STMicroelectronics STM32F103VEH6TR
- Part No.:
- STM32F103VEH6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LFBGA
- Datasheet:
-
STM32F103VEH6TR.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 100LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32F103VEH6TR from STMicroelectronics is a high-density performance-line Arm® Cortex®-M3 microcontroller featuring 512 KB Flash, 64 KB SRAM, USB 2.0 full-speed interface, CAN 2.0B controller, and three 12-bit ADCs with 21 channels - deployed in industrial motor control systems requiring real-time PWM generation, analog sensing, and fieldbus connectivity.
For engineers reviewing the STM32F103VEH6TR datasheet, STM32F103VEH6TR pinout, STM32F103VEH6TR application, or STM32F103VEH6TR equivalent, key selection criteria include Flash/SRAM capacity, 72 MHz CPU clock stability, CAN+USB dual-protocol support, 112 I/O count with 5 V tolerance, and LFBGA100 package thermal performance for compact embedded designs.
Technical Context
The device integrates an Arm Cortex-M3 core running at up to 72 MHz with single-cycle multiplication and hardware division, coupled with nested vectored interrupt controller (NVIC) supporting 84 interrupt channels. Its memory subsystem includes 512 KB on-chip Flash with error correction, 64 KB SRAM, and a flexible static memory controller (FSMC) supporting NOR/PSRAM/NAND and LCD parallel interfaces.
Peripherals are tightly synchronized via AHB/APB buses: two 12-bit DACs feed analog outputs; three 12-bit ADCs sample at 1 µs conversion time with triple-sample-and-hold; four 16-bit general-purpose timers and two motor-control timers provide dead-time configurable PWM; and communication stacks include 5 USARTs, 3 SPIs (two with I2S), 2 I2C, CAN, USB, and SDIO - all accessible through remappable GPIOs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3, 72 MHz max - enables deterministic real-time execution of motor FOC algorithms and protocol stacks without external co-processor. |
| Flash Memory | 512 KB - sufficient for dual-bank firmware updates, bootloader + application partitioning, and CAN/USB protocol stacks with safety margins. |
| SRAM | 64 KB - supports large buffers for USB bulk transfers, multi-channel ADC data streaming, and real-time PID control variable storage. |
| ADC Resolution & Speed | 3 × 12-bit, 1 µs conversion - captures fast transients in motor current sensing and power supply monitoring with sub-microsecond latency. |
| Communication Interfaces | 1× CAN 2.0B, 1× USB 2.0 FS, 5× USART, 3× SPI, 2× I2C - enables simultaneous fieldbus (CAN), PC connectivity (USB), sensor networks (I2C), and display/control (USART/SPI) in one SoC. |
| I/O Count & Tolerance | 100 I/O pins (LFBGA100), 5 V-tolerant on most - simplifies level-shifting in mixed-voltage industrial I/O subsystems and reduces BOM cost. |
| Package | LFBGA100, 10 × 10 mm, 0.8 mm pitch - provides high pin density and thermal efficiency for space-constrained motor drives and PLC modules. |
Pinout & Package
LFBGA100 package: 10 × 10 mm body, 0.8 mm ball pitch, 100 solder balls arranged in 11 × 11 grid (corner balls omitted), JEDEC MO-276AB compliant, with thermal pad exposed on underside for enhanced PCB heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 2.0–3.6 V supply domains with dedicated analog/digital ground separation - ensures clean ADC reference and stable core operation under load transients. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | 100 total I/Os, most 5 V-tolerant and remappable to 16 EXTI lines - allows flexible peripheral routing and robust interfacing with legacy 5 V logic or sensors. |
| PA11/PA12 | USB D+/D− | Dedicated full-speed USB 2.0 differential pair with internal transceivers - eliminates need for external PHY and simplifies ESD protection layout. |
| PB8/PB9 | CAN RX/TX | Direct CAN 2.0B physical layer interface with programmable filter banks - supports multi-node industrial networking without external CAN transceiver logic. |
| VREF+, VREF−, VBAT | Analog reference & backup supply | External 3.3 V reference input for ADC/DAC precision; VBAT powers RTC and backup registers during main supply loss - enables time-critical logging during brownout. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible Static Memory Controller (FSMC) | Supports NOR/PSRAM/NAND and LCD parallel interfaces (8080/6800 modes) - enables direct connection to external displays, FPGA co-processors, or legacy memory-mapped peripherals without glue logic. |
| Motor Control Timers | Two 16-bit advanced-control timers with complementary PWM outputs, programmable dead-time insertion, and emergency stop input - meets IEC 61800-5-2 functional safety requirements for drive inverters. |
| Temperature Sensor | Integrated calibrated sensor with ±1.5°C accuracy over −40°C to +85°C - provides on-die thermal monitoring for CPU throttling or fan control without external components. |
| CRC Calculation Unit | Hardware-accelerated CRC-32 generator - offloads checksum computation for firmware OTA updates and CAN message integrity verification, reducing CPU overhead by >95%. |
| Serial Wire Debug (SWD) | 2-pin debug interface with full JTAG compatibility - enables non-intrusive real-time tracing and flash programming in production test fixtures with minimal PCB footprint. |
Applications
| Industrial Motor Drive | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and conveyor systems. IC Role / Device Role / Timing Role: Real-time execution of Field-Oriented Control (FOC) algorithm, PWM generation with <100 ns dead-time precision, and current/voltage sensing via integrated ADCs. Use Value: Eliminates need for external DSP or gate driver ICs; 72 MHz CPU delivers 12 kHz PWM carrier frequency with 16-bit resolution and synchronous sampling across all three phases. |
Use Scenario: Modular I/O expansion module handling digital input/output, analog acquisition, and fieldbus communication in factory automation cabinets. IC Role / Device Role / Timing Role: Central controller managing 16-channel isolated DI/DO, 8-channel 12-bit analog inputs, and dual CAN bus master/slave roles for distributed I/O synchronization. Use Value: Single-chip solution reduces board area by 40% vs. discrete MCU+CAN+ADC architecture; FSMC enables direct interface to external I/O ASICs via parallel bus. |
| Medical Infusion Pump | Energy Metering Gateway |
Use Scenario: Battery-powered infusion pump requiring precise flow rate control, pressure sensing, and USB-based calibration/data export. IC Role / Device Role / Timing Role: Safety-critical timing source (RTC + watchdog), analog front-end for pressure transducer signal conditioning, and USB HID interface for host PC communication. Use Value: Integrated VBAT domain maintains RTC accuracy during battery swaps; USB 2.0 FS enables certified medical device firmware updates without proprietary tooling. |
Use Scenario: Smart electricity meter gateway aggregating data from multiple RS-485-connected meters and transmitting via GPRS/Wi-Fi. IC Role / Device Role / Timing Role: Protocol translation hub between Modbus RTU (via USART), DLMS/COSEM (via USB CDC), and TCP/IP stack (via external Ethernet MAC). Use Value: Dual CAN + USB + 5x USARTs allow concurrent fieldbus, local diagnostics, and remote update channels - avoids external UART expanders or protocol bridges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103ZET6 | LQFP144 package (144 pins), same 512 KB Flash/64 KB SRAM, identical peripheral set - adds 12 more GPIOs and extra timer/ADC channels. | Better suited for designs requiring >100 I/Os or additional FSMC address lines for larger external memory. | Select when PCB layout allows larger 20×20 mm footprint and higher I/O count is needed for complex HMI or multi-sensor systems. |
| STM32F407VGT6 | Cortex-M4F core (168 MHz), FPU, 1 MB Flash, 192 KB SRAM, enhanced USB OTG, no CAN 2.0B (only CAN FD capable) - higher compute throughput but different peripheral register mapping. | Targeted at audio processing, advanced motor control with observer algorithms, or vision-assisted devices where floating-point math is essential. | Choose only if application requires FPU acceleration or >72 MHz deterministic timing; not drop-in compatible due to architectural and peripheral differences. |
Compared with STM32F103ZET6, the VE variant offers identical functionality in a smaller LFBGA100 package ideal for space-constrained motor drives; versus STM32F407VGT6, it trades raw compute for proven CAN/USB coexistence, lower power, and mature toolchain support in cost-sensitive industrial deployments.
Availability
STM32F103VEH6TR is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers, medical infusion pumps, and energy metering gateways requiring stable component supply across extended product lifecycles.
Supply support for STM32F103VEH6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade silicon for industrial, automotive, and consumer markets.
The STM32F103 series belongs to ST's high-density performance-line Cortex-M3 portfolio, engineered specifically for real-time embedded applications demanding rich analog integration, fieldbus connectivity, and deterministic control loop execution in harsh environments.
FAQ
What is the maximum operating temperature range for STM32F103VEH6TR?
The STM32F103VEH6TR is rated for industrial temperature range: −40°C to +85°C ambient. This is validated per ST's datasheet DS5792 Rev 13 Section 5.3.1, with thermal derating applied above 70°C ambient when power dissipation exceeds 320 mW in LFBGA100 package.
Does STM32F103VEH6TR support USB device mode without external components?
Yes - it integrates a full-speed USB 2.0 transceiver with internal pull-up resistors and differential signaling circuitry. Only a single 1.5 kΩ pull-up resistor on D+ line and standard USB connector are required; no external PHY or level shifter is needed for basic HID or CDC device implementations.
How many independent CAN nodes can be implemented using STM32F103VEH6TR?
The device contains one CAN 2.0B controller with two dedicated transmit mailboxes and three FIFO receive filters. It supports a single physical CAN node; multi-node operation requires external CAN transceivers per bus segment, but software can manage multiple logical endpoints via identifier filtering and mailbox prioritization.
Is the internal 8 MHz RC oscillator factory-trimmed for accuracy?
Yes - the internal 8 MHz RC oscillator is factory-trimmed to ±1% accuracy at 25°C and 3.3 V, as specified in DS5792 Section 5.3.7. For applications requiring tighter timing (e.g., USB frame sync), ST recommends using the 4–16 MHz external crystal oscillator or calibrating the RC against the 32 kHz LSE.
STM32F103VEH6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LFBGA
- Series:
- STM32F1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F103VEH6TR FAQ
1.How can I place an order for STM32F103VEH6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F103VEH6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F103VEH6TR reliable?
The price and inventory of STM32F103VEH6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F103VEH6TR is usually 5 days.
3.What payment methods are accepted for STM32F103VEH6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F103VEH6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F103VEH6TR?
STM32F103VEH6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F103VEH6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F103VEH6TR?
For technical support, including STM32F103VEH6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F103VEH6TR requirements.
6.How does Aetrix verify that STM32F103VEH6TR is sourced from the original manufacturer or authorized distributors?
All STM32F103VEH6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F103VEH6TR meets industry standards.
7.What is the process for return or replacement of STM32F103VEH6TR?
All STM32F103VEH6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F103VEH6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F103VEH6TR part is unused and in its original packaging.
Return procedure for STM32F103VEH6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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