STMicroelectronics STM32F101RGT6TR
- Part No.:
- STM32F101RGT6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
STM32F101RGT6TR.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32F101RGT6TR from STMicroelectronics is an ARM® Cortex®-M3 32-bit microcontroller with 1 MB Flash, 80 KB SRAM, and operating frequency up to 36 MHz. It integrates 1×12-bit ADC (16-channel), 2×12-bit DACs, 15 timers (including watchdogs and SysTick), and 10 communication interfaces (3×SPI, 2×I²C, 3×USART, USB, CAN). It serves as a main application controller in industrial HMI panels requiring real-time sensor acquisition, local display control via parallel LCD interface, and fieldbus connectivity.
For engineers reviewing the STM32F101RGT6TR datasheet, STM32F101RGT6TR pinout, STM32F101RGT6TR application, or STM32F101RGT6TR equivalent, key selection criteria include Flash size (1 MB), dual-bank read-while-write capability, 112 I/O count with 5 V tolerance, FSMC support for NOR/PSRAM expansion, and integrated temperature sensor with ±1.5°C accuracy over –40°C to +85°C.
Technical Context
The device implements a tightly coupled ARM Cortex-M3 core with Memory Protection Unit (MPU), enabling secure task isolation in multitasking embedded firmware. Its clock system combines four oscillator sources - 4–16 MHz HSE crystal, 32.768 kHz LSE for RTC, factory-trimmed 8 MHz HSI, and 40 kHz LSI - feeding a programmable PLL for precise 36 MHz system clock generation.
Peripheral integration centers on deterministic real-time control: 10 timers include four 16-bit general-purpose units with input capture/output compare/PWM, two basic timers dedicated to DAC triggering, and independent/window watchdogs. The FSMC supports asynchronous/synchronous memory protocols across four chip selects, enabling direct interface to external displays, NAND/NOR flash, or PSRAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 @ 36 MHz; delivers 1.25 DMIPS/MHz (Dhrystone 2.1), enabling real-time control loops with sub-10 µs interrupt latency. |
| Flash Memory | 1 MB dual-bank Flash with read-while-write; allows seamless firmware updates without halting application execution. |
| SRAM | 80 KB SRAM; sufficient for RTOS kernel, communication buffers, and sensor data staging without external RAM. |
| ADC | 1×12-bit, 1 µs ADC with 16 channels and internal temperature sensor; supports simultaneous sampling of analog sensors and thermal monitoring. |
| DAC | 2×12-bit DACs; provide precision analog output for calibration signals, audio waveform generation, or actuator biasing. |
| I/O Count | 112 fast I/O pins, all 5 V-tolerant and mappable to 16 external interrupt vectors; simplifies mixed-voltage board design and robust peripheral interfacing. |
| Communication Interfaces | 3×SPI (18 Mbit/s), 2×I²C, 3×USART, USB 2.0 FS, CAN 2.0B; enables concurrent connectivity to displays, EEPROMs, modems, and industrial fieldbuses. |
| FSMC | Flexible Static Memory Controller with 4 Chip Selects; directly drives 8080/6800-mode LCDs, NOR flash, PSRAM, and CompactFlash without glue logic. |
Pinout & Package
LQFP64 package (10 × 10 mm, 0.5 mm pitch), RoHS-compliant, ECOPACK® certified. Pin count and function mapping align with STM32F101xG series standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 2.0–3.6 V supply domains; decoupling required per datasheet Section 5.1.6 to maintain stable core and I/O operation. |
| PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15 | General-purpose I/O | 112 total GPIOs; each configurable as digital input/output, alternate function (AFIO), or analog input; all 5 V-tolerant. |
| OSC_IN / OSC_OUT | External crystal oscillator input/output | Supports 4–16 MHz quartz crystal; essential for high-accuracy timing in USB, CAN, and RTC applications. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; accepts 10 µs minimum pulse width for reliable system initialization. |
| BOOT0 | Boot mode selection | High at power-on forces boot from system memory (for DFU); low enables normal Flash execution. |
| PA11/PA12 | USB D+/D− | Dedicated full-speed USB 2.0 physical layer; requires 1.5 kΩ pull-up on D+ for device enumeration. |
| PB8/PB9 | CAN RX/TX | Direct connection to external CAN transceiver; supports bit rates up to 1 Mbit/s with programmable timing quanta. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air (OTA) firmware updates by executing from Bank A while writing to Bank B - no application interruption. |
| Flexible Static Memory Controller (FSMC) | Eliminates need for external address latches or glue logic when interfacing with 8080/6800 LCDs, NOR flash, or PSRAM up to 64 MB. |
| Temperature sensor with calibration | On-die sensor calibrated at factory; outputs voltage linearly proportional to die temperature (1.41 mV/°C), usable for thermal management without external components. |
| Low-power modes (Sleep/Stop/Standby) | Standby current as low as 2.5 µA with RTC running on VBAT; extends battery life in always-on monitoring nodes. |
| Serial wire debug (SWD) | 2-pin debug interface replacing JTAG; reduces PCB footprint and routing complexity while supporting full breakpoint and trace capabilities. |
| CRC calculation unit | Hardware-accelerated CRC-32 generator; verifies integrity of firmware images or communication payloads in <1 µs per 32-bit word. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
|
Use Scenario: Local operator interface with TFT LCD, capacitive touch, and RS-485 Modbus gateway. IC Role / Device Role / Timing Role: Main application controller managing display refresh (via FSMC 8080 interface), touch scan, energy measurement calculations, and serial protocol stack. Use Value: 112 GPIOs route to display data bus, touch controller, and isolated UART; 1 MB Flash stores GUI assets and firmware; dual-bank enables field-upgradable UI. |
Use Scenario: DIN-rail mounted meter with real-time energy logging, tamper detection, and PLC communication. IC Role / Device Role / Timing Role: System-on-chip performing ADC sampling of current/voltage transformers, RTC-based billing intervals, and CAN/LIN fieldbus interfacing. Use Value: Integrated 12-bit ADC with hardware oversampling achieves 14-bit effective resolution; temperature sensor monitors meter thermal drift; CAN 2.0B supports DLMS/COSEM over PLC networks. |
| Programmable Logic Controller (PLC) I/O Module | Medical Diagnostic Sensor Hub |
|
Use Scenario: Remote I/O expansion module with digital input/output, analog current loop (4–20 mA), and EtherCAT slave interface. IC Role / Device Role / Timing Role: Real-time I/O processor handling cyclic process data exchange, PWM-controlled analog outputs, and watchdog supervision. Use Value: 15 timers enable precise 1 ms I/O update cycles; 2×DACs generate calibrated 4–20 mA outputs; FSMC supports external configuration EEPROM with checksum protection. |
Use Scenario: Portable diagnostic device aggregating ECG, SpO₂, and temperature readings for Bluetooth LE transmission. IC Role / Device Role / Timing Role: Signal acquisition hub synchronizing multi-channel ADC sampling, computing FFT-based heart rate, and managing BLE stack timing. Use Value: Single-cycle multiplication accelerates digital filtering; 80 KB SRAM buffers 10 seconds of raw ECG at 1 kHz; ultra-low Standby mode preserves battery during idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | Same LQFP100 package, 256 KB Flash, 48 KB SRAM, includes USB OTG FS and higher analog performance (2.4 MSPS ADC). | Better suited for USB host applications and higher-speed signal acquisition; lacks FSMC and LCD interface. | Select when USB device/host capability is primary and external memory expansion is unnecessary. |
| STM32F072RBT6 | Cortex-M0 core, 128 KB Flash, 16 KB SRAM, no FSMC or DAC, but adds CEC and enhanced USART features. | Lower cost and power for simpler control tasks; insufficient Flash/SRAM for complex GUI or multi-protocol stacks. | Choose for cost-sensitive, low-complexity automation nodes where real-time determinism > feature count. |
Compared with STM32F103VCT6, the STM32F101RGT6TR offers larger Flash and FSMC for display/memory expansion but omits USB OTG; versus STM32F072RBT6, it delivers higher compute throughput and analog integration at the expense of power efficiency and bill-of-materials simplicity.
Availability
STM32F101RGT6TR is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, and PLC I/O modules requiring stable component supply, long-term lifecycle assurance, and ECOPACK® environmental compliance.
Supply support for STM32F101RGT6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.
The STM32F101xG series targets cost-optimized industrial control applications demanding high peripheral integration, deterministic real-time response, and extended temperature operation (–40°C to +85°C) without sacrificing Flash density or I/O flexibility.
FAQ
What is the maximum operating frequency and corresponding power consumption of STM32F101RGT6TR?
The device operates at up to 36 MHz with typical active current of 36 mA at 3.6 V (code from Flash, all peripherals enabled). At 8 MHz, current drops to ~12 mA under identical conditions. These values are measured per datasheet Table 14 and validated across temperature range –40°C to +85°C using the test setup in Figure 10.
Does STM32F101RGT6TR support external memory interfaces beyond FSMC?
No - the only external memory interface is the Flexible Static Memory Controller (FSMC), which supports NOR, PSRAM, NAND, and CompactFlash in asynchronous/synchronous modes. It does not include SDIO, Quad-SPI, or Octo-SPI controllers. External DDR or SDRAM requires external logic or a higher-tier MCU like STM32H7.
Can the internal temperature sensor be used for system-level thermal monitoring?
Yes - the calibrated on-die sensor provides ±1.5°C accuracy from –40°C to +85°C (Table 61). Its output connects to ADC1_IN16; conversion yields temperature via formula T(°C) = (V25 – VSENSE) / Avg_Slope + 25, where V25 = 1.41 V and Avg_Slope = 4.3 mV/°C, per Section 2.3.25.
Is STM32F101RGT6TR pin-compatible with other STM32F101xx variants?
Yes - within the same package variant (LQFP64), STM32F101RGT6TR shares identical pinout with STM32F101RG, STM32F101RF, and STM32F101RB. Differences are limited to Flash size (1 MB vs. 256 KB/512 KB) and peripheral enablement, verified in Table 1 and Section 2.2 of the datasheet.
STM32F101RGT6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-LQFP
- Series:
- STM32F1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 36MHz
- Connectivity:
- I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F101RGT6TR FAQ
1.How can I place an order for STM32F101RGT6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F101RGT6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F101RGT6TR reliable?
The price and inventory of STM32F101RGT6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F101RGT6TR is usually 5 days.
3.What payment methods are accepted for STM32F101RGT6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F101RGT6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F101RGT6TR?
STM32F101RGT6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F101RGT6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F101RGT6TR?
For technical support, including STM32F101RGT6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F101RGT6TR requirements.
6.How does Aetrix verify that STM32F101RGT6TR is sourced from the original manufacturer or authorized distributors?
All STM32F101RGT6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F101RGT6TR meets industry standards.
7.What is the process for return or replacement of STM32F101RGT6TR?
All STM32F101RGT6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F101RGT6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F101RGT6TR part is unused and in its original packaging.
Return procedure for STM32F101RGT6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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