STMicroelectronics STM32F103TBU6TR
- Part No.:
- STM32F103TBU6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 36-VFQFN Exposed Pad
- Datasheet:
-
STM32F103TBU6TR.pdf
- Description:
- IC MCU 32BIT 128KB FLSH 36VFQFPN
- Quantity:
- Payment:

- Shipping:

Inventory:2,915
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Product details
Overview
STM32F103TBU6TR from STMicroelectronics is a medium-density performance-line Arm® Cortex®-M3 microcontroller featuring 128 KB Flash, 20 KB SRAM, 72 MHz CPU frequency, USB 2.0 full-speed interface, and CAN 2.0B Active controller. It integrates dual 12-bit ADCs (1 µs conversion), seven timers including motor-control PWM with dead-time generation, and operates across 2.0–3.6 V supply for industrial sensor node and motor control applications.
For engineers reviewing the STM32F103TBU6TR datasheet, STM32F103TBU6TR pinout, STM32F103TBU6TR application, or STM32F103TBU6TR equivalent, key selection criteria include Flash/SRAM size, USB+CAN co-integration, VFQFPN36 package thermal profile, and 72 MHz real-time deterministic timing capability in embedded control loops.
Technical Context
The device implements an Arm Cortex-M3 core with Harvard architecture, single-cycle multiplication, hardware divide, and nested vectored interrupt controller (NVIC) supporting up to 68 interrupts. Its clock system includes 4–16 MHz HSE crystal oscillator, 8 MHz factory-trimmed HSI RC, 40 kHz LSI RC, and PLL for scalable 72 MHz system clock.
Peripheral integration centers on real-time control: two 12-bit ADCs with dual-sample-and-hold and temperature sensor input; three 16-bit general-purpose timers with quadrature encoder support; one 16-bit advanced-control timer with complementary outputs and emergency stop; plus dedicated CAN 2.0B and USB 2.0 full-speed PHY with internal transceivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3, 72 MHz max - enables deterministic real-time task scheduling at ≤13.9 ns instruction cycle time |
| Memory | 128 KB Flash + 20 KB SRAM - supports complex control algorithms with local data buffering and firmware updates in field |
| ADC | 2 × 12-bit, 1 µs conversion, 16-channel mux - allows synchronized sampling of motor phase currents and DC bus voltage |
| Timers | 7 timers: 3×16-bit GP, 1×16-bit advanced (dead-time), 2×WDT, 1×SysTick - provides PWM generation, encoder position tracking, and safety-critical timeout monitoring |
| Communication | USB 2.0 FS + CAN 2.0B + 3×USART + 2×I²C + 2×SPI - enables dual-bus diagnostics (CAN) and host connectivity (USB) without external bridge ICs |
| Supply Range | 2.0–3.6 V - compatible with Li-ion battery systems (3.0–3.6 V nominal) and regulated 3.3 V industrial rails |
| Package | VFQFPN36 (6 × 6 mm, 0.5 mm pitch) - surface-mount footprint optimized for compact motor drive PCBs with thermal pad for 1.5 W dissipation |
Pinout & Package
STM32F103TBU6TR uses the VFQFPN36 (ZR) package: 6 mm × 6 mm body, 0.5 mm lead pitch, exposed thermal pad (EP) on underside for enhanced heat dissipation. Pin count is 36, with 26 GPIOs mappable to 16 external interrupt vectors and 5 V-tolerant inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 3.3 V supply pins with decoupling requirement: 100 nF ceramic per VDD/VSS pair near package edge |
| PA0–PA15, PB0–PB15, PC13–PC15 | General-purpose I/O | 26 total GPIOs; all support external interrupt; PA0–PA3 configurable as ADC1_IN0–IN3 and TIM2_CH1–CH4 |
| PA9/PA10 | USB DM/DP | Dedicated full-speed USB differential pair with internal pull-up on PA12; no external transceiver required |
| PB8/PB9 | CAN RX/TX | Direct connection to external CAN transceiver; supports 1 Mbps bit rate with programmable sample point |
| PA1–PA3 | ADC1_IN1–IN3 | Analog inputs shared with GPIO; support 0–3.6 V range and internal temperature sensor channel (ADC1_IN16) |
| NRST | Active-low reset | Asynchronous reset input with internal pull-up; accepts 10 µs minimum pulse width for reliable cold start |
Key Features
| Feature | Design Value |
|---|---|
| Embedded CRC calculation unit | Hardware-accelerated 32-bit CRC-32 for firmware image integrity verification during boot or OTA update |
| Programmable voltage detector (PVD) | Configurable trip points (2.2–2.9 V) enable brown-out detection and graceful shutdown before SRAM corruption |
| Temperature sensor | Calibrated ±1.5°C accuracy over –40 to +85°C; used for thermal derating in motor control or ambient monitoring |
| Serial wire debug (SWD) | 2-pin debug interface (SWDIO/SWCLK) replaces JTAG for reduced PCB footprint and in-system programming |
| VBAT supply domain | Independent 1.8–3.6 V backup rail powers RTC and 4 KB backup SRAM during main power loss |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Brushless DC (BLDC) motor commutation with field-oriented control (FOC) in HVAC blowers and pumps. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, simultaneous ADC sampling of three-phase currents, and generation of six-channel complementary PWM with dead-time insertion. Use Value: Integrated advanced timer eliminates need for external gate driver logic; USB enables configuration and firmware updates via PC tooling. |
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and CO₂ via I²C sensors. IC Role / Device Role / Timing Role: Low-power coordinator managing sensor polling, data fusion, CAN bus reporting, and RTC-based wake-up scheduling. Use Value: Stop/Standby modes achieve <1.5 µA VBAT current; integrated temperature sensor reduces BOM cost by eliminating discrete thermal sensing. |
| Automotive Diagnostic Tool | PLC I/O Module |
Use Scenario: Handheld OBD-II scanner interfacing with vehicle CAN network and displaying diagnostics via USB-connected tablet. IC Role / Device Role / Timing Role: CAN protocol stack processor with ISO 15765-2 compliance and USB CDC-class virtual COM port bridging. Use Value: Dual CAN/USB integration avoids external bridge IC; 72 MHz CPU handles concurrent CAN message filtering and USB bulk transfer without latency. |
Use Scenario: DIN-rail mounted digital I/O expansion module for industrial PLCs with isolated inputs/outputs. IC Role / Device Role / Timing Role: Central controller managing opto-isolated GPIO banks, SPI-driven DACs for analog outputs, and watchdog supervision of field-side logic. Use Value: 26 GPIOs with 5 V tolerance simplify interface to legacy 24 V industrial sensors; CRC unit ensures reliable firmware execution in EMI-heavy environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103C8T6 | LQFP48 package (7 × 7 mm), 64 KB Flash, same peripherals and clock tree | Higher pin count (48 vs 36) eases routing but increases board area; lower Flash limits complex protocol stacks | Select when layout requires more GPIOs or debug signals (e.g., SWD + JTAG + UART), and Flash headroom is sufficient |
| STM32F303CBT6 | Same VFQFPN36 package, 128 KB Flash, but Cortex-M4F core with FPU and enhanced ADC (16-bit oversampling) | Supports floating-point math for predictive maintenance algorithms; higher ADC resolution improves current sensing accuracy | Select when motor control requires real-time FFT or sensor fusion with floating-point precision |
Compared with STM32F103C8T6, STM32F103TBU6TR offers 100% more Flash in identical footprint for future-proof firmware; versus STM32F303CBT6, it trades FPU and ADC enhancement for lower cost and proven qualification in automotive-grade designs.
Availability
STM32F103TBU6TR is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, and automotive diagnostic tools requiring stable component supply across extended product lifecycles.
Supply support for STM32F103TBU6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, and automotive ICs with vertical manufacturing and broad industrial qualification.
This part belongs to the STM32F1 Series - ST's mainstream Arm Cortex-M microcontroller family designed for cost-sensitive, high-reliability embedded control applications demanding rich analog integration and real-time responsiveness.
FAQ
What is the maximum operating temperature range for STM32F103TBU6TR?
The STM32F103TBU6TR is rated for industrial temperature range: –40°C to +85°C ambient. Its VFQFPN36 package achieves junction-to-ambient thermal resistance (RθJA) of 49.5°C/W under standard JEDEC 2-layer board conditions, enabling continuous operation at full 72 MHz with ≤1.5 W power dissipation.
Does STM32F103TBU6TR support USB device mode without external components?
Yes. The part integrates a full-speed USB 2.0 transceiver with internal pull-up on PA12 and differential termination. Only a single 1.5 kΩ pull-up resistor on D+ (PA12) and standard USB Type-A connector are required - no external PHY or level-shifter needed for CDC or HID class implementations.
How many ADC channels can be sampled simultaneously using DMA?
Up to 16 ADC channels can be sequenced via regular channel group with DMA trigger enabled. Dual ADC mode allows interleaved sampling of up to 8 channels per ADC (16 total) with synchronized start, achieving effective 2 MSPS aggregate throughput while maintaining 12-bit resolution and ±1 LSB INL.
Is the VFQFPN36 package RoHS-compliant and halogen-free?
Yes. STM32F103TBU6TR carries ECOPACK®2 certification: fully RoHS-compliant (2011/65/EU), halogen-free (≤900 ppm bromine, ≤900 ppm chlorine), and compliant with REACH SVHC regulations. The package uses matte tin lead finish and lead-free solder reflow profile (JEDEC J-STD-020D).
STM32F103TBU6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 36-VFQFN Exposed Pad
- Series:
- STM32F1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 20K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F103TBU6TR FAQ
1.How can I place an order for STM32F103TBU6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F103TBU6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F103TBU6TR reliable?
The price and inventory of STM32F103TBU6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F103TBU6TR is usually 5 days.
3.What payment methods are accepted for STM32F103TBU6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F103TBU6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F103TBU6TR?
STM32F103TBU6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F103TBU6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F103TBU6TR?
For technical support, including STM32F103TBU6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F103TBU6TR requirements.
6.How does Aetrix verify that STM32F103TBU6TR is sourced from the original manufacturer or authorized distributors?
All STM32F103TBU6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F103TBU6TR meets industry standards.
7.What is the process for return or replacement of STM32F103TBU6TR?
All STM32F103TBU6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F103TBU6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F103TBU6TR part is unused and in its original packaging.
Return procedure for STM32F103TBU6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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