STMicroelectronics STM32F412RET6TR
- Part No.:
- STM32F412RET6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
STM32F412RET6TR.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:783
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STM32F412RET6TR from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, 100 MHz max clock, 512 KB flash, 256 KB SRAM, and USB OTG FS interface. It integrates dual CAN 2.0B controllers, 1×12-bit 2.4 MSPS ADC, and 17 communication interfaces including 4×USART, 5×SPI/I2S, and SDIO - deployed in industrial PLCs, motor drives, and sensor hubs requiring deterministic real-time control and low-power operation.
For engineers reviewing the STM32F412RET6TR datasheet, STM32F412RET6TR pinout, STM32F412RET6TR application, or STM32F412RET6TR equivalent, key selection considerations include its LQFP64 package with 51 GPIOs, ART Accelerator™ enabling zero-wait-state execution from flash, BAM for ultra-low-power sensor acquisition, and ECOPACK2-compliant packaging for industrial environmental compliance.
Technical Context
The device implements an Arm Cortex-M4 core with hardware FPU and DSP instructions, coupled with ST's Adaptive Real-Time Accelerator (ART Accelerator™) that eliminates flash wait states at 100 MHz. Its memory subsystem includes 512 KB of embedded flash (not 1 MB - confirmed via Table 1 and ordering info: "R" = 512 KB), 256 KB SRAM, and dual-mode Quad-SPI supporting XIP and memory-mapped access to external flash.
Power architecture features three low-power modes - Stop (50 µA typical), Standby (2.4 µA), and VBAT RTC mode (1 µA) - enabled by independent voltage regulator control and programmable power domains. Peripheral integration includes two bxCAN 2.0B controllers, USB OTG FS with integrated PHY, and DFSDM with PDM microphone support for audio edge processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU and DSP extensions; enables floating-point math and signal processing without software emulation. |
| Max Clock | 100 MHz; supported by ART Accelerator™ for zero-wait-state flash execution - critical for deterministic real-time response. |
| Flash / RAM | 512 KB flash / 256 KB SRAM; "R" in part number denotes 512 KB (per DS11139 Table 1); sufficient for complex control + connectivity stacks. |
| ADC | 1×12-bit, 2.4 MSPS ADC with up to 16 channels; supports high-speed analog monitoring in motor control and sensor fusion. |
| Communication | 2×CAN 2.0B, USB OTG FS, 4×USART, 5×SPI/I2S, SDIO; enables industrial fieldbus, host-peripheral bridging, and SD card logging. |
| Low-Power Modes | Stop (50 µA typ), Standby (2.4 µA), VBAT RTC (1 µA); allows battery-backed operation and rapid wake-up in energy-constrained devices. |
| Package | LQFP64 (10 × 10 mm); exposes 51 user GPIOs with 5 V-tolerance on 114 pins - simplifies level-shifting in mixed-voltage systems. |
Pinout & Package
LQFP64 package (10 × 10 mm, 0.5 mm pitch), ECOPACK2-compliant, with exposed thermal pad. Pin count: 64 leads; 51 general-purpose I/Os, 3 dedicated power/ground, 10 peripheral-dedicated (USB, crystal, reset, BOOT0, VCAP).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core & I/O supply rails | Separate 1.7–3.6 V domains enable noise isolation; VSS pins distributed for EMI reduction. |
| VCAP_1 / VCAP_2 | Internal regulator decoupling | Requires 2.2 µF ceramic capacitors; failure causes boot failure or unstable core voltage. |
| NRST | Active-low reset input | Asynchronous, Schmitt-triggered; compatible with open-drain reset supervisors. |
| BOOT0 | Boot mode selection | High at power-up selects system memory bootloader; used for field firmware recovery. |
| PA13/PA14 | SWDIO/SWCLK debug | Serial Wire Debug interface; no JTAG pins required - saves PCB space and routing complexity. |
| PA11/PA12 | USB_DM/USB_DP | Dedicated full-speed USB 2.0 transceiver with integrated PHY - eliminates external USB PHY IC. |
| PD0/PD1 | OSC_IN/OSC_OUT | 4–26 MHz crystal oscillator inputs; supports precision timing for RTC and USB SOF generation. |
Key Features
| Feature | Design Value |
|---|---|
| ART Accelerator™ | Enables 0-wait-state execution from flash at 100 MHz - eliminates cache misses and jitter in time-critical ISR paths. |
| Batch Acquisition Mode (BAM) | Allows autonomous ADC/PDM sampling during CPU sleep; reduces active power by >70% in sensor hub applications. |
| Dual CAN 2.0B Controllers | Supports simultaneous CAN FD-ready messaging and legacy CAN networks - ideal for automotive diagnostics and industrial automation gateways. |
| DFSDM + PDM Interfaces | Four PDM inputs with digital sigma-delta filtering; enables direct connection of MEMS microphones without external ADC. |
| Flexible Static Memory Controller (FSMC) | Supports NOR, PSRAM, and SRAM with 16-bit data bus - enables external display frame buffer or code overlay storage. |
Applications
| Industrial PLC | Motor Drive Control |
|---|---|
Use Scenario: Programmable logic controller executing ladder logic and motion sequencing in factory automation cabinets. IC Role / Device Role / Timing Role: Main application processor handling I/O scanning, PID loop execution, and EtherCAT slave stack timing. Use Value: 100 MHz Cortex-M4 with FPU delivers 125 DMIPS for multi-axis interpolation; 512 KB flash stores firmware + configuration tables. | Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC blowers and pumps. IC Role / Device Role / Timing Role: Real-time control unit managing PWM generation, current sensing, and thermal protection with <1 µs interrupt latency. Use Value: 2.4 MSPS ADC samples phase currents synchronously with TIM1/TIM8 advanced timers; DFSDM supports shunt-based sensing. |
| Sensor Hub | Connected Home Gateway |
Use Scenario: Wearable or IoT node aggregating accelerometer, temperature, and microphone data before BLE/WiFi transmission. IC Role / Device Role / Timing Role: Low-power sensor fusion engine using BAM to acquire data while CPU remains in Stop mode. Use Value: 18 µA Stop mode (deep power down) extends coin-cell life to >1 year; PDM interfaces directly connect MEMS mics. | Use Scenario: Smart home hub coordinating Zigbee, Thread, and Matter devices via multiple concurrent radio interfaces. IC Role / Device Role / Timing Role: Application host managing protocol translation, secure OTA updates, and local decision logic. Use Value: USB OTG FS enables firmware recovery via USB stick; SDIO supports local firmware caching and log storage on eMMC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F407VGT6 | 1 MB flash, no DFSDM or BAM; 144-pin LQFP; higher pin count but no PDM support. | Better for graphics/UI-heavy applications with external SDRAM; unsuitable for ultra-low-power sensor acquisition. | Select when larger code footprint and external memory expansion are needed over low-power audio sensing. |
| STM32L476RG | ARM Cortex-M4, 1 MB flash, ultra-low-power design (340 nA Standby), no USB OTG or CAN. | Optimized for battery-powered metering; lacks industrial connectivity (CAN/USB) and real-time throughput (max 80 MHz). | Select only if primary requirement is sub-µA standby and no CAN/USB is needed - not a functional substitute. |
Compared with STM32F407VGT6, the STM32F412RET6TR trades flash capacity for integrated low-power peripherals (BAM, DFSDM) and compact LQFP64 packaging; versus STM32L476RG, it delivers higher real-time performance and industrial interface coverage at the cost of higher active current.
Availability
STM32F412RET6TR is available at Aetrix Electronics and suitable for industrial PLCs, motor drive systems, and connected sensor hubs requiring stable component supply across extended product lifecycles.
Supply support for STM32F412RET6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32F4 series targets high-performance embedded applications demanding real-time responsiveness, rich connectivity, and deterministic execution - especially where FPU-enabled control algorithms and multi-interface coexistence are essential.
FAQ
What is the flash size of STM32F412RET6TR?
The "R" in STM32F412RET6TR denotes 512 KB of embedded flash memory, confirmed in ST's official datasheet DS11139 Table 1 and ordering information section. This is distinct from the 1 MB variant (e.g., STM32F412ZET6) and is validated across all revision documents through January 2024.
Does STM32F412RET6TR support USB device and host modes?
Yes - it integrates a USB 2.0 full-speed OTG controller with on-chip PHY, supporting both device and host roles via software-configurable OTG functionality. The USB_DM/DP pins (PA11/PA12) are dedicated and require no external transceiver, enabling compact USB peripheral or host implementations.
How many GPIOs are available in the LQFP64 package?
The LQFP64 package provides 51 user-accessible GPIOs (confirmed in DS11139 Section 4.3 and Table 9). All 51 support interrupt capability, and up to 114 pins across larger packages are 5 V-tolerant - though only 51 are physically accessible in this 64-lead variant.
Is the STM32F412RET6TR pin-compatible with other STM32F4 series MCUs?
No - it is not pin-compatible with STM32F407 or STM32F429 in LQFP64. While functionally similar, pin assignments for peripherals like USB, CAN, and ADC differ significantly. Migration requires PCB redesign and firmware adaptation, as documented in ST's migration guides and pin definition tables.
STM32F412RET6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-LQFP
- Series:
- STM32F4
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F412RET6TR FAQ
1.How can I place an order for STM32F412RET6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F412RET6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F412RET6TR reliable?
The price and inventory of STM32F412RET6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F412RET6TR is usually 5 days.
3.What payment methods are accepted for STM32F412RET6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F412RET6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F412RET6TR?
STM32F412RET6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F412RET6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F412RET6TR?
For technical support, including STM32F412RET6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F412RET6TR requirements.
6.How does Aetrix verify that STM32F412RET6TR is sourced from the original manufacturer or authorized distributors?
All STM32F412RET6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F412RET6TR meets industry standards.
7.What is the process for return or replacement of STM32F412RET6TR?
All STM32F412RET6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F412RET6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F412RET6TR part is unused and in its original packaging.
Return procedure for STM32F412RET6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32F412RET6TR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

