STMicroelectronics STM32F103ZET6
- Part No.:
- STM32F103ZET6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
STM32F103ZET6.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:13,491
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STM32F103ZET6 from STMicroelectronics is a high-density performance-line Arm® Cortex®-M3 microcontroller featuring 512 KB Flash, 64 KB SRAM, USB 2.0 full-speed and CAN 2.0B interfaces, 3×12-bit ADCs (21 channels), and 112 I/O pins in LQFP144 package - deployed in industrial motor control, PLC I/O modules, and USB-CAN bridge gateways.
For engineers reviewing the STM32F103ZET6 datasheet, STM32F103ZET6 pinout, STM32F103ZET6 application, or STM32F103ZET6 equivalent, key selection considerations include Flash/SRAM size, USB+CAN co-integration, 72 MHz real-time execution capability, and 112-pin LQFP thermal/mechanical suitability for industrial PCB layouts.
Technical Context
The STM32F103ZET6 implements an Arm Cortex-M3 core with Harvard architecture, 72 MHz max clock (0-wait-state Flash access), single-cycle multiply/hardware divide, and NVIC supporting 68 maskable interrupts. Its memory subsystem includes 512 KB on-chip Flash with ECC protection, 64 KB SRAM, and FSMC enabling direct interface to NOR/PSRAM/NAND and CompactFlash.
Clock management integrates four oscillators: 4–16 MHz HSE crystal input, 8 MHz factory-trimmed HSI RC, 40 kHz LSI RC, and 32.768 kHz LSE for RTC - all feeding a PLL capable of generating system clocks up to 72 MHz. Peripheral timing is synchronized via APB1 (36 MHz) and APB2 (72 MHz) buses with configurable prescalers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M3, 72 MHz max - enables deterministic real-time control loops with ≤14 ns instruction cycle time. |
| Flash Memory | 512 KB - sufficient for dual-bank firmware updates and complex protocol stacks (USB + CAN + TCP/IP). |
| SRAM | 64 KB - supports large buffers for USB endpoint FIFOs, CAN message queues, and ADC data streaming. |
| ADC | 3 × 12-bit, 1 µs conversion, 21 channels - allows simultaneous sampling across motor phase currents, temperature sensors, and analog inputs. |
| Timers | Up to 11 timers including 4×16-bit general-purpose, 2×16-bit motor control PWM with dead-time insertion - meets IEC 60730 Class B functional safety timing requirements. |
| Communication | USB 2.0 FS + CAN 2.0B + 5×USART + 3×SPI + 2×I²C - enables embedded gateway functionality bridging fieldbus (CAN) and host PC (USB). |
| I/O Pins | 112 GPIO, 5 V-tolerant on most - simplifies level-shifting in mixed-voltage industrial sensor/actuator interfacing. |
| Package | LQFP144 (20 × 20 mm, 0.5 mm pitch) - provides mechanical robustness and thermal dissipation for extended industrial temperature operation (–40°C to +85°C). |
Pinout & Package
LQFP144 (20 × 20 mm, 0.5 mm pitch) package with exposed thermal pad; rated for industrial temperature range (–40°C to +85°C) and RoHS-compliant ECOPACK® construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power domains with separate decoupling - critical for ADC/DAC noise immunity. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | 112 total GPIOs, most 5 V-tolerant and remappable to 16 EXTI lines - enables flexible peripheral routing and ESD-hardened sensor interface. |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | On-chip transceiver with internal pull-ups - eliminates external PHY, reducing BOM cost for USB device-class applications. |
| CAN_RX / CAN_TX | CAN 2.0B physical layer interface | Direct connection to external CAN transceiver (e.g., TJA1050) - supports 1 Mbit/s bus rate in industrial automation networks. |
| OSC_IN / OSC_OUT | HSE crystal oscillator terminals | Supports 4–16 MHz quartz crystal - provides precise timing source for USB frame sync and CAN bit timing calibration. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up and Schmitt trigger - ensures reliable de-assertion during power ramp and brown-out conditions. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible Static Memory Controller (FSMC) | Direct interface to external NOR/PSRAM/NAND and CompactFlash - enables local HMI display buffer or firmware storage expansion without external bus logic. |
| Triple 12-bit ADC with sample-and-hold | Simultaneous sampling across three independent ADCs - essential for vector-controlled PMSM/BLDC motor drives requiring synchronized current measurement. |
| Motor Control Timers with Dead-Time | Hardware-inserted dead-time (1–128 ns resolution) and emergency stop input - prevents shoot-through in 3-phase inverter gate drivers. |
| Serial Wire Debug (SWD) | 2-pin debug interface with full trace capability - reduces debug footprint vs JTAG and supports real-time variable monitoring in safety-critical firmware. |
| Temperature Sensor + VREFINT | Calibrated on-die temperature sensor (±1.5°C accuracy) and internal voltage reference - enables self-calibrating analog measurements without external components. |
Applications
| Industrial Motor Drive | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Closed-loop field-oriented control of 3-phase AC induction or BLDC motors in HVAC compressors and conveyor systems. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm at 10–20 kHz PWM carrier frequency, synchronized ADC sampling, and hardware dead-time generation. Use Value: Eliminates need for external timer ASIC or FPGA; 72 MHz core delivers >1000 DMIPS for PID + Clarke/Park transforms within 50 µs loop time. | Use Scenario: Modular I/O base unit handling digital input debouncing, analog sensor acquisition, and CANopen master communication. IC Role / Device Role / Timing Role: Central controller managing 32-channel DI/DO, 8-channel AI, and multi-node CANopen network supervision. Use Value: Integrated CAN + USB + 112 GPIO enables unified diagnostics port and fieldbus interface - reduces interposer board count by 1–2 layers. |
| USB-to-CAN Bridge | Smart Energy Metering Gateway |
Use Scenario: Protocol converter between PC-based configuration tools (USB CDC ACM) and industrial CAN networks (J1939, CANopen). IC Role / Device Role / Timing Role: Dual-role USB device stack and CAN controller with message filtering and TX/RX FIFO buffering. Use Value: On-chip USB transceiver and CAN controller eliminate two external ICs; 512 KB Flash stores dual firmware images for fail-safe field updates. | Use Scenario: Substation-level energy aggregator collecting meter data via RS-485 Modbus and forwarding via CAN/LTE to SCADA. IC Role / Device Role / Timing Role: Secure data concentrator with RTC-backed timestamping, AES-128 encryption offload, and watchdog-monitored CAN/UART comms. Use Value: Integrated 32 kHz RTC with VBAT backup and 64 KB SRAM retain critical logs during mains failure - meets IEC 62056-21 data integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VET6 | LQFP100 package (100 pins), 512 KB Flash, 64 KB SRAM - lacks 12 additional GPIOs and 1 FSMC address line. | Suitable for space-constrained designs where <100 I/Os suffice and external memory interface is not required. | Select when PCB area is limited and full 112-pin I/O count or FSMC-driven display/NOR flash is unnecessary. |
| STM32F407VGT6 | Cortex-M4F core, 168 MHz, 1 MB Flash, FPU, no native CAN 2.0B (requires external transceiver + software stack), USB OTG HS support. | Better for floating-point intensive tasks (FFT, audio processing) but increases BOM cost and firmware complexity for basic CAN+USB use cases. | Choose only if FPU, higher clock speed, or USB OTG host capability is mandatory - not a drop-in replacement for STM32F103ZET6's integrated CAN+USB device functionality. |
Compared with STM32F103VET6, the ZET6 adds 12 GPIOs and FSMC for external memory - critical for HMI or firmware update storage; versus STM32F407VGT6, it trades FPU and speed for lower cost, simpler CAN integration, and proven industrial qualification.
Availability
STM32F103ZET6 is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers, and USB-CAN protocol bridges requiring stable component supply across long-lifecycle production programs.
Supply support for STM32F103ZET6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs - with over 40 years of industrial-grade product validation.
The STM32F103 performance line targets cost-sensitive, high-reliability embedded applications demanding rich analog/peripheral integration, USB/CAN connectivity, and deterministic real-time execution - optimized for industrial automation and smart infrastructure.
FAQ
What is the maximum operating temperature range for STM32F103ZET6?
The STM32F103ZET6 is specified for industrial temperature range: –40°C to +85°C ambient. It features internal temperature sensor calibrated across this range (±1.5°C accuracy) and thermal shutdown protection triggered above 125°C junction temperature - validated per JEDEC JESD22-A104 reliability testing.
Does STM32F103ZET6 support USB device mode without external components?
Yes - the part integrates a full-speed USB 2.0 transceiver with internal pull-up resistors on USB_DP, eliminating need for external PHY or discrete pull-ups. It supports CDC, HID, and MSC device classes via ST's HAL/LL libraries and passes USB-IF compliance testing when laid out per AN2891 layout guidelines.
How many CAN message objects can STM32F103ZET6 handle simultaneously?
The integrated bxCAN controller supports 14 total mailboxes: 2 dedicated transmit and 3 dedicated receive mailboxes, plus 9 scalable filter banks. With standard 11-bit identifiers, it handles up to 28 unique CAN IDs in receive filter mode - sufficient for CANopen NMT and PDO traffic in 8-node networks.
Is the FSMC interface compatible with common parallel LCD controllers?
Yes - the FSMC supports 8080 and 6800 bus modes with programmable timing (address/setup/hold/wait cycles), enabling direct connection to ILI9341, SSD1963, and RA8875 controllers. It delivers up to 14 MHz pixel clock for QVGA RGB565 displays without external glue logic or FPGA bridging.
STM32F103ZET6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 144-LQFP
- Series:
- STM32F1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 21x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F103ZET6 FAQ
1.How can I place an order for STM32F103ZET6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F103ZET6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F103ZET6 reliable?
The price and inventory of STM32F103ZET6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F103ZET6 is usually 5 days.
3.What payment methods are accepted for STM32F103ZET6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F103ZET6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F103ZET6?
STM32F103ZET6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F103ZET6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F103ZET6?
For technical support, including STM32F103ZET6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F103ZET6 requirements.
6.How does Aetrix verify that STM32F103ZET6 is sourced from the original manufacturer or authorized distributors?
All STM32F103ZET6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F103ZET6 meets industry standards.
7.What is the process for return or replacement of STM32F103ZET6?
All STM32F103ZET6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F103ZET6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F103ZET6 part is unused and in its original packaging.
Return procedure for STM32F103ZET6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32F103ZET6 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

