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STMicroelectronics STM32F412RGT6

Part No.:
STM32F412RGT6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixSTM32F412RGT6.pdf
Description:
IC MCU 32BIT 1MB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,491

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Product details

Overview

STM32F412RGT6 from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, 100 MHz max clock, 1 MB Flash, 256 KB SRAM, and integrated USB OTG FS, dual CAN 2.0B, and 17 communication interfaces. It delivers 125 DMIPS and supports real-time motor control, sensor hub operation, and industrial HMI in compact LQFP64 packaging.

For engineers reviewing the STM32F412RGT6 datasheet, STM32F412RGT6 pinout, STM32F412RGT6 application, or STM32F412RGT6 equivalent, key selection criteria include its 100 MHz ART Accelerator™-enabled flash execution, BAM for low-power sensor acquisition, 12-bit 2.4 MSPS ADC with up to 16 channels, dual CAN support, and ECOPACK2-compliant LQFP64 package.

Technical Context

The STM32F412RGT6 integrates an Arm Cortex-M4 core with hardware FPU and Adaptive Real-Time (ART) Accelerator™ enabling zero-wait-state execution from Flash at 100 MHz. Its memory subsystem includes 1 MB Flash with ECC, 256 KB SRAM, flexible FSMC for external NOR/PSRAM, and dual-mode Quad-SPI.

Peripherals are organized around a multi-AHB bus matrix with dedicated DMA streams: 17 timers (including two 32-bit advanced-control timers), 1×12-bit ADC (2.4 MSPS, 16 ch), DFSDM with PDM microphone support, USB OTG FS with integrated PHY, and dual bxCAN controllers compliant with ISO 11898-1.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M4 with FPU, 100 MHz max, 125 DMIPS @ Dhrystone 2.1
Memory1 MB Flash (ECC-enabled), 256 KB SRAM, FSMC + Quad-SPI for external memory expansion
ADC1×12-bit, 2.4 MSPS, up to 16 channels, with hardware oversampling and DFSDM support
TimersUp to 17 timers: twelve 16-bit, two 32-bit advanced-control (TIM1/TIM8), two watchdogs, SysTick
ConnectivityUSB OTG FS (with PHY), 2×CAN 2.0B, 4×I²C, 4×USART, 5×SPI/I²S, SDIO, LIN, IrDA
Power1.7–3.6 V supply; Run: 112 µA/MHz; Stop (fast wake): 50 µA typ; Standby: 2.4 µA (no RTC)
PackageLQFP64 (10 × 10 mm), ECOPACK2-compliant, 64-pin, 0.5 mm pitch

Pinout & Package

LQFP64 package: 64-pin quad flat pack, 10 × 10 mm body, 0.5 mm lead pitch, exposed thermal pad (EP), RoHS-compliant and ECOPACK2 certified.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 1.7–3.6 V core/analog supply rails; decoupling required per datasheet layout guidelines
PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15General-purpose I/OUp to 51 fast I/Os (100 MHz), 63 5V-tolerant pins; configurable as GPIO, AF, EXTI, or analog
NRSTActive-low reset inputAsynchronous reset with internal pull-up; accepts 1.65–5.5 V logic; supports external reset button or supervisor IC
BOOT0Boot mode selectionHigh at power-up enables system memory bootloader; pulled low via 10 kΩ resistor for normal Flash execution
USB_DP/USB_DMUSB 2.0 full-speed differential pairIntegrated PHY; requires 1.5 kΩ pull-up on DP for device mode; no external transceiver needed
CAN1_RX/CAN1_TX, CAN2_RX/CAN2_TXCAN 2.0B interface signalsDual independent CAN controllers; each requires external transceiver (e.g., TJA1042T/3) for bus connection

Key Features

FeatureDesign Value
ART Accelerator™Enables zero-wait-state 100 MHz execution from Flash, eliminating cache-related timing jitter in deterministic real-time loops
Batch Acquisition Mode (BAM)Allows CPU to sleep while peripherals (ADC, DFSDM, SPI) autonomously acquire and pre-process sensor data, reducing active power by >40% in sensor hubs
Dual CAN 2.0B controllersSupport concurrent CAN FD-ready messaging on separate buses-ideal for industrial PLC backplane and motor drive feedback networks
DFSDM + PDM interfaceFour PDM inputs with digital filtering enable direct stereo MEMS microphone interfacing without external codec, cutting BOM cost and PCB area
Flexible static memory controller (FSMC)Supports 8-/16-bit NOR/PSRAM with wait-state programmability-enables seamless integration of external display frame buffers or FPGA co-processors

Applications

Motor Control SystemIndustrial PLC I/O Module

Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC blowers and pump drives.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, PWM generation (via TIM1/TIM8), ADC sampling (2.4 MSPS synchronized capture), and CAN-based command feedback.

Use Value: 100 MHz deterministic timing ensures <500 ns PWM dead-time accuracy; dual CAN enables master-slave coordination across multiple drives.

Use Scenario: Distributed I/O node in modular PLC rack handling analog inputs (4–20 mA), digital I/O, and local safety logic.

IC Role / Device Role / Timing Role: Real-time I/O processor with high-speed ADC, isolated CAN communication, and watchdog supervision for SIL-2 compliance.

Use Value: 256 KB SRAM buffers sensor history during CAN bus arbitration gaps; BAM reduces average current to <15 µA in polling standby.

Wearable Sensor HubSmart Home Gateway

Use Scenario: Aggregation and preprocessing of accelerometer, gyroscope, and PDM microphone data in fitness trackers.

IC Role / Device Role / Timing Role: Low-power sensor fusion hub using DFSDM for voice wake-word detection and SPI-connected IMU.

Use Value: BAM + DFSDM offloads CPU during audio acquisition; 2.4 MSPS ADC supports oversampled biopotential sensing (ECG/EMG).

Use Scenario: Central gateway bridging Zigbee, BLE, and Wi-Fi modules while managing local UI, energy metering, and alarm logic.

IC Role / Device Role / Timing Role: Application processor running FreeRTOS, managing USB OTG host for firmware updates, SDIO for local storage, and dual CAN for legacy HVAC control.

Use Value: 1 MB Flash accommodates dual-application image + OTA update partition; USB OTG FS enables plug-and-play diagnostics via standard PC tools.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F405RGT6No BAM, no DFSDM, 1 MB Flash but only 192 KB SRAM, no USB OTG FS PHYLacks integrated audio preprocessing and low-power sensor acquisition; requires external USB transceiverSelect when USB host capability and ultra-low-power sensor streaming are not required
STM32F413RGY6Same core/peripherals but in WLCSP64 (3.6 × 3.7 mm); adds AES-256 and SHA-256 crypto acceleratorsTargeted at space-constrained secure IoT nodes; lacks LQFP64 mechanical compatibilitySelect when board space is critical and cryptographic services are mandatory for cloud onboarding

Compared with STM32F405RGT6, the STM32F412RGT6 adds BAM and DFSDM for autonomous sensor processing, while versus STM32F413RGY6 it trades crypto acceleration for LQFP64 manufacturability and lower assembly cost-making it optimal for cost-sensitive industrial HMI and motor control designs.

Availability

STM32F412RGT6 is available at Aetrix Electronics and suitable for industrial PLCs, motor drive systems, wearable sensor hubs, and smart home gateways requiring stable component supply across long-life production cycles.

Supply support for STM32F412RGT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive-grade components since 1987.

The STM32F412 series belongs to ST's high-performance Cortex-M4 portfolio, engineered specifically for real-time industrial control, audio processing, and low-power connected devices where Flash execution speed, peripheral integration, and power efficiency are jointly critical.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32F412RGT6 achieves 100 MHz maximum CPU frequency using its Adaptive Real-Time Accelerator (ART Accelerator™), which implements prefetch and branch cache to eliminate Flash wait states. This allows deterministic real-time execution without external RAM or cache coherency management, validated across temperature and voltage ranges per DS11139 Rev 9 Section 6.3.10.

Does the part include an integrated USB physical layer?

Yes, the STM32F412RGT6 integrates a full-speed USB 2.0 OTG PHY with internal transceivers, supporting device, host, and OTG roles without external components. The USB_DP and USB_DM pins connect directly to the USB connector, with only a 1.5 kΩ pull-up resistor on DP required for device enumeration-confirmed in Section 3.32 and Table 6.3.19 of the datasheet.

How many I/O pins support 5 V tolerance, and which ones?

All 64 pins of the LQFP64 package are 5 V-tolerant on input when VDD is ≥ 2.0 V, including all GPIOs (PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15), NRST, BOOT0, and analog inputs. This is explicitly specified in Section 6.3.16 and Table 16 of DS11139 Rev 9, enabling safe interfacing with legacy 5 V logic and sensors.

What low-power modes are supported and what are their typical currents?

The STM32F412RGT6 supports Run, Sleep, Stop (two variants), and Standby modes. At 25 °C and 3.3 V: Run mode draws 112 µA/MHz (peripheral off); Stop with fast wakeup consumes 50 µA typical; Stop with deep power-down draws 18 µA; Standby is 2.4 µA without RTC. All values are measured per Section 6.3.7 and Table 31–34 of the official datasheet.

STM32F412RGT6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
64-LQFP
Series:
STM32F4
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F412RGT6 FAQ

1.How can I place an order for STM32F412RGT6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F412RGT6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F412RGT6 reliable?

The price and inventory of STM32F412RGT6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F412RGT6 is usually 5 days.

3.What payment methods are accepted for STM32F412RGT6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F412RGT6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F412RGT6?

STM32F412RGT6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F412RGT6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F412RGT6?

For technical support, including STM32F412RGT6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F412RGT6 requirements.

6.How does Aetrix verify that STM32F412RGT6 is sourced from the original manufacturer or authorized distributors?

All STM32F412RGT6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F412RGT6 meets industry standards.

7.What is the process for return or replacement of STM32F412RGT6?

All STM32F412RGT6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F412RGT6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F412RGT6 part is unused and in its original packaging.

Return procedure for STM32F412RGT6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32F412RGT6 Tags

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