STMicroelectronics STM32F103RDT6TR
- Part No.:
- STM32F103RDT6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
STM32F103RDT6TR.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:6,846
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Product details
Overview
STM32F103RDT6TR from STMicroelectronics is a high-density performance-line Arm® Cortex®-M3 microcontroller featuring 384 KB Flash, 64 KB SRAM, 72 MHz CPU frequency, USB 2.0 full-speed interface, and CAN 2.0B controller. It integrates three 12-bit ADCs (21 channels), two 12-bit DACs, 11 timers including motor-control PWM units with dead-time generation, and supports industrial motor control, PLC I/O modules, and USB-CAN gateway designs.
For engineers reviewing the STM32F103RDT6TR datasheet, STM32F103RDT6TR pinout, STM32F103RDT6TR application, or STM32F103RDT6TR equivalent, key selection criteria include Flash/SRAM capacity, USB+CAN dual-interface capability, LQFP64 package compatibility, and support for real-time motor control with quadrature encoder input and emergency stop functionality.
Technical Context
The device implements an Arm Cortex-M3 core with Harvard architecture, single-cycle multiplication, hardware divide, and nested vectored interrupt controller (NVIC) supporting up to 68 maskable interrupts. Its memory subsystem includes 384 KB of embedded Flash with error correction and 64 KB of SRAM with bit-band aliasing for atomic peripheral access.
Clock management integrates four oscillators: 4–16 MHz HSE crystal, 8 MHz factory-trimmed HSI RC, 40 kHz LSI RC, and 32.768 kHz LSE RTC oscillator - all feeding a programmable PLL that delivers 72 MHz system clock with ±1% stability over temperature and voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3, 72 MHz max - enables deterministic real-time execution with 1.25 DMIPS/MHz performance. |
| Flash Memory | 384 KB - sufficient for complex firmware with bootloader, USB stack, CAN protocol handler, and application logic. |
| SRAM | 64 KB - supports large buffers for USB/CAN data throughput and real-time control algorithms. |
| Analog Peripherals | 3 × 12-bit ADCs (21 ch), 2 × 12-bit DACs - enables simultaneous motor phase current sensing and analog output control. |
| Communication Interfaces | USB 2.0 FS + CAN 2.0B + 5×USART + 3×SPI + 2×I²C - supports dual-bus industrial connectivity with host PC and fieldbus nodes. |
| Timers | 11 timers including 4×16-bit general-purpose, 2×16-bit motor-control PWM, 2×watchdog - provides precise PWM generation, encoder counting, and safety monitoring. |
| Package | LQFP64 (10 × 10 mm, 0.5 mm pitch) - standard surface-mount footprint compatible with automated assembly and thermal relief design. |
| Supply Voltage | 2.0–3.6 V - operates directly from common 3.3 V rail without level-shifting for I/O and peripherals. |
Pinout & Package
LQFP64 package: 10 × 10 mm body, 0.5 mm lead pitch, 64 leads, exposed thermal pad (EP), RoHS-compliant, ECOPACK® certified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power pins enable clean separation of noise-sensitive domains; VDDA must be ≥ VDD for ADC accuracy. |
| PA0–PA15, PB0–PB15, PC13–PC15, PD0–PD2 | General-purpose I/O | 51 GPIOs, all 5 V-tolerant, mappable to 16 EXTI lines - supports flexible peripheral routing and interrupt-driven event handling. |
| PA9/PA10 | USB_DM / USB_DP | Dedicated full-speed USB differential pair with internal transceivers - eliminates need for external PHY in cost-sensitive designs. |
| PB8/PB9 | CAN_RX / CAN_TX | Direct CAN 2.0B physical layer interface - requires external transceiver but avoids signal integrity issues from multiplexed routing. |
| PA11/PA12 | USB_DM / USB_DP (alternate) | Secondary USB pin mapping - allows PCB layout optimization when primary pins conflict with critical signals. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; accepts 10 µs minimum pulse width - ensures reliable recovery after brown-out or watchdog timeout. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible Static Memory Controller (FSMC) | Supports NOR/PSRAM/NAND/CompactFlash with configurable timing - enables expansion to external display buffers or data loggers. |
| Temperature Sensor | Integrated calibrated sensor with ±1.5°C accuracy - provides on-chip thermal monitoring without external components. |
| Serial Wire Debug (SWD) | 2-pin debug interface with full JTAG feature set - reduces debug footprint while maintaining trace and flash programming capability. |
| Low-power Modes | Sleep (2.5 µA), Stop (1.8 µA), Standby (1.7 µA) - extends battery life in portable industrial sensors and remote I/O nodes. |
| CRC Calculation Unit | Hardware-accelerated CRC-32 generator - offloads checksum computation from CPU during firmware updates or communication packet validation. |
Applications
| Industrial Motor Control | USB-to-CAN Bridge |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors using space-vector PWM and Hall sensor feedback. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, quadrature encoder input capture, and 6-channel complementary PWM with programmable dead-time. Use Value: Enables sub-microsecond timer resolution for precise commutation timing and integrated fault protection via emergency stop input. | Use Scenario: Protocol translation between USB-connected PC software and CAN-based automotive or industrial networks. IC Role / Device Role / Timing Role: Dual-role interface managing USB enumeration and CAN message framing with timestamping and filtering. Use Value: Eliminates need for external USB PHY or CAN transceiver driver IC, reducing BOM count and PCB area by 30%. |
| Programmable Logic Controller I/O Module | Smart Energy Meter Interface |
Use Scenario: Digital input/output expansion module with isolation, status LED control, and diagnostics reporting. IC Role / Device Role / Timing Role: High-speed GPIO scanning (up to 50 MHz toggle rate), SPI master for isolated digital isolators, and UART for Modbus RTU communication. Use Value: Supports 16-channel DI/DO with <100 µs response latency and built-in CRC for secure configuration updates. | Use Scenario: Data concentrator interfacing with metrology ICs (e.g., ADE7880) and RF/wireless communication modules. IC Role / Device Role / Timing Role: Simultaneous SPI slave for energy measurement data and I²C master for RTC and EEPROM configuration storage. Use Value: Provides accurate time-stamped energy logging with backup power support via VBAT and 32.768 kHz RTC oscillator calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 100-pin LQFP, 256 KB Flash, 48 KB SRAM, same core/peripherals | Higher I/O count (80 vs. 51), no FSMC or LCD interface in RDT6TR variant | Select when >51 GPIOs or external memory interface required; otherwise RDT6TR offers better cost/space efficiency. |
| STM32F103C8T6 | 64-pin LQFP, 64 KB Flash, 20 KB SRAM, no USB/CAN | Lacks USB and CAN interfaces; limited timer/ADC resources | Choose only for low-cost, low-feature applications where USB/CAN are unnecessary and firmware fits within 64 KB. |
Compared with STM32F103VCT6, the RDT6TR trades I/O count and memory for compact LQFP64 packaging and lower unit cost; versus STM32F103C8T6, it adds essential industrial connectivity (USB+CAN) and doubles Flash/SRAM - making it optimal for mid-tier embedded gateways and motor drives.
Availability
STM32F103RDT6TR is available at Aetrix Electronics and suitable for industrial motor control, USB-CAN bridge devices, and programmable logic controller I/O modules requiring stable component supply across multi-year production cycles.
Supply support for STM32F103RDT6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.
The STM32F103 series belongs to ST's mainstream Cortex-M3 portfolio, engineered specifically for cost-sensitive, high-reliability embedded applications demanding rich peripheral integration, deterministic real-time performance, and long-term supply assurance.
FAQ
What is the maximum operating temperature range for STM32F103RDT6TR?
The STM32F103RDT6TR is rated for industrial temperature operation from –40 °C to +85 °C. This range is validated per ST's specification document DS5792 Rev 13, Section 5.3.1, and applies to all electrical characteristics including Flash programming, ADC accuracy, and USB timing compliance under full load conditions.
Does STM32F103RDT6TR support external memory expansion?
Yes, it integrates a Flexible Static Memory Controller (FSMC) supporting NOR, PSRAM, NAND, and CompactFlash memories with configurable read/write timings. Pin assignments for FSMC signals (e.g., NE1, NOE, NWE, A0–A25, D0–D15) are defined in Table 5 of DS5792 Rev 13 and mapped to specific GPIOs in LQFP64 package.
Can STM32F103RDT6TR run USB and CAN simultaneously without resource conflict?
Yes - USB and CAN operate independently using separate APB1 clock domains and dedicated DMA channels. The reference manual RM0008 confirms concurrent operation with no shared registers or timing dependencies, enabling simultaneous USB CDC ACM and CAN 2.0B frame transmission at full rates.
Is the internal 8 MHz RC oscillator factory-trimmed for accuracy?
Yes, the internal 8 MHz HSI oscillator is factory-trimmed to ±1% accuracy at 25 °C and 3.3 V, with typical drift of ±2% over the full –40 °C to +85 °C range. Calibration data is stored in system memory and accessible via RCC_HSICALIBRATION_DEFAULT register per Section 5.3.7 of DS5792 Rev 13.
STM32F103RDT6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-LQFP
- Series:
- STM32F1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F103RDT6TR FAQ
1.How can I place an order for STM32F103RDT6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F103RDT6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F103RDT6TR reliable?
The price and inventory of STM32F103RDT6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F103RDT6TR is usually 5 days.
3.What payment methods are accepted for STM32F103RDT6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F103RDT6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F103RDT6TR?
STM32F103RDT6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F103RDT6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F103RDT6TR?
For technical support, including STM32F103RDT6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F103RDT6TR requirements.
6.How does Aetrix verify that STM32F103RDT6TR is sourced from the original manufacturer or authorized distributors?
All STM32F103RDT6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F103RDT6TR meets industry standards.
7.What is the process for return or replacement of STM32F103RDT6TR?
All STM32F103RDT6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F103RDT6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F103RDT6TR part is unused and in its original packaging.
Return procedure for STM32F103RDT6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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