STMicroelectronics STM32F303C8Y6TR
- Part No.:
- STM32F303C8Y6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 49-UFBGA, WLCSP
- Datasheet:
-
STM32F303C8Y6TR.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,957
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Product details
Overview
STM32F303C8Y6TR from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, operating up to 72 MHz, featuring 64 KB Flash, 12 KB SRAM with hardware parity, and integrated analog peripherals including two 12-bit ADCs (0.20 µs conversion), three 12-bit DACs, three rail-to-rail comparators, and one programmable-gain operational amplifier - deployed in motor control, digital power conversion, and sensor signal conditioning systems.
For engineers reviewing the STM32F303C8Y6TR datasheet, STM32F303C8Y6TR pinout, STM32F303C8Y6TR application, or STM32F303C8Y6TR equivalent, key selection criteria include ADC/DAC co-sampling capability, op-amp PGA configuration for current sensing, CAN 2.0B interface support, and UFQFPN32 package thermal performance in space-constrained industrial controllers.
Technical Context
The device integrates an Arm Cortex-M4 core with single-cycle multiply and hardware divide, delivering 90 DMIPS at 72 MHz. Its analog subsystem includes dual independent ADCs with selectable 6/8/10/12-bit resolution, differential input support, and separate VDDA supply (2.0–3.6 V), enabling simultaneous high-speed acquisition of voltage and current signals in closed-loop control.
Clock architecture supports four oscillator sources: 4–32 MHz HSE crystal, 32 kHz LSE for RTC, 8 MHz HSI (PLL-tunable to 72 MHz), and 40 kHz LSI. The interconnect matrix enables concurrent peripheral access without bus contention, critical for real-time PWM generation, ADC triggering, and CAN message handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU, 72 MHz max - enables real-time DSP operations (e.g., PID + observer) in motor FOC without external coprocessor |
| Flash / SRAM | 64 KB Flash, 12 KB SRAM + 4 KB CCM-SRAM - sufficient for dual-bank firmware updates and real-time control buffers |
| ADC | 2 × 12-bit ADCs, 0.20 µs conversion, 21-channel mux - supports synchronized sampling of phase currents and DC-link voltage in 3-phase inverters |
| DAC | 3 × 12-bit DACs, 2.4–3.6 V analog supply - provides reference waveforms for analog comparators or biasing in sensor front-ends |
| Op-Amp | 1 rail-to-rail op-amp with PGA mode, 2.4–3.6 V supply - configurable as current-sense amplifier with gain up to 32×, eliminating external gain stages |
| CAN Interface | CAN 2.0B Active - enables robust fieldbus communication in industrial automation and automotive body electronics |
| Package | UFQFPN32 (5 × 5 mm, 0.5 mm pitch) - compact footprint with exposed thermal pad for enhanced heat dissipation in sealed enclosures |
Pinout & Package
STM32F303C8Y6TR uses the UFQFPN32 package (5 × 5 mm, 0.5 mm pitch) with an exposed thermal pad (EP) on the underside for improved thermal management in continuous-duty applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA | Power supply inputs | VDD = 2.0–3.6 V digital supply; VDDA = 2.0–3.6 V analog supply - requires separate filtering to maintain ADC/DAC SNR |
| VSS, VSSA | Ground returns | Digital and analog ground planes must be joined at single point near regulator to minimize noise coupling into analog circuits |
| PA0–PA15, PB0–PB15, PC13–PC15 | General-purpose I/O | 51 total GPIOs, all mappable to EXTI; up to 25 pins are 5 V-tolerant - simplifies level-shifting in mixed-voltage systems |
| PA1, PA2, PA3, PA4, PA5, PA6, PA7 | ADC1/2 inputs | Support simultaneous sampling across multiple channels - essential for three-phase motor current reconstruction |
| PA4, PA5, PA6 | DAC1/DAC2/DAC3 outputs | Independent buffered outputs with configurable trigger sources - used for programmable reference generation or waveform synthesis |
| PA0, PA1, PA2, PA3, PA6, PA7 | Comparator inputs (COMP1–COMP3) | Rail-to-rail inputs with internal hysteresis - enable fast overcurrent protection with sub-100 ns response |
| PA1, PA2, PA3, PA4, PA5, PA6, PA7 | Op-amp terminals (OPAMP1) | Non-inverting/inverting inputs and output accessible - allows direct connection to shunt resistor and feedback network |
| PD0, PD1 | CAN_RX / CAN_TX | Dedicated differential CAN transceiver interface - supports bit rates up to 1 Mbps with built-in protocol engine |
Key Features
| Feature | Design Value |
|---|---|
| Programmable-gain op-amp (PGA) | Configurable gain (1×, 2×, 4×, 8×, 16×, 32×) with internal resistors - eliminates external precision gain networks in current-sense amplifiers |
| Synchronized ADC-DAC operation | Hardware-triggered ADC conversions aligned with DAC update events - ensures deterministic timing for closed-loop control loops |
| Capacitive touch sensing (TSC) | 18-channel TSC supporting touchkeys, sliders, and wheels - enables user interface integration without external ICs |
| Advanced-control timer (TIM1) | 16-bit, 6-channel PWM with deadtime insertion and emergency stop - directly drives 3-phase gate drivers with fault-safe shutdown |
| RTC with calendar and alarm | Hardware calendar, periodic wakeup from Stop mode - supports low-power data logging and scheduled system wakeups |
Applications
| Motor Control | Digital Power Supply |
|---|---|
Use Scenario: Field-oriented control (FOC) of BLDC/PMSM motors in HVAC blowers and industrial pumps. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, synchronized ADC sampling of phase currents, and generation of six complementary PWM signals with deadtime. Use Value: Integrated op-amp and comparators enable single-chip current sensing and overcurrent protection, reducing BOM count by 3 discrete components. | Use Scenario: Digital AC/DC and DC/DC converters with adaptive voltage regulation and load transient response. IC Role / Device Role / Timing Role: Voltage/current loop controller with 12-bit DAC-generated references and ADC-monitored feedback paths. Use Value: Dual ADCs allow simultaneous measurement of input voltage, output voltage, and output current - enabling full-state feedback without multiplexing delay. |
| Sensor Signal Conditioning | Industrial CAN Node |
Use Scenario: Analog front-end for strain gauges, thermocouples, and RTDs in process instrumentation. IC Role / Device Role / Timing Role: Precision signal amplification (via PGA op-amp), filtering (via ADC oversampling), and linearization (via lookup tables in Flash). Use Value: On-chip 12-bit DACs provide programmable excitation currents for RTDs and bridge sensors - eliminating external DAC and current source ICs. | Use Scenario: Distributed I/O module in factory automation with local analog/digital monitoring and CAN backbone reporting. IC Role / Device Role / Timing Role: CAN protocol handler, analog sensor acquisition hub, and local decision node for alarm thresholds. Use Value: Hardware CAN controller with 14-message FIFO reduces CPU load by >40% vs software-implemented CAN stacks, improving deterministic response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F303K8T6 | LQFP32 package (7 × 7 mm), no exposed thermal pad, identical peripheral set | Better suited for prototyping and manual soldering due to larger pitch and visibility | Select when thermal constraints are relaxed and PCB assembly favors through-hole or reflow-friendly leads |
| STM32G431CBU6 | Higher ADC speed (3.6 MSPS vs 5 MSPS), enhanced op-amp bandwidth (10 MHz vs 2.4 MHz), same UFQFPN32 package | Targeted at higher-bandwidth control loops (e.g., servo drives) requiring faster analog processing | Choose when design requires >2 MSPS ADC throughput or >5 MHz op-amp GBW for wideband signal conditioning |
Compared with STM32F303K8T6, the STM32F303C8Y6TR offers superior thermal performance in dense layouts; versus STM32G431CBU6, it trades higher analog bandwidth for proven qualification in extended temperature industrial environments (-40°C to +105°C).
Availability
STM32F303C8Y6TR is available at Aetrix Electronics and suitable for motor control, digital power conversion, sensor signal conditioning, and industrial CAN node applications requiring stable component supply across multi-year production cycles.
Supply support for STM32F303C8Y6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The STM32F3 series targets cost-sensitive, analog-intensive embedded applications - emphasizing integrated precision analog peripherals, real-time control capability, and compact packaging for space-constrained industrial equipment.
FAQ
What is the maximum operating temperature range for STM32F303C8Y6TR?
The STM32F303C8Y6TR is qualified for industrial temperature range: –40 °C to +105 °C. This rating is verified per ST's ECOPACK2 compliance and JEDEC JESD47 stress testing, ensuring reliability in enclosed motor drives and power supplies without active cooling.
Does STM32F303C8Y6TR support hardware CRC calculation?
Yes, it includes a dedicated cyclic redundancy check (CRC) calculation unit compliant with IEEE-802.3, enabling fast integrity verification of Flash contents, communication payloads, or configuration data without CPU overhead - critical for functional safety diagnostics per IEC 61508.
Can the op-amp in STM32F303C8Y6TR drive capacitive loads directly?
No - the integrated op-amp is not unity-gain stable with capacitive loads >100 pF. For driving ADC inputs or filters, external isolation resistors (≥1 kΩ) are required. ST Application Note AN4272 specifies layout and compensation guidelines for stable operation.
Is the UFQFPN32 package of STM32F303C8Y6TR compatible with standard reflow profiles?
Yes - it follows JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) and supports standard lead-free reflow profiles (peak 260 °C, 10–30 sec). The exposed thermal pad must be soldered to a solid copper thermal plane using ≥50% solder paste coverage for mechanical and thermal reliability.
STM32F303C8Y6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 49-UFBGA, WLCSP
- Series:
- STM32F3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 15x12b; D/A 3x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F303C8Y6TR FAQ
1.How can I place an order for STM32F303C8Y6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F303C8Y6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F303C8Y6TR reliable?
The price and inventory of STM32F303C8Y6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F303C8Y6TR is usually 5 days.
3.What payment methods are accepted for STM32F303C8Y6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F303C8Y6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F303C8Y6TR?
STM32F303C8Y6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F303C8Y6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F303C8Y6TR?
For technical support, including STM32F303C8Y6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F303C8Y6TR requirements.
6.How does Aetrix verify that STM32F303C8Y6TR is sourced from the original manufacturer or authorized distributors?
All STM32F303C8Y6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F303C8Y6TR meets industry standards.
7.What is the process for return or replacement of STM32F303C8Y6TR?
All STM32F303C8Y6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F303C8Y6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F303C8Y6TR part is unused and in its original packaging.
Return procedure for STM32F303C8Y6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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