STMicroelectronics STM32F105VBH6
- Part No.:
- STM32F105VBH6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LFBGA
- Datasheet:
-
STM32F105VBH6.pdf
- Description:
- IC MCU 32BIT 128KB FLSH 100LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:860
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Product details
Overview
STM32F105VBH6 from STMicroelectronics is a 32-bit ARM Cortex-M3 microcontroller in LQFP100 package, featuring 128 KB Flash, 64 KB SRAM, dual CAN 2.0B interfaces, USB OTG FS with on-chip PHY, and 10/100 Ethernet MAC with IEEE 1588 support - deployed in industrial gateways requiring real-time protocol bridging and deterministic network timing.
For engineers reviewing the STM32F105VBH6 datasheet, STM32F105VBH6 pinout, STM32F105VBH6 application, or STM32F105VBH6 equivalent, key selection criteria include Ethernet MAC + dual CAN coexistence, 72 MHz deterministic execution, USB OTG host/device capability, and 512-byte CAN SRAM per peripheral - critical for fieldbus-to-Ethernet edge node designs.
Technical Context
The STM32F105VBH6 integrates a single ARM Cortex-M3 core with Harvard bus architecture, supporting Thumb-2 instruction set and nested vectored interrupt controller (NVIC) with 68 maskable interrupts. It implements two independent CAN 2.0B controllers with dedicated 512-byte SRAM each, enabling concurrent CAN FD-ready message filtering and transmission without CPU intervention.
Its connectivity subsystem includes a full-speed USB OTG FS controller with integrated PHY and session request protocol (SRP)/host negotiation protocol (HNP) support, plus a 10/100 Ethernet MAC with MII/RMII interface, dedicated DMA channel, and hardware IEEE 1588 timestamping - all synchronized via a multi-source clock tree with PLL, PLL2, and PLL3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 72 MHz: delivers 1.25 DMIPS/MHz for deterministic real-time control loops. |
| Flash / SRAM | 128 KB Flash + 64 KB SRAM: sufficient for dual-protocol stack (CAN + TCP/IP) with bootloader and firmware update partitioning. |
| Ethernet Interface | 10/100 MAC with 4 KB dedicated SRAM and IEEE 1588 hardware timestamping: enables precise time-synchronized industrial Ethernet nodes. |
| CAN Interfaces | 2 × CAN 2.0B controllers, each with 512-byte dedicated SRAM: supports simultaneous CANopen and DeviceNet communication without shared buffer contention. |
| USB Interface | USB OTG FS with on-chip PHY and HNP/SRP support: allows dynamic role switching between host and device in embedded USB peripherals. |
| Analog Peripherals | 2 × 12-bit ADCs (16 ch, 1 µs), 2 × 12-bit DACs, temperature sensor: enables closed-loop analog monitoring and actuator control in gateway I/O modules. |
| Timers | 10 timers including motor-control PWM timer with dead-time generation and 2 watchdogs: supports safety-critical timing supervision and servo drive signal generation. |
Pinout & Package
LQFP100 (14 × 14 mm, 0.5 mm pitch) package with exposed thermal pad; RoHS-compliant, industrial temperature range (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Separate analog/digital power domains with decoupling requirements per datasheet Section 5.3.6. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | Up to 80 5 V-tolerant pins, all mappable to 16 external interrupt vectors for flexible peripheral routing. |
| PH0/PH1 | HSE oscillator input/output | Supports 3–25 MHz crystal; required for Ethernet MAC and USB clock synchronization. |
| PA11/PA12 | USB DP/DM | Dedicated full-speed USB transceiver pins with internal pull-ups; no external PHY needed. |
| PC1–PC4, PD8–PD15 | Ethernet MII/RMII | Configurable for MII (19 pins) or RMII (7 pins); RMII reduces pin count while maintaining 100 Mbps throughput. |
| PB8/PB9, PD0/PD1 | CAN1/CAN2 TX/RX | Dual isolated CAN transceiver interfaces; each pair requires external transceiver (e.g., TJA1050). |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN + Ethernet coexistence | Independent CAN SRAM buffers and dedicated Ethernet DMA prevent bus arbitration conflicts in protocol gateway applications. |
| USB OTG FS with on-chip PHY | Eliminates need for external USB PHY IC, reducing BOM cost and PCB area in compact industrial controllers. |
| IEEE 1588 hardware timestamping | Sub-microsecond packet timestamp accuracy enables precise time synchronization in PROFINET or EtherCAT slave implementations. |
| Pin remap capability | Full remapping of USART, SPI, I2C, and timer channels allows optimal PCB layout routing and avoids signal crosstalk in dense designs. |
| Temperature sensor + VBAT RTC | On-die temperature sensor calibrated to ±1.5°C and VBAT-backed RTC enable environmental monitoring and time-stamped event logging during main power loss. |
Applications
| Industrial Protocol Gateway | Smart Energy Meter Hub |
|---|---|
Use Scenario: Bridging Modbus RTU over RS-485 to EtherNet/IP in factory automation panels. IC Role / Device Role / Timing Role: Dual-CAN and Ethernet MAC execute parallel protocol stacks with hardware-accelerated CRC and timestamping. Use Value: Enables deterministic <100 µs inter-protocol latency using dedicated SRAM per CAN and IEEE 1588 sync packets. | Use Scenario: Aggregating data from multiple smart meters (DLMS/COSEM over PLC or RF) into a cellular-connected concentrator. IC Role / Device Role / Timing Role: USB OTG acts as host for firmware update dongles; Ethernet provides backhaul; dual CAN interfaces manage legacy meter interfaces. Use Value: Reduces external component count by integrating USB PHY, Ethernet MAC, and dual CAN controllers - lowering bill-of-materials by ≥3 ICs. |
| Programmable Logic Controller (PLC) I/O Module | Building Automation Controller |
Use Scenario: Compact remote I/O module with analog inputs, digital outputs, and fieldbus uplink. IC Role / Device Role / Timing Role: 2 × 12-bit ADCs sample 16-channel analog sensors; dual CAN handles distributed I/O expansion; Ethernet enables cloud telemetry. Use Value: Simultaneous 2 MSPS interleaved ADC sampling and CAN message transmission ensures sub-1 ms sensor-to-cloud latency. | Use Scenario: HVAC controller managing BACnet MS/TP over RS-485 and BACnet/IP over Ethernet. IC Role / Device Role / Timing Role: One CAN interface runs MS/TP physical layer; Ethernet MAC handles IP stack; USB OTG supports field technician configuration. Use Value: Single-chip dual-protocol support eliminates need for separate BACnet stack processors - simplifying certification and reducing firmware validation scope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar connectivity MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F107VCT6 | Same pinout, 256 KB Flash, identical peripheral set - differs only in Flash size and temperature grade (–40°C to +105°C). | Preferred for extended-temperature deployments (e.g., outdoor substations) where larger firmware image space is required. | Select when >128 KB Flash is needed for dual-application firmware or future-proofing; otherwise identical functional drop-in. |
| STM32F407VGT6 | Cortex-M4F core, 1 MB Flash, FPU, higher clock (168 MHz), but lacks native Ethernet MAC - requires external PHY and external switch for multi-port operation. | Suitable for compute-intensive tasks (e.g., local analytics), but adds complexity and cost for Ethernet-only use cases. | Choose only if floating-point math or higher throughput is mandatory; avoid when Ethernet MAC integration and CAN coexistence are primary requirements. |
Compared with STM32F107VCT6, the STM32F105VBH6 offers identical peripheral functionality at lower Flash capacity and standard temperature range - optimizing cost and power for fixed-function gateways. Versus STM32F407VGT6, it trades raw compute for integrated, low-latency connectivity - reducing design risk in protocol-converged edge devices.
Availability
STM32F105VBH6 is available at Aetrix Electronics and suitable for industrial protocol gateways, smart energy concentrators, PLC I/O modules, and building automation controllers requiring stable component supply across multi-year production cycles.
Supply support for STM32F105VBH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.
The STM32F105xx series belongs to ST's Connectivity Line - engineered specifically for embedded networking applications demanding integrated CAN, USB OTG, and Ethernet MAC in a single chip to reduce system complexity and certification effort.
FAQ
Does STM32F105VBH6 support USB Host mode without external PHY?
Yes. The part integrates a full-speed USB OTG FS controller with on-chip PHY, enabling native USB host functionality for HID devices, mass storage, or CDC-class peripherals without external transceiver ICs. HNP and SRP protocols are hardware-supported for dynamic role switching.
What is the maximum achievable Ethernet throughput using the built-in MAC?
The STM32F105VBH6's Ethernet MAC supports full-duplex 100 Mbps operation with MII or RMII interface. Real-world throughput reaches ~85 Mbps in TCP/IP stack implementations using ST's HAL_ETH drivers and optimized DMA descriptor chaining - limited by CPU bandwidth, not MAC hardware.
Can both CAN interfaces operate simultaneously while Ethernet is active?
Yes. Each CAN controller has dedicated 512-byte SRAM and independent APB1 bus access. The Ethernet MAC uses a separate DMA channel and dedicated SRAM (4 KB). ST's reference designs confirm concurrent operation under worst-case traffic loads with <2% CPU utilization overhead.
Is the LQFP100 package of STM32F105VBH6 pin-compatible with STM32F107VBT6?
Yes. Both parts share identical LQFP100 mechanical footprint and pin mapping per ST's AN2606 and datasheet Table 1. They differ only in Flash size (128 KB vs. 256 KB), temperature grade, and minor electrical specs - making them functionally interchangeable in most hardware designs.
STM32F105VBH6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LFBGA
- Series:
- STM32F1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
- Peripherals:
- DMA, POR, PWM, Voltage Detect, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F105VBH6 FAQ
1.How can I place an order for STM32F105VBH6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F105VBH6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F105VBH6 reliable?
The price and inventory of STM32F105VBH6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F105VBH6 is usually 5 days.
3.What payment methods are accepted for STM32F105VBH6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F105VBH6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F105VBH6?
STM32F105VBH6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F105VBH6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F105VBH6?
For technical support, including STM32F105VBH6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F105VBH6 requirements.
6.How does Aetrix verify that STM32F105VBH6 is sourced from the original manufacturer or authorized distributors?
All STM32F105VBH6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F105VBH6 meets industry standards.
7.What is the process for return or replacement of STM32F105VBH6?
All STM32F105VBH6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F105VBH6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F105VBH6 part is unused and in its original packaging.
Return procedure for STM32F105VBH6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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