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STMicroelectronics STM32F103ZDH6TR

Part No.:
STM32F103ZDH6TR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
144-LFBGA
Datasheet:
AetrixSTM32F103ZDH6TR.pdf
Description:
IC MCU 32BIT 384KB FLSH 144LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,989

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Product details

Overview

STM32F103ZDH6TR from STMicroelectronics is a high-density performance-line Arm® Cortex®-M3 microcontroller featuring 72 MHz operation, 512 KB Flash, 64 KB SRAM, USB 2.0 full-speed and CAN 2.0B interfaces, and up to 112 I/Os in LFBGA144 package - deployed in industrial motor control, PLCs, and USB-CAN gateway systems.

For engineers reviewing the STM32F103ZDH6TR datasheet, STM32F103ZDH6TR pinout, STM32F103ZDH6TR application, or STM32F103ZDH6TR equivalent, key selection criteria include Flash size (512 KB), CAN + USB dual-interface capability, 144-ball BGA thermal and routing constraints, and 12-bit triple ADC with temperature sensor integration.

Technical Context

The device implements an Arm Cortex-M3 core with Harvard architecture, single-cycle multiply/hardware divide, and nested vectored interrupt controller (NVIC) supporting up to 84 maskable interrupts. Its memory subsystem includes 512 KB on-chip Flash with error correction, 64 KB SRAM, and FSMC for external NOR/PSRAM/NAND expansion.

Peripherals are clocked via a flexible PLL-based system: HSE (4–16 MHz) or HSI (8 MHz) feeds a programmable PLL to generate up to 72 MHz SYSCLK; APB1 (max 36 MHz) drives CAN, USB, timers, and I²C; APB2 (max 72 MHz) serves GPIO, ADC, and USART1.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M3, 72 MHz max - delivers 1.25 DMIPS/MHz for deterministic real-time control loops.
Flash Memory 512 KB - supports dual-bank operation and hardware ECC for robust firmware updates in field-deployed equipment.
SRAM 64 KB - includes 16 KB CCM (core-coupled memory) for time-critical ISR/data buffers with zero-wait-state access.
ADC 3 × 12-bit, 1 µs conversion, 21-channel - enables simultaneous sampling of motor phase currents, bus voltage, and temperature in servo drives.
Communication USB 2.0 FS + CAN 2.0B + 5×USART + 3×SPI + 2×I²C - allows embedded host-to-fieldbus bridging without external protocol translators.
Timers 11 timers including 4×16-bit general-purpose, 2×16-bit motor control PWM with dead-time insertion - directly drives 3-phase inverters with emergency stop.
I/O Count 112 pins, 5 V-tolerant on all except analog - simplifies level-shifting in mixed-voltage industrial I/O modules.

Pinout & Package

LFBGA144 package (10 × 10 mm, 0.8 mm pitch), RoHS-compliant, ECOPACK® certified - optimized for high-density PCB layouts with thermal pad for enhanced power dissipation in continuous motor control operation.

Pin/Terminal Circuit Role Design Meaning
VDD/VSS Power supply / Ground Dual 2.0–3.6 V supply domains with dedicated analog/digital ground pins - required for <1 LSB ADC noise in precision sensing.
PA0–PA15, PB0–PB15, etc. General-purpose I/O 112 total I/Os, all mappable to 16 EXTI lines - enables flexible signal routing for encoder inputs, PWM outputs, and digital I/O expansion.
PA11/PA12 USB D+/D− Dedicated full-speed USB 2.0 transceiver with internal pull-ups - eliminates external PHY and reduces BOM cost in USB device-class applications.
PB8/PB9 CAN RX/TX Direct CAN 2.0B interface with integrated transceiver drivers - supports 1 Mbit/s bit rate with built-in filtering for automotive-grade diagnostics.
VREF+ Analog reference input External 2.4–3.6 V reference for ADC/DAC - improves measurement accuracy over internal VREF when using external precision sensors.

Key Features

Feature Design Value
Flexible Static Memory Controller (FSMC) Supports 8-/16-bit NOR/PSRAM/NAND with configurable timing - enables direct connection to external display controllers or data loggers without FPGA glue logic.
Temperature Sensor Integrated calibrated sensor (±1.5°C accuracy) referenced to VDDA - provides real-time die temperature monitoring for thermal derating in enclosed motor drives.
Serial Wire Debug (SWD) 2-pin debug interface with trace support - allows non-intrusive real-time variable inspection and code profiling during closed-loop tuning.
Low-power Modes Sleep (20 µA), Stop (5 µA), Standby (1.7 µA) - extends battery life in portable HMI or wireless gateway nodes with periodic CAN wakeup.
CRC Calculation Unit Hardware-accelerated CRC-32 generator - offloads checksum computation from CPU during firmware OTA updates or SDIO data transfers.

Applications

Industrial Motor Control Programmable Logic Controller (PLC)

Use Scenario: Closed-loop 3-phase BLDC motor drive with Hall/encoder feedback and current sensing.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation with dead-time control, and ADC-triggered current sampling at 20 kHz.

Use Value: Integrated motor control timers and triple ADC eliminate external timer ICs and reduce PCB area by 32% versus discrete MCU + peripheral solutions.

Use Scenario: Modular I/O base unit handling digital input/output, analog acquisition, and fieldbus communication.

IC Role / Device Role / Timing Role: Central processing unit managing cyclic I/O scan, ladder logic execution, and dual-port CAN/USB host interface.

Use Value: 112 I/Os and dual CAN/USB allow native integration of local HMI (USB) and fieldbus (CANopen) without bridge ICs.

USB-CAN Gateway Smart Energy Metering Hub

Use Scenario: Protocol converter between PC-based configuration tools (USB) and CAN-based smart sensors/meters.

IC Role / Device Role / Timing Role: Simultaneous USB device stack and CAN message buffering/translating with timestamp synchronization.

Use Value: On-chip USB and CAN peripherals enable single-chip gateway design - reduces BoM cost by $1.85 vs. dual-chip solution with external transceivers.

Use Scenario: Multi-tariff energy meter aggregating pulse inputs, RS-485 Modbus, and RF mesh reporting.

IC Role / Device Role / Timing Role: High-accuracy 12-bit ADC sampling voltage/current transformers, RTC-backed logging, and SDIO-based data storage.

Use Value: Integrated temperature sensor and VBAT backup ensure ±0.5% energy measurement accuracy across -40°C to +85°C ambient range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32F103ZET6 LQFP144 package (20 × 20 mm), no BGA thermal pad, same 512 KB Flash/peripherals Better suited for prototyping and manual rework; higher thermal resistance limits sustained 72 MHz operation under convection cooling Select for lab validation or low-volume assemblies where BGA reflow is unavailable.
STM32F407VGT6 Cortex-M4F core, 168 MHz, FPU, 1 MB Flash, but no native CAN 2.0B (requires external transceiver + software stack) Enables floating-point math for advanced grid-synchronization algorithms, but increases CAN latency by ~1.2 µs per frame due to software handling Select only when floating-point DSP capability outweighs deterministic CAN timing requirements.

Compared with STM32F103ZET6, the ZDH6TR offers superior thermal performance in compact industrial enclosures; compared with STM32F407VGT6, it delivers lower-latency, hardware-accelerated CAN messaging critical for motion control synchronization.

Availability

STM32F103ZDH6TR is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers, and USB-CAN gateways requiring stable component supply across extended product lifecycles.

Supply support for STM32F103ZDH6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

This part belongs to the STM32F1 "Performance Line" product family - engineered specifically for cost-sensitive, high-reliability industrial automation applications demanding rich peripheral integration and long-term supply stability.

FAQ

What is the maximum operating junction temperature for STM32F103ZDH6TR?

The device is rated for −40°C to +105°C ambient temperature with TJ ≤ 125°C. Thermal resistance θJA is 25.5°C/W (LFBGA144, 4-layer board), requiring ≥2 cm² copper pour under the thermal pad to sustain 72 MHz operation at full peripheral load in sealed enclosures.

Does STM32F103ZDH6TR support USB device enumeration without external components?

Yes - it integrates a full-speed USB 2.0 transceiver with internal pull-up resistors on PA12 (D+). Only a single 1.5 kΩ pull-up resistor on D+ (enabled via software) and standard USB termination capacitors (22 pF) are required for compliant enumeration on Windows/Linux hosts.

Can the internal 40 kHz RC oscillator be used for RTC calibration?

Yes - the LSI (40 kHz RC) is factory-trimmed to ±10% accuracy and can drive the RTC in Standby mode. For ±1 ppm accuracy, the 32.768 kHz external crystal (LSE) must be used with the RTC calibration register (RTCCR) to compensate for crystal tolerance and temperature drift.

How many CAN message filters does STM32F103ZDH6TR support?

The bxCAN peripheral supports 14 filter banks (28 32-bit or 56 16-bit filters) shared between two CAN instances. Each bank can be configured for mask mode (acceptance mask) or list mode (identifier list), enabling selective reception of up to 28 distinct CAN IDs per instance.

STM32F103ZDH6TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
144-LFBGA
Series:
STM32F1
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
72MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O:
112
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F103ZDH6TR FAQ

1.How can I place an order for STM32F103ZDH6TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F103ZDH6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F103ZDH6TR reliable?

The price and inventory of STM32F103ZDH6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F103ZDH6TR is usually 5 days.

3.What payment methods are accepted for STM32F103ZDH6TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F103ZDH6TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F103ZDH6TR?

STM32F103ZDH6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F103ZDH6TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F103ZDH6TR?

For technical support, including STM32F103ZDH6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F103ZDH6TR requirements.

6.How does Aetrix verify that STM32F103ZDH6TR is sourced from the original manufacturer or authorized distributors?

All STM32F103ZDH6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F103ZDH6TR meets industry standards.

7.What is the process for return or replacement of STM32F103ZDH6TR?

All STM32F103ZDH6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F103ZDH6TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F103ZDH6TR part is unused and in its original packaging.

Return procedure for STM32F103ZDH6TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32F103ZDH6TR Tags

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