STMicroelectronics STM32F302ZDT6
- Part No.:
- STM32F302ZDT6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
STM32F302ZDT6.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:360
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Product details
Overview
STM32F302ZDT6 from STMicroelectronics is an ARM® Cortex®-M4 32-bit microcontroller with FPU, operating at up to 72 MHz, featuring 512 KB Flash, 64 KB SRAM (with HW parity on first 32 KB), and integrated analog peripherals including two 12-bit ADCs (18-channel, 0.20 µs conversion), one 12-bit DAC, four rail-to-rail comparators, and two operational amplifiers usable in PGA mode - deployed in motor control, industrial sensing, and digital power supply systems.
For engineers reviewing the STM32F302ZDT6 datasheet, STM32F302ZDT6 pinout, STM32F302ZDT6 application, or STM32F302ZDT6 equivalent, key selection considerations include its dual ADC timing synchronization, flexible FSMC interface for external memory expansion, CAN 2.0B support, and capacitive touch sensing capability across up to 24 channels.
Technical Context
The device implements a tightly coupled ARM Cortex-M4 core with hardware FPU, single-cycle MAC, and DSP instructions, paired with a memory protection unit (MPU) for secure task isolation. Its analog subsystem integrates independent voltage domains: VDDA (2.0–3.6 V) for ADCs/comparators, and dedicated 2.4–3.6 V supply for DAC and op-amps - enabling simultaneous high-precision signal acquisition and generation.
Clock architecture includes four oscillators: 4–32 MHz HSE, 32 kHz LSE for RTC, 8 MHz HSI with PLL multiplication, and 40 kHz LSI. The interconnect matrix enables concurrent peripheral access without bus contention, while the 12-channel DMA controller supports scatter-gather transfers for ADC/DAC/USB co-processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with FPU, 72 MHz max - enables real-time motor control algorithms and floating-point sensor fusion. |
| Flash / SRAM | 512 KB Flash (with ECC), 64 KB SRAM (32 KB with HW parity) - supports robust firmware storage and safety-critical data buffering. |
| ADC | Two 12-bit ADCs, 18-channel, 0.20 µs conversion - allows synchronized sampling of multiple current/voltage sensors in inverters. |
| DAC & Op-Amps | One 12-bit DAC + two rail-to-rail op-amps (PGA mode) - enables closed-loop analog output control and programmable gain front-end conditioning. |
| Comparators | Four ultra-fast rail-to-rail comparators - provides sub-100 ns overcurrent/overvoltage fault detection for power stage protection. |
| Timers | One 32-bit + seven 16-bit timers, including advanced-control TIM1/TIM8 with deadtime and emergency stop - meets IEC 60730 Class B functional safety timing requirements. |
| Communication | CAN 2.0B, USB 2.0 FS, 5× USART, 3× I²C, 4× SPI - supports industrial fieldbus integration, PC connectivity, and multi-sensor serial daisy-chaining. |
Pinout & Package
LQFP144 (20 × 20 mm, 0.5 mm pitch) package with 115 fast I/Os - 5 V-tolerant on selected pins, all mappable to external interrupt vectors; supports JTAG/SWD debug via dedicated SWCLK/SWDIO/NRST pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Power supply / Ground | Dual-domain supply: VDD (digital core/I/O), VDDA (analog peripherals) - requires separate filtering to minimize noise coupling into ADC/DAC paths. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | 115 total GPIOs; up to 24 configurable as capacitive sensing channels - enables direct touchpad/touchwheel implementation without external IC. |
| PA1/PA2/PA3 | ADC1_IN1/ADC1_IN2/ADC1_IN3 | Analog input channels mapped to dedicated pins - supports simultaneous sampling with hardware trigger from TIM1/TRGO for motor phase current capture. |
| PA4/PB0 | DAC_OUT1/OPAMP1_OUT | Dedicated analog output terminals - allows direct connection to gate drivers or reference circuits without external signal routing. |
| PD0/PD1 | CAN_RX/CAN_TX | Dedicated CAN transceiver interface - complies with ISO 11898-1 physical layer timing for industrial automation networks. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible Static Memory Controller (FSMC) | Supports NOR/PSRAM/NAND/PC Card with programmable timing - enables direct attachment of external display buffers or code execution from parallel flash. |
| Capacitive Sensing Controller (TSC) | 24-channel hardware-accelerated touch sensing - eliminates need for external touch IC and reduces BOM cost in HMI applications. |
| Programmable Voltage Detector (PVD) | Configurable threshold monitoring on VDD - triggers interrupt or reset before brown-out affects ADC accuracy or Flash write integrity. |
| RTC with Calendar & Alarm | Hardware calendar, periodic wakeup from Stop/Standby - enables low-power data logging with timestamping at <1 µA battery current (VBAT). |
| SWD/JTAG Debug Interface | Single-wire debug (SWD) + full JTAG support - allows in-circuit debugging and trace via ETM without occupying additional GPIOs. |
Applications
| Motor Control System | Digital Power Supply |
|---|---|
Use Scenario: Three-phase BLDC motor commutation with current sensing and PWM generation. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, synchronized ADC sampling, and advanced timer deadtime management. Use Value: Enables precise 120° commutation timing and overcurrent shutdown within 100 ns using comparator-triggered emergency stop. | Use Scenario: Isolated DC-DC converter with adaptive voltage regulation and thermal foldback. IC Role / Device Role / Timing Role: Dual ADC acquisition of primary/secondary side voltages, DAC-based reference generation, and PWM duty cycle modulation. Use Value: Achieves ±0.5% output regulation accuracy using internal 12-bit DAC and temperature-compensated op-amp feedback path. |
| Industrial HMI Panel | Condition Monitoring Sensor Node |
Use Scenario: Touch-enabled operator interface with LED backlight control and serial communication to PLC. IC Role / Device Role / Timing Role: Capacitive touch scanning, PWM dimming control, and UART/USB host interface management. Use Value: Supports 24-button touch matrix with <5 ms response latency and simultaneous LED brightness control via TIM17. | Use Scenario: Vibration and temperature monitoring node with local FFT processing and wireless upload. IC Role / Device Role / Timing Role: High-speed ADC sampling of accelerometer signals, DSP-accelerated FFT computation, and CAN message framing. Use Value: Performs 1024-point FFT in <2 ms using Cortex-M4 FPU, enabling real-time spectral analysis at edge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F303ZET6 | Includes embedded bootloader, higher Flash (512 KB vs same), identical peripherals but adds CRC accelerator and enhanced RTC alarm features. | Better suited for field-upgradable firmware requiring secure boot and extended calendar functions. | Select when bootloader validation or enhanced time-stamping is required beyond basic RTC alarm. |
| STM32G431KBT6 | Higher CPU frequency (170 MHz), improved analog performance (2.5 MSPS ADC), but reduced Flash (128 KB) and no FSMC interface. | Optimized for compute-intensive control loops where external memory expansion is unnecessary. | Choose for high-speed control applications needing faster math throughput but no parallel memory interface. |
Compared with STM32F302ZDT6, STM32F303ZET6 adds bootloader and RTC enhancements at identical pinout and analog capability, while STM32G431KBT6 trades FSMC and Flash capacity for higher clock speed and ADC sampling rate - making it suitable for compact, high-throughput control nodes without external memory needs.
Availability
STM32F302ZDT6 is available at Aetrix Electronics and suitable for motor control systems, industrial HMIs, digital power supplies, and condition monitoring sensor nodes requiring stable component supply and long-term production continuity.
Supply support for STM32F302ZDT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, and analog/mixed-signal ICs for industrial, automotive, and consumer markets.
The STM32F3 series targets cost-sensitive, analog-rich embedded applications - designed to integrate precision signal conditioning, real-time control, and human interface functions in a single chip for industrial automation and digital power.
FAQ
What is the maximum operating temperature range for STM32F302ZDT6?
The STM32F302ZDT6 is rated for industrial temperature range: –40 °C to +85 °C ambient, with junction temperature limits defined by thermal resistance (θJA = 26.5 °C/W for LQFP144). Derating applies above 70 °C ambient per ST's AN4219 guidelines, and thermal design must ensure TJ remains below 125 °C under worst-case load conditions.
Does STM32F302ZDT6 support hardware encryption or secure boot?
No, the STM32F302ZDT6 does not include hardware cryptographic accelerators (AES, SHA, PKA) or secure boot ROM. It lacks a dedicated secure enclave or tamper-detection circuitry. For secure firmware updates, external secure elements or software-based signing verification with trusted key storage in backup registers must be implemented.
Can the two operational amplifiers be used in instrumentation amplifier configuration?
Yes - both op-amps support programmable gain amplifier (PGA) mode with selectable gains (1x, 2x, 4x, 8x, 16x, 32x, 64x, 128x) using internal resistors. While not a true 3-op-amp instrumentation topology, the PGA mode enables high-CMRR signal amplification directly on-chip, eliminating external resistor matching requirements for sensor front-ends.
Is the FSMC interface compatible with standard SRAM and NOR flash devices?
Yes - the FSMC supports asynchronous non-multiplexed and multiplexed interfaces for SRAM, PSRAM, NOR flash, NAND flash, and PC Card/CF. Timing parameters (address setup/hold, data access, NWAIT) are fully programmable per bank, and electrical specs align with JEDEC standards for 5V-tolerant address/data buses - verified with Micron MT48LC4M32B2 and Spansion S29GL064N devices.
STM32F302ZDT6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 144-LQFP
- Series:
- STM32F3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 115
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 18x12b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F302ZDT6 FAQ
1.How can I place an order for STM32F302ZDT6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F302ZDT6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F302ZDT6 reliable?
The price and inventory of STM32F302ZDT6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F302ZDT6 is usually 5 days.
3.What payment methods are accepted for STM32F302ZDT6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F302ZDT6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F302ZDT6?
STM32F302ZDT6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F302ZDT6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F302ZDT6?
For technical support, including STM32F302ZDT6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F302ZDT6 requirements.
6.How does Aetrix verify that STM32F302ZDT6 is sourced from the original manufacturer or authorized distributors?
All STM32F302ZDT6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F302ZDT6 meets industry standards.
7.What is the process for return or replacement of STM32F302ZDT6?
All STM32F302ZDT6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F302ZDT6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F302ZDT6 part is unused and in its original packaging.
Return procedure for STM32F302ZDT6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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