature Design Value
Flexible Static Memory Controller (FSMC) 4 chip selects with configurable timing - eliminates need for external glue logic when interfacing with external SRAM or NOR flash.
LCD Parallel Interface 8080/6800 mode support - drives monochrome or color segment/graphic LCDs directly, reducing BOM count and PCB layer count.
Programmable Voltage Detector (PVD) Configurable threshold monitoring on VDD - triggers interrupt or reset before brown-out, protecting firmware integrity during power sag.
Temperature Sensor Calibrated internal sensor - provides system-level thermal monitoring without external components, usable for fan control or derating logic.
CRC Calculation Unit Hardware-accelerated CRC-32 - offloads checksum computation from CPU during firmware update validation or data packet integrity checks.

Applications

Industrial Motor Control Interface Smart Energy Meter Front-End

Use Scenario: Real-time three-phase motor commutation with current feedback, thermal monitoring, and LIN bus diagnostics.

IC Role / Device Role / Timing Role: Main control MCU executing FOC algorithm, generating complementary PWM with dead-time, sampling ADC channels at 100 kHz, and managing LIN physical layer via USART.

Use Value: Integrated advanced timer with emergency stop input and dual DACs enable safe, compact inverter gate driver design without external PWM generators or DAC ICs.

Use Scenario: Polyphase electricity meter with metrology ADC interface, tamper detection, and RS-485/IR communication.

IC Role / Device Role / Timing Role: System controller handling pulse counting, RTC-backed billing timestamping, secure EEPROM access, and isolated UART/IRDA protocol translation.

Use Value: VBAT-powered RTC with backup registers maintains accurate time and tariff switching during main power loss; 32 KB SRAM buffers metrology data during communication latency.

Human-Machine Interface (HMI) Terminal Medical Diagnostic Sensor Hub

Use Scenario: Standalone display terminal with keypad, buzzer, LED indicators, and SD card logging.

IC Role / Device Role / Timing Role: Primary processor driving 160×128 pixel LCD via 8080 interface, scanning matrix keypad using GPIO remapping, and managing FAT32 file writes over SPI.

Use Value: LCD parallel interface and FSMC eliminate external display controller; 384 KB Flash stores fonts, UI assets, and firmware updates locally.

Use Scenario: Portable ECG/SpO₂ sensor aggregator with analog front-end conditioning, Bluetooth LE interface, and battery management.

IC Role / Device Role / Timing Role: Signal acquisition MCU performing 12-bit ADC oversampling, digital filtering, and BLE packet formatting via USART + SPI to transceiver.

Use Value: Dual 12-bit DACs calibrate analog sensor offsets; low-power Stop mode extends battery life between 10-second measurement cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32F072RBT6 ARM Cortex-M0, 48 MHz, 128 KB Flash, 16 KB SRAM, no FSMC or LCD interface Suitable for cost-sensitive, lower-compute applications without external memory or display needs Select when Flash/SRAM demand is <256 KB and no parallel interface required - reduces BOM cost but sacrifices memory expansion capability.
STM32F103RCT6 Cortex-M3, 72 MHz, 256 KB Flash, 48 KB SRAM, same LQFP100 package, no DAC Better performance for compute-heavy tasks; lacks DACs but adds USB 2.0 FS device Choose for higher-speed control loops or USB-CDC virtual COM port - trade DAC functionality for USB connectivity and faster clock.

Compared with STM32F100RDT6B, STM32F072RBT6 offers lower cost and power but reduced peripheral integration, while STM32F103RCT6 delivers higher CPU throughput and USB support at the expense of analog output capability - making STM32F100RDT6B optimal for mixed-signal embedded systems needing DACs, RTC, and memory expansion in constrained space.

Availability

STM32F100RDT6B is available at Aetrix Electronics and suitable for industrial motor control interfaces, smart energy meter front-ends, HMI terminals, and medical diagnostic sensor hubs requiring stable component supply across long-lifecycle production programs.

Supply support for STM32F100RDT6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.

The STM32F100 value line targets cost-optimized industrial and consumer applications requiring rich analog integration, real-time control, and extended temperature operation - balancing performance, peripheral density, and price for high-volume embedded systems.

FAQ

What is the maximum operating frequency and associated performance metric?

The STM32F100RDT6B operates at up to 24 MHz with an Arm Cortex-M3 core delivering 1.25 DMIPS/MHz (Dhrystone 2.1). This yields ~30 DMIPS total performance - sufficient for real-time PID control, sensor fusion, and protocol stack processing without external co-processors.

Does this MCU support external memory expansion, and what interfaces are available?

Yes - it integrates a Flexible Static Memory Controller (FSMC) with four chip selects supporting asynchronous/synchronous SRAM, PSRAM, and NOR flash in multiplexed or non-multiplexed modes. Timing parameters are fully configurable via registers, enabling direct connection to common memory devices without address latches or glue logic.

How many analog-to-digital and digital-to-analog converter channels does it provide?

It includes one 12-bit ADC with up to 16 input channels and two independent 12-bit DACs. The ADC supports 1.2 µs conversion time and built-in temperature sensor; each DAC has dedicated output buffers and supports noise-shaping modes for improved resolution in audio or calibration applications.

Is the STM32F100RDT6B pin-compatible with other STM32F100 variants in the same package?

Yes - all STM32F100x D-series devices in LQFP100 (e.g., STM32F100RDT6, STM32F100VDT6) share identical pinouts and electrical characteristics. Firmware is binary-compatible across same-density variants, enabling scalable design reuse by changing Flash/SRAM size via part number without PCB revision.

STM32F100RDT6B Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
64-LQFP
Series:
STM32F1
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
24MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O:
51
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F100RDT6B FAQ

1.How can I place an order for STM32F100RDT6B through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F100RDT6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F100RDT6B reliable?

The price and inventory of STM32F100RDT6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F100RDT6B is usually 5 days.

3.What payment methods are accepted for STM32F100RDT6B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F100RDT6B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F100RDT6B?

STM32F100RDT6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F100RDT6B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F100RDT6B?

For technical support, including STM32F100RDT6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F100RDT6B requirements.

6.How does Aetrix verify that STM32F100RDT6B is sourced from the original manufacturer or authorized distributors?

All STM32F100RDT6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F100RDT6B meets industry standards.

7.What is the process for return or replacement of STM32F100RDT6B?

All STM32F100RDT6B units undergo pre-shipment inspection (PSI). If there is an issue with STM32F100RDT6B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F100RDT6B part is unused and in its original packaging.

Return procedure for STM32F100RDT6B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32F100RDT6B Tags

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